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http://dx.doi.org/10.5695/JKISE.2015.48.4.131

Characterization of the SnAg Electrodeposits according to the Current Density and Cross-sectional Microstructure Analysis in the Cu Pillar Solder Bump  

Kim, Sang-Hyuk (Department of Material Science and Engineering, Dong-A University)
Hong, Seong-Ki (Department of Material Science and Engineering, Dong-A University)
Yim, Hyunho (Department of Material Science and Engineering, Dong-A University)
Lee, Hyo-Jong (Department of Material Science and Engineering, Dong-A University)
Publication Information
Journal of the Korean institute of surface engineering / v.48, no.4, 2015 , pp. 131-135 More about this Journal
Abstract
We investigated the surface morphology and the change of Ag concentration for SnAg electrodeposits according to the current density using labmade and commercial plating solutions. The concentration of Ag in the SnAg electrodeposits decreased with increasing the current density. The Ag concentrations at the conditions of over $50mA/cm^2$ were below 3 wt% and the surface was relatively smooth. Cu pillar bump was fabricated by using SnAg electroplating, and it was reflowed at $240^{\circ}C$ for 90 sec. The cross-sectional microstructure was investigated by using EBSD measurement and it was found that the grain size of SnAg became smaller by increasing the number of reflow treatments.
Keywords
SnAg; Electroplating; Current density; EBSD; Microstructure;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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