Characterization of the SnAg Electrodeposits according to the Current Density and Cross-sectional Microstructure Analysis in the Cu Pillar Solder Bump (전류밀도에 따른 SnAg 도금층의 특성 및 Cu 필라 솔더 범프의 단면 미세구조 측정)
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- Journal of the Korean institute of surface engineering
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- v.48 no.4
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- pp.131-135
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- 2015