• Explosives and Blasting
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• v.22 no.3
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• pp.57-64
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• 2004

There are two major types of underwater blasting at Korea, bridges and harbor construction work. Pier blasting for lay the foundation bridges construction is used dry excavation working (drilling and charging) after pump out water and then fire pump in water that is same as bench blasting. In contrast, underwater blasting for harbor construction and increase of harbor load depth is used to barge with digging equipment that is in oder to drilling on the surface and blasting work(charge, hook-up) under water. Thus, there are need to special concern such as charge method and hook-up method different from tunnel blasting work and bench blasting work. If do not use special concern breaks out dead pressure and mis fire because of there are so many difficult condition such as water pressure, obstruct field of vision. In this study underwater blasting at Busan Harbor Construction have consider with special concern that is plastic pipe charge method used to MegaMITE I and specialized buoy hook- up method make far initial system detonate on the surface used to TLD. The results is designed blast pattern charge per delay effect an inspection of verify between predict velocity and measure velocity. minimized break out mis fire consideration charge method, hook up method. According to result best underwater blasting design is 105mm drilling dia, MeGAMITE II, HiNLL Plus(non electric detonator).

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.81.2-81.2
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• 2012

To fabricate a metal mold for injection molding, hot-embossing and imprinting process, mechanical machining, electro discharge machining (EDM), electrochemical machining (ECM), laser process and wet etching ($FeCl_3$ process) have been widely used. However it is hard to get precise structure with these processes. Electrochemical etching has been also employed to fabricate a micro structure in metal mold. A through mask electrochemical micro machining (TMEMM) is one of the electrochemical etching processes which can obtain finely precise structure. In this process, many parameters such as current density, process time, temperature of electrolyte and distance between electrodes should be controlled. Therefore, it is difficult to predict the result because it has low reliability and reproducibility. To improve it, we investigated this process numerically and experimentally. To search the relation between processing parameters and the results, we used finite element simulation and the commercial finite element method (FEM) software ANSYS was used to analyze the electric field. In this study, it was supposed that the anodic dissolution process is predicted depending on the current density which is one of major parameters with finite element method. In experiment, we used stainless steel (SS304) substrate with various sized square and circular array patterns as an anode and copper (Cu) plate as a cathode. A mixture of $H_2SO_4$, $H_3PO_4$ and DIW was used as an electrolyte. After electrochemical etching process, we compared the results of experiment and simulation. As a result, we got the current distribution in the electrolyte and line profile of current density of the patterns from simulation. And etching profile and surface morphologies were characterized by 3D-profiler(${\mu}$-surf, Nanofocus, Germany) and FE-SEM(S-4800, Hitachi, Japan) measurement. From comparison of these data, it was confirmed that current distribution and line profile of the patterns from simulation are similar to surface morphology and etching profile of the sample from the process, respectively. Then we concluded that current density is more concentrated at the edge of pattern and the depth of etched area is proportional to current density.

• Korean Journal of Environmental Agriculture
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• v.20 no.1
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• pp.15-19
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• 2001

This study was carried out to investigate the effect of application time and amount of rice bran on rice yield, weed occurrence, and chemical change in water as applied at the level of 1.8 Mg/ha (1.8RB) and 3.5 Mg/ha (3.5RB) through field and pot experiment. $Nitrate(NO_3\;^-)$ in the surface water and the percolated water through pot were high in application of 3.5RB, and similar in application of 1.8RB as compared to chemical fertilization. Electric conductivity in surface water were higher by application of rice bran until 25 days after rice bran application. $NH_4-N$ in soil were lower in application of rice bran, and $NO_3-N$ in soil were higher in 3.5RB at tillering stage and panicle formation stage of rice. Rice bran application(3.5RB) showed 68% of weed occurrence as compared to that of chemical fertilization. Rice yield were increased by heavy application of rice bran; 4.41 Mg/ha in 1.8RB and 4.87 Mg/ha in 3.5RB, and top dressing of nitrogen at panicle formation stage caused to increased rice yield by $14{\sim}15%$. Rice yield was also increased by early application of rice bran.

