• 대한전자공학회논문지
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• 제25권11호
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• pp.1286-1293
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• 1988

자기정렬 DMOS 트랜지스터의 채널 길이에 관한 수식을 2차원적인 Caussian 농도분포식으로부터 유도하였다. 본 논문에서는 제시된 채널 길이에 관한 수식은 기판의 농도, 이중확산된 각 영역의 표면 농도와 수직 접합 깊이의 함수로 이루어져 있으며, 계산된 실험치와 잘 일치하고 있다. 또한 고전압용 DMOS 트랜지스터에서 채널 punchthrough를 억제할 수 있는 최소 채널 길이를 채널영역의 평균농도를 이용하여 계산하였으며 소자 simulation을 통하여 최적의 채널 조건(채널농도분포 및 채널 길이)를 예측할 수 있음을 확인하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.424.1-424.1
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• 2014

Vanadium dioxide (VO2) is a strongly correlated oxide exhibiting a first-order metal-insulator transition (MIT) that is accompanied by a structural phase transition from a low temperature monoclinic phase to a high-temperature rutile phase. VO2 has attracted significant attention because of a variety of possible applications based on its ultrafast MIT. Interestingly, the transition nature of VO2 is significantly affected by stress due to doping and/or interaction with a substrate and/or surface tension as well as defects. Accordingly, there have been considerable efforts to understand the influences of such factors on the phase transition and the fundamental mechanisms behind the MIT behavior. Here, we present the influences of oxygen deficiency, hydrogen doping, and substrate-induced stress on MIT phenomena in single-crystalline VO2 nanobeams. Specifically, the work function and the electrical resistance of the VO2 nanobeams change with the compositional variation due to the oxygen-deficiency-related defects. In addition, the VO2 nanobeams during exposure to hydrogen gas exhibit the reduction of transition temperature and the complex phase inhomogenieties arising from both substrate-induced stress and the formation of the hydrogen doping-induced metallic rutile phase.

• 한국재료학회지
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• 제18권5호
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• pp.272-276
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• 2008

In submicron MOSFET devices, maintaining the ratio between the channel length (L) and the channel depth (D) at 3 : 1 or larger is known to be critical in preventing deleterious short-channel effects. In this study, n-type SOI-MOSFETs with a channel length of $0.1\;{\mu}m$ and a Si film thickness (channel depth) of $0.033\;{\mu}m$ (L : D = 3 : 1) were virtually fabricated using a TSUPREM-4 process simulator. To form functioning transistors on the very thin Si film, a protective layer of $0.08\;{\mu}m$-thick surface oxide was deposited prior to the source/drain ion implantation so as to dampen the speed of the incoming As ions. The p-type boron doping concentration of the Si film, in which the device channel is formed, was used as the key variable in the process simulation. The finished devices were electrically tested with a Medici device simulator. The result showed that, for a given channel doping concentration of $1.9{\sim}2.5\;{\times}\;10^{18}\;cm^{-3}$, the threshold voltage was $0.5{\sim}0.7\;V$, and the subthreshold swing was $70{\sim}80\;mV/dec$. These value ranges are all fairly reasonable and should form a 'magic region' in which SOI-MOSFETs run optimally.

• 한국전기전자재료학회논문지
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• 제29권12호
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• pp.750-758
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• 2016

For the channel doping of shallow junction and retrograde well formation in CMOS, indium can be implanted in silicon. The retrograde doping profiles can serve the needs of channel engineering in deep MOS devices for punch-through suppression and threshold voltage control. Indium is heavier element than B, $BF_2$ and Ga ions. It also has low coefficient of diffusion at high temperatures. Indium ions can be cause the erode of wafer surface during the implantation process due to sputtering. For the ultra shallow junction, indium ions can be implanted for p-doping in silicon. UT-MARLOWE and SRIM as Monte carlo ion-implant models have been developed for indium implantation into single crystal and amorphous silicon, respectively. An analytical tool was used to carry out for the annealing process from the extracted simulation data. For the 1D (one-dimensional) and 2D (two-dimensional) diffused profiles, the analytical model is also developed a simulation program with $C^{{+}{+}}$ code. It is very useful to simulate the indium profiles in implanted and annealed silicon autonomously. The fundamental ion-solid interactions and sputtering effects of ion implantation are discussed and explained using SRIM and T-dyn programs. The exact control of indium doping profiles can be suggested as a future technology for the extreme shallow junction in the fabrication process of integrated circuits.

• Bulletin of the Korean Chemical Society
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• 제35권4호
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• pp.1067-1072
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• 2014

In this study, we report a new approach for $Mn_3O_4$-graphene nanocomposite by ex situ method. This nanocomposite shows two-dimensional aggregation of nanoparticle, and doping effect by decorated manganese oxide ($Mn_3O_4$), as well. The graphene film was made through micromechanical cleavage of graphite on the $SiO_2/Si$ wafer. Manganese oxide ($Mn_3O_4$) nanoparticle with uniform cubic shape and size (about $5.47{\pm}0.61$ nm sized) was synthesized through the thermal decomposition of manganese(II) acetate, in the presence of oleic acid and oleylamine. The nanocomposite was obtained by self-assembly of nanoparticles on graphene film, using hydrophobic interaction. After heat treatment, the decorated nanoparticles have island structure, with one-layer thickness by two-dimensional aggregations of particles, to minimize the surface potential of each particle. The doping effect of $Mn_3O_4$ nanoparticle was investigated with Raman spectra. Given the upshift in positions of G and 2D in raman peaks, we suggest that $Mn_3O_4$ nanoparticles induce p-doping of graphene film.

