• 제어로봇시스템학회논문지
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• 제21권10호
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• pp.982-987
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• 2015

The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2011년도 추계학술대회 논문집
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• pp.440-445
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• 2011

Dynamic characteristic analysis is required in developing SMT mounter system with high installation speed and position precision, because of vibration source occurred by positioning head. This paper presents the method of improving dynamic characteristic of SMT(Surface Mount Technology) mounter with finite element method and modal test. The design direction is that natural frequencies of SMT mounter must be higher than the vibration source. In addition, the effect of input shaping on residual vibration reduction is investigated by simulating the response of a first-order system.

• 마이크로전자및패키징학회지
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• 제29권3호
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• pp.31-35
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• 2022

최근 4차산업혁명으로 대용량 데이터 처리를 위한 고집적 반도체에 대한 수요가 증가하고 있다. 반도체 제품에 장착되는 소자들의 크기가 작아 짐에 따라 표면실장기술(SMT)의 신뢰성에 대한 연구가 관심을 받고 있다. 본 연구에서는 PCB의 패드 디자인이 수동소자의 조립 및 접합 신뢰성에 미치는 영향을 실험 계획법(design of experiment, DOE) 이용하여 분석하였다. 수동소자를 실장하기 위한 PCB의 패드 길이, 너비 및 두 패드간 거리를 변수로 하여 실험계획법을 수립하였다. 저항칩의 오배치(misplacement) 방향에 따른 수동소자의 톰스톤(tombstone)불량률을 도출하였다. 전단테스트를 통해 수동소자와 PCB 사이의 전단력을 측정하였다. 또한, 단면분석을 통해 패드 디자인에 따른 솔더의 형상을 분석하였다.

• 산업경영시스템학회지
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• 제43권4호
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• pp.67-75
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• 2020

This paper proposes a methodology for gantry route optimization in order to maximize the productivity of a odd-type surface mount device (SMD). A odd-type SMD is a machine that uses a gantry to mount electronic components on the placement point of a printed circuit board (PCB). The gantry needs a nozzle to move its electronic components. There is a suitability between the nozzle and the electronic component, and the mounting speed varies depending on the suitability. When it is difficult for the nozzle to adsorb electronic components, nozzle exchange is performed, and nozzle exchange takes a certain amount of time. The gantry route optimization problem is divided into the mounting order on PCB and the allocation of nozzles and electronic components to the gantry. Nozzle and electronic component allocation minimized the time incurred by nozzle exchange and nozzle-to-electronic component compatibility by using an mixed integer programming method. Sequence of mounting points on PCB minimizes travel time by using the branch-and-price method. Experimental data was made by randomly picking the location of the mounting point on a PCB of 800mm in width and 800mm in length. The number of mounting points is divided into 25, 50, 75, and 100, and experiments are conducted according to the number of types of electronic components, number of nozzle types, and suitability between nozzles and electronic components, respectively. Because the experimental data are random, the calculation time is not constant, but it is confirmed that the gantry route is found within a reasonable time.

• 마이크로전자및패키징학회지
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• 제18권1호
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• pp.1-5
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• 2011

In this paper, we introduce knowledge sharing platform for production technology. Surface mount technology (SMT) is one of the important production technologies to fabricate electronic devices. The production technology of the SMT, however, has been propagated from an experienced worker to an inexperienced worker in a manufacturing field. The objective of the knowledge sharing platform is to convert the production experiences like a solder printing knowhow into quantitative values, to construct the database of the process technologies, and to share the technologies systematically via web portal service. In addition, the knowledge sharing platform contains the total production process of mobile products, the information of experts and facilities, and recent R&D output. In this manner, the knowledge sharing platform for production technology could strengthen the technological competitiveness of small and medium manufacturing companies in Korea.

• 한국산학기술학회논문지
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• 제16권2호
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• pp.1398-1402
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• 2015

표면실장기술에 있어서, 자동차 정션박스 등에 삽입되는 릴레이를 칩 마운터를 이용하여 실장 하는 기술이 대두되고 있다. 그러나 릴레이가 일반 칩과 다르게 스틱 튜브로 공급되고 부품의 무게가 무거워 공급하는 기술이 필요하다. 따라서 본 연구는 스틱 튜브를 이용한 부품 공급 장치를 기존 기술보다 보다 안정적으로 공급을 할 수 있는 에어를 이용한 기계적 구조를 마련하고, 이를 활용한 시스템 알고리즘을 개선하는 기술을 제시한다. 또 개선된 에어 스틱 피더를 설비에 장착하여 사용했을 때 생산량의 증가와 폐기 비용 감소 효과를 확인할 수 있다.

• 대한산업공학회지
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• 제20권3호
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• pp.79-92
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• 1994

Surface mount technology has been evolving in the electronics industries. Efficient operation of surface mounters is closely related with the productivity of the electronic products. In this study, modeling and optimal algorithm for allocating feeders and sequencing mounting jobs in the rotary type surface mounter, which consider all the constraints, in the hardware and are easy to be used in the field, are developed.

• 제어로봇시스템학회논문지
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• 제8권7호
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• pp.573-577
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• 2002

A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens, LED illumination systems, and a frame grabber inside the PC. This system loads up to six feeders at a time and inspects them automatically and sequentially. The inspection software was implemented using Visual C++on Windows NT with easily usable GUI. Using this system, we can automatically measure and inspect the quality of all feeders in production process by analyzing the measurement results statistically.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.494-495
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• 2007

As a pocket size electronic device have developed and electronic parts is increased, it need dual face soldering using SMT(Surface Mount Technology) and it can be getting high density soldering. Inductor is one of their electronic parts using SMT and inductor was developed to make electromagnetic energy. In this study, it is analyzed temperature properties of surface mount type Inductor due to current injection which is satisfied the demand of utmost small size and the substance of high density simultaneously.

• 대한금속재료학회지
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• 제48권11호
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• pp.1035-1040
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• 2010

The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.