• 센서학회지
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• 제9권3호
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• pp.224-232
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• 2000

표면 미세가공 공정에서 Al 공정을 이용하면 Al 전극의 제작에 의해 접촉 저항이나 선 저항 등을 줄여 전기적인 신호 손실을 줄일 수 있고, 산화막을 희생층으로 사용하는 간단한 공정에 의해 Al 구조물 제작이 가능한 장점을 지닌다. 그러나 실제 공정에서는 Al 전극이나 Al 구조물이 희생층 제거 시에 사용되는 HF 용액에 의해서 부식되는 문제점이 있다. 이러한 문제점을 해결하기 위해 사용되는 희생층 식각액인 BHF/glycerine 혼합 용액에 대한 PSG와 Al의 기본적인 식각 특성은 표면 미세가공에서 발생하는 구조적인 제한 조건에 따라 상당히 달라진다. 본 논문에서는 이러한 희생층의 구조적 특성과 Al 박막의 증착 표면 거칠기의 변화로 인한 식각 특성의 변화를 고려하여 실제로 표면 미세가공에 적용 가능한 혼합 용액의 조건을 조사하였다. 희생층 식각 조건변화에 따른 BHF/glycerine 혼합용액의 최적 혼합비는 $NH_4F$:HF:glycerine=2:1:2에서 가장 좋은 식각 선택비를 보이는 것으로 나타났으며 이 실험 결과를 실제 Al 전극 제작에 적용한 결과 Al 패턴이 희생층 식각액에 대해서 우수한 내식성을 보였다. 또한 Al의 식각액에 대한 내식성을 향상시키기 위하여 CMP 공정을 도입하여 증착 표면을 개선시켰으며 이를 Al 구조물의 제작에 적용하여 식각 특성을 분석하였다. 이러한 분석을 통해 본 논문에서 제시한 식각 조건을 이용하면 Al 전극과 Al 구조물을 표준적인 표면 미세가공 공정을 통하여 간단하게 제작할 수 있다.

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2006년도 춘계학술발표대회 논문집
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• pp.60-65
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• 2006

Previous studies demonstrated that laser ablation under transparent liquid can result in ablation enhacement and particle removal from the surface. In this work, the liquid-assisted excimer laser ablation process is examined fer polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), Si, and alumina with emphasis on ablation enhacement, surface topography, and debris formation. In the case of PET and PMMA, the effect of liquid is analyzed both fer thin water film and bulk water. As the ablation enhanement by liquid is already known for Si and alumina, the analysis focuses on surface topography and debris formation resulting from the liquid-assisted laser ablation process. The results show that application of liquid increases the ablation rate of PMMA while that of PET remains unchanged even in the liquid-assisted process. It is also revealed that the liquid can significantly improve the surface quality by reducing the debris deposition. However, the surface roughness is generally deteriorated in the liquid-assisted process. The surface toporaphy is found to be strongly dependent on the method of liquid application, i.e., thin film or bulk liquid.

• 한국레이저가공학회지
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• 제10권1호
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• pp.19-27
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• 2007

Previous studies demonstrated that laser ablation under transparent liquid can result in ablation enhancement and particle removal from the surface. Although the ablation enhancement by liquid is already known for semiconductor and metal, the phenomena of polymer ablation have not been studied. In this work, tile liquid-assisted excimer laser ablation process is examined for polymer materials, such as polyethylene terephthalate (PET), polymethyl methacrylate (PMMA) with emphasis on ablation enhancement and surface topography. In the case of PET and PMMA, the effect of liquid is analyzed both for thin water film and bulk water. The results show that application of liquid increases the ablation rate of PMMA while that of PET remains unchanged even in the liquid-assisted process. However, the surface roughness is generally deteriorated in the liquid-assisted process. The surface topography is found to be strongly dependent on the method of liquid application, i.e., thin film or bulk liquid.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 G
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• pp.2518-2520
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• 1998

