• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.2
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• pp.80-84
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• 2010

The temperature-programmed reduction of titanium oxide ($TiO_2$) with pure $CH_4$ was used for the preparation of titanium carbide crystallites. The synthesized materials had the different surface areas, indicating that the structural properties of these materials were strong functions of two different heating rates and space velocity employed. The titanium carbide crystallites were active for $NH_3$ decomposition. Since the reactivity varied with changes in the particle size, ammonia decomposition reactivity over the titanium carbides crystallites appeared to be related to the different active species. The reactivities of titanium carbide crystallites were two and three times lower than those of the vanadium and molybdenum carbide crystallites, respectively. These results suggested that the difference in activities might be related to the degree of electron transfer between metals and carbon.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.14 no.2
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• pp.58-62
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• 2004

The shape evolution of the interface void of copper metallization for intergrated circuits under electromigration stress is modeled. A 2-dimensional finite-difference numerical method is employed for computing time evolution of the void shape driven by surface diffusion, and the electrostatic problem is solved by boundary element method. When the diffusion coefficient is isotropic, the numerical results agree well with the known case of wedge-shape void evolution. The numerical results for the anisotropic diffusion coefficient show that the initially circular void evolves to become a fatal slitlike shape when the electron wind force is large, while the shape becomes non-fatal and circular as the electron wind force decreases. The results indicate that the open circuit failure caused by slit-like void shape is far less probable to be observed for copper metallization under a normal electromigration stress condition.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.17 no.5
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• pp.196-203
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• 2007

We have studied a method for the preparation of hybrid $carbon/TiO_2$ complexes involving pitch coating, pitch binding and the penetration of titanium n-butoxide(TNB) solution with porous carbon. The photocatalysts were investigated with surface textural properties and SEM morphology, structural crystallinity and elemental identification between porous carbon and $TiO_2$, and dye decomposition performance. For the all $carbon/TiO_2$ complexes prepared by some kinds of different methods, the excellent photocatalytic effect for dye degradation should be attributed to the both effects between photo-decomposition of the supported $TiO_2$ and adsorptivity of the porous carbons.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.10 no.1
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• pp.55-61
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• 2000

The electrochemical properties of hard carbon anodes in lithium ion batteries were improved by carbon coating using polyvinyl chloride (PVC). The reduction in irreversible capacity occured and the reversible capacity increased. It is suggested that the PVC carbon coating modifies the surface of hard carbon and reduces the surface reaction with species from air. The degree of the graphitization of PVC carbon was controlled by an addition of Ni, and the effect of the amount of Ni addition on the electrochemical properties was discussed.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.26 no.5
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• pp.171-174
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• 2016

The diamond wire sawing method to produce silicon wafers for the photovoltaic application is still a new and highly investigated wafering technology. This technology, featured as the higher productivity, lower wear of the wire, and easier recycling of the coolant, is expected to become the mainstream technique for slicing the silicon crystals. However, the saw marks on the wafer surface have to be investigated and improved. This paper discusses the removal of saw marks on diamond wire-sawn single crystalline silicon wafer. With a pretreatment step using tetramethyl ammonium hydroxide ($(CH_3)_4NOH$, TMAH) and conventional texturing process with KOH solution (1 % KOH, 8 % IPA, and DI water), the saw marks on the surface of the diamond wire-sawn silicon wafers can be effectively removed and they are invisible to naked eyes completely.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 2000.06a
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• pp.35-58
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• 2000

The demand for sub-micrometer or nanometer functional ceramic powders with a better suspension behavior in aqueous media in increasing. Redispersible barium titanate (BT) nanocrystals, green light emitting Mn2+ doped Zn$_2$SiO$_4$ and ZnS nanoparticle phosphors were synthesized by a hydrothermal method or chemical precipitation with surface modification. The nanoparticle redispersibility for BT was achieved by using a polymeric surfactant. X-ray diffraction(XRD) results indicated that the BT particles are of cubic phase with 80 nm in size. XRD results of zinc silicate phosphor indicate that seeds play an important role in enhancing the nucleation and crystallization of Zn$_2$SiO$_4$ crystals in a hydrothermal condition. This paper describes and discuss the methods of surface modification, and the resulting related properties for BT, zinc silicate and zinc sulfide.

• 한국전산유체공학회:학술대회논문집
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• 2003.10a
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• pp.160-161
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• 2003

Thermocapillary convection is a surface tension driven flow due to a temperature gradient along an interface. It occurs during a crystal-growth process and therefore understanding the convection is important to material processing in microgravity. Although modelling of the float-zone crystal-growth process has been of interest for a few decades, most studies of liquid bridges assumed non-deformable flat surfaces. In reality, the surface profile, g(t,z), is unknown and should be obtained as a solution to the coupled transport equations along with the surface force balance. Here we report on a numerical study of axisymmetric thermocapillary convection in liquid bridges with deformable surfaces. The interface is determined as part of the complete solution. The influence of the capillary number (Ca), Reynolds number (Re), Prandtl number (Pr) and aspect ratio(Ar) on the dynamics is explored.

• Journal of the Korean institute of surface engineering
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• v.28 no.3
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• pp.174-181
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• 1995

Multilayered silicon cantilever beams as interconnection systems for bare chip burn-in socket applications have been designed, fabricated and characterized. Fabrication processes of the beam are employing standard semiconductor processes such as thin film processes and epitaxial layer growth and silicon wet etching techniques. We investigated silicon etch rate in 1-3-10 etchant as functions of doping concentration, surface mechanical stress and crystal defects. The experimental results indicate that silicon etch rate in 1-3-10 etchant is strong functions of doping concentration and crystal defect density rather than surface mechanical stress. We suggested the new fabrication processes of multilayered silicon cantilever beams.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 2000.06a
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• pp.127-142
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• 2000

The charged cluster model states that chemical vapor deposition (CVD) begins with gas phase nucleation of charged clusters followed by cluster deposition on a substrate surface to form a thin film. A two-chambered CVD system, separated by a 1-mm orifice, was used to study gold deposition by thermal evaporation in order to determine if the CCM applies in this case. At a filament temperature of 1523 and 1773 K, the presence of nano-meter sized gold clusters was found to be positive and the cluster size and size distribution increased with increasing temperature. Small clusters were found to be amorphous and they combined with clusters already deposited on a substrate surface to form larger amorphous clusters on the surface. This work revealed that gold thin films deposited on a mica surface are the result of the sticking of 4-10 nm clusters. The topography of these films was similar to those reported previously under similar conditions.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.15 no.1
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• pp.34-38
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• 2005

Effects of pH level and slurry particle size on material removal rate and planarization of langasite single crystal wafer have been examined. Higher material removal rate was obtained with lower pH level slurries while the planarization was found to be determined by average particle size of colloidal silica slurries. Slurries containing 0.045 ㎛ amorphous silica particles showed the best polishing effect without any scratches on the surface. Effective particle number has a strong effect on the surface planarization and the removal rate, so that the lower effective particle numbers produced low removal rate but the better planarization results.