• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 D
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• pp.2453-2455
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• 2003

We propose a path planning method to reduce the inspection time of AOI (automatic optical inspection) machines in SMT (surface mount technology) in-line system. Inspection windows of board should be clustered to consider the FOV (field-of-view) of camera. The number of clusters is desirable to be minimized in order to reduce the overall inspection time. We newly propose a genetic algorithm to minimize the number of clusters for a given board. Comparative simulation results are presented to verify the usefulness of proposed algorithm.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.35-40
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• 2000

MCM technology languished troughout most of the 1990's due to high costs resulting from low yields and issues with known god die. During the last five years of the decade new developments in chip scale packages and high density, build up multi-layer printed wiring boards created new opportunities to design and produce ultra miniaturized modules using conventional surface mount manufacturing capabilities. Focus on the miniaturization of substrate based packages such as ball grid arrays (BGAs) resulted in chip scale packages (CSPs) offering many of the benefits of flip chip along with the handling, testing, manufacturing and reliability capabilities of packaged deviced. New developments in the PWB industry sought to reduce the size, weight, thickness and cost of high density interconnect (HDI) substrates. Shrinking geometries of vias and new constructions significantly increased the interconnect density available for MCM-L applications. This paper describes the most promising CSP and HDI technologies for portable products, high performance computing and dense multi-chip modules.

• 한국결정성장학회지
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• 제28권3호
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• pp.130-134
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• 2018

솔더(solder) 재료는 수 천년 이상 인류 문명과 함께해온 대표적인 금속 합금으로서 현재까지도 전자 패키징(electronic packaging) 및 표면 실장(SMT, surface mount technology) 분야의 핵심 소재로 사용되고 있다 그러나 최근 Ag 가격의 급격한 상승과 전자산업의 저가격화 전략으로 인해 솔더 재료에서의 Ag 함량의 감소가 지속적으로 요구되고 있다. 본 연구에서는 Sn-3.0Ag-0.5Cu, Sn-0.7Cu 및 Sn-0.3Ag-0.5Cu(weight%) 조성의 무연납 솔더바 샘플을 주조법으로 합금화 하였다. 제조한 Sn-3.0Ag-0.5Cu, Sn-0.7Cu 및 Sn-0.3Ag-0.5Cu 샘플에 대한 결정구조, 화학조성 및 미세구조를 XRD, XRF, 광학현미경, FE-SEM 및 EDS 분석을 이용하여 조사하였다. 분석결과, 제조된 샘플은 ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$ 및 ${\eta}-Cu_6Sn_5$ 결정으로 구성되어 있었을 확인할 수 있었다.

• 반도체디스플레이기술학회지
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• 제15권3호
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• pp.18-23
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• 2016

QFN (Quad Flat No-leads Package) is one of the SMD (Surface Mount Device). Since there is no lead in QFN, there are many defects on solder. Therefore, we propose an efficient mechanism for QFN solder defect detection at this paper. For this, we employ Convolutional Neural Network (CNN) of the Machine Learning algorithm. QFN solder's color multi-layer images are used to train CNN. Since these images are 3-channel color images, they have a problem with applying to CNN. To solve this problem, we used each 1-channel grayscale image (Red, Green, Blue) that was separated from 3-channel color images. We were able to detect QFN solder defects by using this CNN. In this paper, it is shown that the CNN is superior to the conventional multi-layer neural networks in detecting QFN solder defects. Later, further research is needed to detect other QFN.

• 한국기계가공학회지
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• 제15권3호
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• pp.8-14
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• 2016

Medical bed head consoles (BHC) are generally used to increase the efficiency of medical equipment and speed the medical treatment response time. The BHC design has been consistently improved including a movable shelf unit that is embedded to mount stably medical instruments on the lower part of the main console. The cost of a BHC can be reduced through design optimization to limit the overall weight. However, as the size of a head console might decrease due to design optimization, the BHC deflection could be increased. In this study, multi-objective optimal design was adopted to consider this BHC design problem. In order to reduce the cost of optimization planning, an approximate model was applied for the design optimization. In the context of approximate optimization, we used the response surface method and non-dominant sorting genetic algorithm developed from various fields. Multi-objective optimal solutions were also compared with a single objective optimal design.