• The Journal of Engineering Geology
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• v.31 no.2
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• pp.187-197
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• 2021

Clay mineral content of weathered zone is a key parameter for landslide studies. Electrical resistivity tomography is usually performed to delineate the geometry of complex landslides and to identify the sliding surface. In clay-bearing weathered zone, parallel resistivity Archie equation is employed to investigate the effect of conductivity added (resistivity reduced) by clay minerals of kaolinite and montmorillonite, which is dependent on their specific surface area and cation exchange capacities (CEC). A decrease of overall resistivity and apparent formation factor is observed with increasing pore-water resistivity, significantly in montmorillonite. Formation factor is found decreased with increasing porosity and decreasing cementation factor. Parallel Archie equation was applied to the electrical resistivity data from the test area (Sinjindo-ri, Taean-gun, Chungcheongnam-do, Korea) which experienced land creeping in the year of 2014. A panel test with varying clay-mineral contents provides the best fit section when the theoretical section constructed with the assumed contents approaches the field section, from which the clay-mineral content of the weathered zone is estimated to be approximately 10%. Resistivity interpretation schemes including the clay mineral contents for land creeping studies explored in this paper can be challenged more when porosity, saturation, and pore-water resistivity are provided and they are included in the numerical resistivity modeling.

• Journal of the Korean Institute of Landscape Architecture
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• v.38 no.2
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• pp.1-8
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• 2010

The purpose of the study was to evaluate the influence of landscaping pavements on WBGT(Wet-Bulb Globe Temperature) of outdoor spaces that lack ventilation and shade at summer midday. The relative humidity(RH), dry-bulb temperature(DT) and globe temperature(GT) were recorded every minute from June to October 2009 at a height of 1.2m above ten experimental beds with different pavements, by a measuring system consisting of an electric humidity sensor(GHM-15), resistance temperature detector(RTD, Pt-100), standard black globe(${\phi} 150mm$) and data acquisition systems(National Instrument's Labview and Compact FieldPoint). Additionally, the surface dry-bulb temperatures also were recorded and compared. The area of each experimental bed was 1.5m(W)${\times}$2.0m(L) and ten different kinds of pavement were used including grass, grass+cubic stone, grass+porous brick, brick, stone panels, cubic stone, interlocking blocks, clay brick, naked soil, gravel and concrete. To prevent interference from ventilation, a 1.5m height cubic steel frame was established around each bed and each vertical side of the frame was covered with transparent polyethylene film. Based on the records of the hottest period from noon to 3 PM on 26 days with a peak dry-bulb temperature over $30^{\circ}C$ at natural condition, the wet-bulb temperature(WT) and WBGT were calculated and compared. The major findings were as follows: 1. The average surface DT was $40.1^{\circ}C$, which is $9^{\circ}C$ higher than that of the natural condition. The surface DT of the pavements with grass were higher than those of concrete and interlocking block. The peak DT of the surface almost every pavement rose to above $50^{\circ}C$ during the hottest time. 2. The averages of DT, WT and GT were $40.1^{\circ}C$, $27.5^{\circ}C$ and $49.1^{\circ}C$, and the peak values rose to $48.1^{\circ}C$, $45.8^{\circ}C$ and $59.5^{\circ}C$, respectively. In spite of slight differences that resulted according to pavements, no coherent differentiating factor could be found. 3. The average WBGT of grass was the highest at $34.3^{\circ}C$ while the others were similar in the range of around $33{\pm}1^{\circ}C$. Meanwhile, the peak WBGT was highest with stone panel at $47.9^{\circ}C$. Though there were some differences according to pavements, and while grass seemed to be worst in terms of WBGT, it seems difficult to say ablolutely that grass was the worst because the measurement was conducted without ventilation and shade during summer daytime hours only, which had temperatures that rose to a dangerous degree(above $45^{\circ}C$ WBGT), withering the grass during the hottest period. The average WBGT resulted also showed that the thermal environment of the pavement without ventilation and shade were at an intolerable level for humans regardless of the pavement type. In summary, the results of this study show that ventilation and shade are more important factor than pavement type in terms of outdoor thermal comfort in summer daylight hours.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.3
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• pp.113-116
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• 2010

We report on the growth and characteristics of the structural and optical properties of InGaN nano-structures doped with antimony (Sb) as a catalyst. The use of catalyst has been explored to modify the growth and defect generation during strained layer heteroepitaxial growth. We performed the growth of the InGaN nano-structures on c-sapphire substrates using mixed-source hydride vapor phase epitaxy (HVPE). The characteristic of samples was measured by scanning electron microscope (SEM) and photoluminescence (PL). The aligning direction of c-axis of the InGaN nano-structures was changed from vertical to parallel or inclined to the surface of substrates when the Sb was added as a catalyst. The indium composition was estimated about 3.2% in both cases of with or without the addition of Sb in the InxGal-xN structures. From the results of InGaN nano-structures formed with the addition of Sb, we can expect the performance of optical devices would be more improved by reduced piezo-electric field if we use the InGaN nano-structures of which c-axes are aligned parallel to the substrates as an active layer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.9
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• pp.535-540
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• 2017