Silicon can be reactive ion etched (RIE) either isotropically or anisotropically. In this paper, a new micromachining technology combining these two etching characteristics is proposed. In the proposed method, the fabrication steps are as follows. First. a polysilicon layer, which is used as the bottom electrode, is deposited on the silicon wafer and patterned. Then the silicon substrate is etched anisotropically to a few micrometer depth that forms a cavity. Then an PECVD oxide layer is deposited to passivate the cavity side walls. The oxide layers at the top and bottom faces are removed while the passivation layers of the side walls are left. Then the substrate is etched again but in an isotropic etch condition to form a round trench with a larger radius than the anisotropic cavity. Then a sacrificial PECVD oxide layer is deposited and patterned. Then a polysilicon structural layer is deposited and patterned. This polysilicon layer forms a pivot structure of a rocker-arm. Finally, oxide sacrificial layers are etched away. This new micromachining technology is quite simpler than conventional method to fabricate joint structures, and the devices that are fabricated using this technology do not require a flexing structure for motion.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.640-643
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• 2003

We present investigations of the surface micromachining for transparent glass substrate, e.g. soda lime glass using tightly focused 800nm Ti:sapphire femtosecond laser. In this study, experiment conditions such as laser intensity, scanning speed, focus position were controlled as variable parameters to decide optimal machining conditions. This study shows clearly that laser intensity and scanning speed are dominant factors for good surface morphology. Using the optimal conditions, grooves with 50${\mu}{\textrm}{m}$ line width were fabricated on glass substrate and their surface morphologies were investigated from SEM image.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 추계종합학술대회 논문집
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• pp.905-908
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• 1999

In this paper, we present a polysilicon actuator on silicon wafer using surface micromachining technology which employs an electrostatic stepwise driven Scratch Drive Actuator to generate a force that can move an external object. For optical applications, we propose wavelength selector using distributed feedback structures and this micro actuator.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 G
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• pp.3298-3300
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• 1999

In this paper, a $10{\times}10$ micro SLM array for phase and amplitude modulation of incident light is designed and fabricated using surface micromachining technology. Hidden spring structure is used in order to maximize the fill-factor and minimize diffraction effect at the support posts. Static and dynamic characteristics of designed micro SLM are simulated with ABAQUS and measured with optical measurement system using He-Ne laser and PSD(position sensitive devise).

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 추계학술대회 논문집 학회본부
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• pp.416-418
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• 1996

A $50{\times}50{\mu}m^2$ aluminum micromirror array is fabricated using surface micromachining technology. $50{\times}50$ micromirrors are arrayed two dimensionally. The micromirror plate is supported by a vertical spring structure that is placed underneath the mirror plate. When the mirror plates reflect a light, the micromirror array un have large effective reflecting area. Fabrication of vertical spring uses only one mask and shadow evaporation process.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2005년도 추계종합학술대회
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• pp.925-928
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• 2005

In this study, we fabricated the DAMLs using surface micromachining technology as well a low loss coupler for the millimeter-wave band applications using these DAMLs. The structure of DAML is that a signal line is supported on ground plane by dielectric posts. Therefore it has advantages about the loss characteristic and the stable structure. The other advantage of the DAML process is a simple and convenient technique using 4 mask steps, even if it has a micromachining technology. The lowest loss of the fabricated DAML was obtained 2.2 dB/cm at 110 GHz. To obtain the low loss characteristic, couplers were designed and fabricated by using DAMLs. The fabricated ring hybrid coupler has the coupling of 3.58 dB and the thru of 3.31 dB at 60 GHz. We can also obtain the coupling of 3.42 dB, the thru of 3.82 dB from fabricated branch line coupler at 60 GHz.

• 대한기계학회논문집A
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• 제30권11호
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• pp.1369-1375
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• 2006

In this work, mechanical characteristics of stainless steel diaphragm have been studied as a potential robust substrate and a diaphragm material for micromachined devices. Lamination process techniques combined with traditional micromachining processes have been adopted as suitable fabrication technologies. To illustrate these principles, capacitive pressure sensors based on a stainless steel diaphragm have been designed, fabricated and characterized. The fabrication process for stainless steel micromachined devices keeps the membrane and substrate being at the environment of 8.65MPa pressure and $175^{\circ}C$ for a half hour and then subsequently cooled to $25^{\circ}C$. Each sensor uses a stainless steel substrate, a laminated stainless steel film as a suspended movable plate and a fixed, surface micromachined back electrode of electroplated nickel. The finite element method is adopted to investigate residual stresses formed in the process. Besides, out-of-plane deflections are calculated under pressures on the diaphragm. The sensitivity of the device fabricated using these technologies is 9.03 ppm $kPa^{-1}$ with a net capacitance change of 0.14 pF over a range 0$\sim$180 kPa.