• 한국결정성장학회지
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• 제33권2호
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• pp.78-82
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• 2023

The oxygen evolution reaction (OER) is the primary challenge in renewable energy storage technologies, specifically electrochemical water splitting for hydrogen generation. We report effects of Mo doping into Ni layered double hydroxide (Ni-LDH) microcrystal on electrocatalytic activities. In this study, Mo doped Ni-LDH were grown on three-dimensional porous nicekl foam (NF) by a facile solvothermal method. Homogeneous LDH structure on the NF was clearly observed. However, the surface microstructure of the nickel foam began to be irregular and collapsed when Mo precursor is doped. Electrocatalytic OER properties were analyzed by Linear sweep voltammetry (LSV) and Electrochemical impedance spectroscopy (EIS). The amount of Mo doping used in the electrocatalytic reaction was found to play a crucial role in improving catalytic activity. The optimum Mo amount introduced into the Ni LDH was discussed with respect to their OER performance.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1996년도 재료학회 추계학술발표회
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• pp.21-21
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• 1996

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 하계종합학술대회논문집
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• pp.437-440
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• 1998

We studied phosphorus doping effect on the epitaxial growth of $Si_{1-x}Ge_{x}$ film with high Ge fraction on Si substates at 550.deg. C by LPCVD. In a low $Ph_{3}$ partial pressure region such as below 1.25 mPa, the phosphorus dopant concentration increased linearly with increasing $PH_{3}$ partial pressure while the deposition rate and the Ge fraction were constant. In a higher $PH_{3}$ partial pressure region, the phosphorus dopant concentration and the deposition rate decreased, while the Ge fraction slightly increased. The deposition arate and the Ge fraction increased with increasing $GeH_{4}$ partial pressure while the phophours dopant concentration decreased. But the increasing rate of Ge fraction with incrasing $PH_{3}$ partial pressure was reduced at a high $GeH_{4}$ partial pressure. According to test results, it suggests that high surface coverage of phosphorus atoms suppress both the $SiH_{4}$ adsorption/reasction and the $GeH_{4}$ adsorption/reaction on the surfaces, and the effect is more stronger on $SiH_{4}$ than on $GeH_{4}$. In a higher $PH_{3}$ partial pressure region, the epitaxial growth is largely controlled by surface coverage effect of phosphorus atoms. The phosphorus surface coverage was slimited at a high $GeH_{4}$ partial pressure because adsorbed Ge atoms effectively suppresses the adsorption of phosphorus atoms.

• 한국표면공학회지
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• 제49권1호
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• pp.40-45
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• 2016

Recently, $Bi_2Te_3$-based alloys are the best thermoelectric materials near to room temperature, so it has been researched to achieve increased figure of merit(ZT). Ternary compounds such as Bi-Te-Se and Bi-Sb-Te have higher thermoelectric property than binary compound Bi-Te and Sb-Te, respectively. Compared to DC plating method, pulsed electrodeposition is able to control parameters including average current density, and on/off pulse time etc. Thereby the morphology and properties of the films can be improved. In this study, we electrodeposited n-type ternary Cu-doped $Bi_2(Te-Se)_3$ thin film by modified pulse technique at room temperature. To further enhance thermoelectric properties of $Bi_2(Te-Se)_3$ thin film, we optimized Cu doping concentration in $Bi_2(Te-Se)_3$ thin film and correlated it to electrical and thermoelectric properties. Thus, the crystal, electrical, and thermoelectric properties of electrodeposited $Bi_2(Te-Se)_3$ thin film were characterized the XRD, SEM, EDS, Seebeck measurement, and Hall effect measurement, respectively. As a result, the thermoelectric properties of Cu-doped $Bi_2(Te-Se)_3$ thin films were observed that the Seebeck coefficient is $-101.2{\mu}V/K$ and the power factor is $1412.6{\mu}W/mK^2$ at 10 mg of Cu weight. The power factor of Cu-doped $Bi_2(Te-Se)_3$ thin film is 1.4 times higher than undoped $Bi_2(Te-Se)_3$ thin film.

• 청정기술
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• 제23권3호
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• pp.308-313
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• 2017

본 연구에서는 Graphite Felt (GF) 전극의 표면에 산소와 질소의 도핑을 통하여 전기화학적 특성을 개선하고, 이의 촉매화학적 효과를 바나듐 레독스 흐름전지의 양극과 음극의 특성비교를 통하여 관찰하였다. 탄소전극 표면의 산소와 질소 동시 도핑은 GF 샘플을 773 K에서 암모니아-공기 ($NH_3=50%$, $O_2=10%$) 혼합가스에 노출시켜 Chemical Vapor Deposition (CVD) 방법으로 제조하였다. 이러한 산소-질소 동시 도핑의 전기화학적 효과는 산소만으로 도핑 처리된 GF 샘플과 비교하여 분석, 평가하였다. 탄소전극 샘플들의 표면 구조와 화학적 조성은 Scanning Electron Microscopy (SEM)와 X-ray Photoelectron Spectroscopy (XPS) 방법을 통하여 분석하였다. 결과물로 얻어진 탄소전극은 바나듐 레독스-흐름전지의 양극과 음극에 동시 적용하여 충-방전 사이클을 진행하고, 각 전극이 흐름전지의 효율과 양극과 음극에서의 전기화학적 특성에 미치는 효과를 비교하여 분석하였다. 산소와 질소의 동시 도핑으로 처리된 GF 전극은 산소만으로 활성화된 전극에 비하여 흐름전지의 전압 및 에너지 효율에서 2% 이상의 향상 효과를 보여주었다. 특히, 탄소전극 표면의 산소-질소의 동시 도핑은 음극반응에서 우수한 전기화학적 특성을 유도하는 것을 확인하였다.