• 한국주조공학회지
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• 제34권1호
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• pp.14-21
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• 2014

Magnesium and its alloys are being applied to various kinds of industrial fields, especially their use on automotive parts and electronic part. These parts are manufactured mainly through diecasting process and magnesium ingots are used as raw materials. In the case that ingot quality is not secured, massive casting defects can occur and some manufactures can be damaged by the defects. This study is to evaluate ingots' cleanliness of magnesium alloys. It includes composition analysis by spectrometer, measurement of inclusion contents by SEM, brightness test on fractured surface and etc. Especially, the brightness test is a very easy and quick evaluation method. The brightness becomes low when the amount of oxides or inclusions on the surface increases. The brightness test data have been compared with those obtained from other methods for measuring the mount of impurities, which showed good relationship between the brightness and the others. Thus, the brightness test could be a promising method to measure the cleanliness of magnesium alloys.

• 마이크로전자및패키징학회지
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• 제11권1호
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• pp.43-47
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• 2004

We have been using Moisture Barrier Bags for dry packing of semiconductor packages to prevent moisture from absorbing during shipping. Moisture barrier bag material is required to be waterproof, vapor proof and offer superior ESD (Electro-static discharge) and EMI shielding. Also, the bag should be formed easily to the shape of products for vacuum packing while providing excellent puncture resistance and offer very low gas ＆ moisture permeation. There are some problems like pinholes and punctured bags after sealing and before the surface mount process. This failure may easily result in package pop corn crack during board mounting. The bags should be developed to meet the requirements of excellent electrical and physical properties by means of optimization of their raw material composition and their thickness. This study investigates the performance of moisture barrier bags by characterization of their mechanical endurance, tensile strength and through thermal analysis. By this study, we arrived at a robust material composition (polyester/Aluminate) for better packing.

• 마이크로전자및패키징학회지
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• 제31권2호
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• pp.69-77
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• 2024

최근 전자기기의 소형화, 다기능화 등으로 인한 전자부품 실장 영역의 한계치를 극복하고 플라스틱 사출물에 직접 회로를 인쇄하고 소자 및 부품을 실장하는 molded interconnect device (MID) 형태의 패키징 기법이 도입되고 있다. 다만 열 안정성이 낮은 플라스틱 사출물을 사용하는 경우, 종래의 리플로우 공정을 통한 부품 실장에 어려움이 있다. 본 연구에서는 특정 부위 혹은 소재만을 가열할 수 있는 유도가열 현상을 이용하여 플라스틱에 어떠한 열 데미지 없이 솔더를 용융시켜 실장하는 공정을 개발하였다. 가열하고자 하는 부위에 자속을 집중시킬 수 있는 유도가열용 Cu 코일 형상을 설계하고, 유한요소해석을 통해 패드부 자속 집중 및 가열 정도를 검증하였다. Polycarbonate 기판 위에 실장공정 검증을 위한 LED, capacitor, resistor, connector를 각각 유도가열을 통해 실장하고 작동여부를 확인하였다. 본 연구를 통해 리플로우 공법의 한계를 극복가능한 자기유도를 통한 선택적 가열 공정의 적용 가능성을 제시하였다.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.43-48
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• 2016

3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

• 한국생산제조학회지
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• 제23권1호
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• pp.64-68
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• 2014

This paper introduces the use of a crown-shaped (CR) lens to effectively diffuse the light from a light-emitting diode (LED) without any loss in the light intensity, in contrast to polymer-bulb-type diffusers. The diffusion lens was designed based on the Snell's law, which describes the physical path of a ray passing through the boundary between different media. CR lenses were fabricated by polydimethylsiloxane (PDMS) casting and UV-embossing processes, which used a pre-designed metal mold and UV-curable resin, respectively. Through experiments and optical evaluations, it was verified that the newly proposed CR lens not only decreased the vertical light strength and glare effect from an LED light source but also improved the diffusion characteristics while maintaining the quality of the LED's light intensity.