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http://dx.doi.org/10.5762/KAIS.2014.15.8.5269

Solder Region Detection and Height Calculation by the Characteristics and Phase Difference of the 3D Profiles in Moire Images  

Song, Jun Ho (INTEKPLUS Co., Ltd.)
Rhee, Eun Joo (Department of Computer Engineering, Hanbat National University)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.15, no.8, 2014 , pp. 5269-5279 More about this Journal
Abstract
The cause of defects in the PCB SMT assembly is mostly solder paste deposits. Conventional inspection methods for solder paste deposits suffer from slow speed, low reliability and high cost. Therefore, this paper proposes a method for calculating the height and region of solder paste on PCB using the 3D profiles without measuring the 2D image. The solder paste region is detected by the phase difference in the measurement points and the average phase on the whole surface of PCB. The high reliable height of the solder paste region is computed by the average of the measurement points' phase with repeatability and reliability. The experimental results revealed improvements of 17% in inspection time and 29% repeatability in the height calculation of the solder paste region, resulting in a high speed and less expensive system.
Keywords
3D profiles; Moire images; SMT(Surface Mount Technology); Solder region and height; SPI(Solder Paste Inspection);
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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