• Journal of Institute of Control, Robotics and Systems
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• v.21 no.10
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• pp.982-987
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• 2015

The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2011.10a
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• pp.440-445
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• 2011

Dynamic characteristic analysis is required in developing SMT mounter system with high installation speed and position precision, because of vibration source occurred by positioning head. This paper presents the method of improving dynamic characteristic of SMT(Surface Mount Technology) mounter with finite element method and modal test. The design direction is that natural frequencies of SMT mounter must be higher than the vibration source. In addition, the effect of input shaping on residual vibration reduction is investigated by simulating the response of a first-order system.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.31-35
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• 2022

Recently, with the 4th industrial revolution, the demand for high-density semiconductors for large-capacity data processing is increasing. Researchers are interested in researching the reliability of surface mount technology (SMT). In this study, the effect of PCB pad design on assembly and adhesion reliability of passive component was analyzed using design of experiment (DOE). The DOE method was established using the pad length, width, and distance between pads of the PCB as variables. The assembly defect rate of the passive element after the reflow process was derived according to the misplacement direction of the chip resistor. The shear force between the passive element and the PCB was measured using shear tests. In addition, the shape of the solder according to the pad design was analyzed through cross-sectional analysis.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.43 no.4
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• pp.67-75
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• 2020

This paper proposes a methodology for gantry route optimization in order to maximize the productivity of a odd-type surface mount device (SMD). A odd-type SMD is a machine that uses a gantry to mount electronic components on the placement point of a printed circuit board (PCB). The gantry needs a nozzle to move its electronic components. There is a suitability between the nozzle and the electronic component, and the mounting speed varies depending on the suitability. When it is difficult for the nozzle to adsorb electronic components, nozzle exchange is performed, and nozzle exchange takes a certain amount of time. The gantry route optimization problem is divided into the mounting order on PCB and the allocation of nozzles and electronic components to the gantry. Nozzle and electronic component allocation minimized the time incurred by nozzle exchange and nozzle-to-electronic component compatibility by using an mixed integer programming method. Sequence of mounting points on PCB minimizes travel time by using the branch-and-price method. Experimental data was made by randomly picking the location of the mounting point on a PCB of 800mm in width and 800mm in length. The number of mounting points is divided into 25, 50, 75, and 100, and experiments are conducted according to the number of types of electronic components, number of nozzle types, and suitability between nozzles and electronic components, respectively. Because the experimental data are random, the calculation time is not constant, but it is confirmed that the gantry route is found within a reasonable time.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.1-5
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• 2011

In this paper, we introduce knowledge sharing platform for production technology. Surface mount technology (SMT) is one of the important production technologies to fabricate electronic devices. The production technology of the SMT, however, has been propagated from an experienced worker to an inexperienced worker in a manufacturing field. The objective of the knowledge sharing platform is to convert the production experiences like a solder printing knowhow into quantitative values, to construct the database of the process technologies, and to share the technologies systematically via web portal service. In addition, the knowledge sharing platform contains the total production process of mobile products, the information of experts and facilities, and recent R&D output. In this manner, the knowledge sharing platform for production technology could strengthen the technological competitiveness of small and medium manufacturing companies in Korea.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.2
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• pp.1398-1402
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• 2015

In surface mount technology, the use of technology implemented using a Chip Mounter relay that is inserted into the junction box, etc. car is increasing. On the other hand, there is a need for technology to reduce the weight of the heavy component of the relay attached to different Stick Tube generally chips. Therefore, rather than existing technology, this study improved the algorithm of the system to provide a mechanical structure using Air to supply greater stability using this the component feeder utilizing the Stick Tube proposed technology. When the equipment installed in the Air Stick Feeder was used, the effectiveness, such as increased production and reduced disposal expense, was improved.

• Journal of Korean Institute of Industrial Engineers
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• v.20 no.3
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• pp.79-92
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• 1994

Surface mount technology has been evolving in the electronics industries. Efficient operation of surface mounters is closely related with the productivity of the electronic products. In this study, modeling and optimal algorithm for allocating feeders and sequencing mounting jobs in the rotary type surface mounter, which consider all the constraints, in the hardware and are easy to be used in the field, are developed.

• Journal of Institute of Control, Robotics and Systems
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• v.8 no.7
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• pp.573-577
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• 2002

A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens, LED illumination systems, and a frame grabber inside the PC. This system loads up to six feeders at a time and inspects them automatically and sequentially. The inspection software was implemented using Visual C++on Windows NT with easily usable GUI. Using this system, we can automatically measure and inspect the quality of all feeders in production process by analyzing the measurement results statistically.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.494-495
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• 2007

As a pocket size electronic device have developed and electronic parts is increased, it need dual face soldering using SMT(Surface Mount Technology) and it can be getting high density soldering. Inductor is one of their electronic parts using SMT and inductor was developed to make electromagnetic energy. In this study, it is analyzed temperature properties of surface mount type Inductor due to current injection which is satisfied the demand of utmost small size and the substance of high density simultaneously.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1035-1040
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• 2010

The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.