The changes in the electrical characteristics of CMOS ICs due to coupling with a narrow-band electromagnetic wave were analyzed in this study. A magnetron (3 kW, 2.45 GHz) was used as the narrow-band electromagnetic source. The DUT was a CMOS logic IC and the gate output was in the ON state. The malfunction of the ICs was confirmed by monitoring the variation of the gate output voltage. It was observed that malfunction (self-reset) and destruction of the ICs occurred as the electric field increased. To confirm the variation of electrical characteristics of the ICs due to the narrow-band electromagnetic wave, the pin-to-pin resistances (Vcc-GND, Vcc-Input1, Input1-GND) and input capacitance of the ICs were measured. The pin-to-pin resistances and input capacitance of the ICs before exposure to the narrow-band electromagnetic waves were $8.57M{\Omega}$ (Vcc-GND), $14.14M{\Omega}$ (Vcc-Input1), $18.24M{\Omega}$ (Input1-GND), and 5 pF (input capacitance). The ICs exposed to narrow-band electromagnetic waves showed mostly similar values, but some error values were observed, such as $2.5{\Omega}$, $50M{\Omega}$, or 71 pF. This is attributed to the breakdown of the pn junction when latch-up in CMOS occurred. In order to confirm surface damage of the ICs, the epoxy molding compound was removed and then studied with an optical microscope. In general, there was severe deterioration in the PCB trace. It is considered that the current density of the trace increased due to the electromagnetic wave, resulting in the deterioration of the trace. The results of this study can be applied as basic data for the analysis of the effect of narrow-band high-power electromagnetic waves on ICs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.269-270
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• 2009

The biased vertical alignment (BVA) liquid crystal (LC) mode shows a has a distinct advantage of lower manufacture cost due to the elimination of a lithographic process step to form either ITO-patterning or protrusions on the color-filter substrates. However, those devices have complex voltage conditions which is the respective induce voltage on common electrode, pixel electrode and bias electrode when positive and negative frame. In order to overcome the complex voltage condition, the pretilt angles is controlled by photo polymerization of the UV-curable reactive mesogen (RM). According to our studies, voltages to the cell are critical to achieve an optimized surface-modified quality BVA (Q-BVA) mode which provides the well defined reorientation of the LCs with respect to an electric field.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.1-8
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• 2006

Higher density integration and adoption of new materials in advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, metal interconnects respond to applied voltages by electrochemical ionization and conductive filament formation, which leads to short-circuit failure of the electronic package. In this work, in-situ water drop test and evaluation of corrosion characteristics for SnPb solder alloys in D.I. water and NaCl solutions were carried out to understand the fundamental electrochemical migration characteristics and to correlate each other. It was revealed that electrochemical migration behavior of SnPb solder alloys was closely related to the corrosion characteristics, and Pb was primarily ionized in both D.I. water and $Cl^{-}$ solutions. The quality of passive film formed at film surface seems to be critical not only for corrosion resistance but also for ECM resistance of solder alloys.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.4
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• pp.7-14
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• 2000

A Bi$_{4}$Ti$_{3}$O$_{12}$ (BIT) thin film is prepared by sol-gel method using acetate precursors and evaluated whether it could be applied to NVFRAM (Non-Volatile Ferroelectric RAM). The drying and the annealing temperature are 40$0^{\circ}C$ and $650^{\circ}C$, respectively and they are determined from the DT-TG (Differential Thermal-Thermal Gravimetric) analysis. The BIT thin film deposited on Pt/Ta/SiO$_{2}$/Si substrate shows orthorhombic perovskite phase. The grain size and the surface roughness are about 100 nm and 70.2$\AA$, respectively. The dielectric constant and the loss tangent at 10 KHz are 176 and 0.038, respectively, and the leakage current density at 100 ㎸/cm is 4.71 $mutextrm{A}$/$\textrm{cm}^2$. In the results of hysteresis loops measured at $\pm$250 ㎸/cm, the remanent polarization (Pt) and the coercive field (Ec) are 5.92 $\mu$C/$\textrm{cm}^2$ and 86.3 ㎸/cm, respectively. After applying 10$^{9}$ square pulses of $\pm$5V, the remanent polarization of the BIT thin film decreases as much as about 33% from 5.92 $\mu$C/$\textrm{cm}^2$ of initial state to 3.95 $\mu$C/$\textrm{cm}^2$.