• Title/Summary/Keyword: Surface Profiler

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Influence of Temperature on the Fretting Wear of Advanced Nuclear Fuel Cladding Tube against Supporting Grid (온도 상승이 개량형 핵연료 피복관과 지지격자 사이의 프레팅 마멸에 미치는 영향)

  • Lee Young-Ze;Park Yong-Chang;Jeong Sung-Hoon;Kim Jin-Seon;Kim Yong-Hwan
    • Tribology and Lubricants
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    • v.22 no.3
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    • pp.144-148
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    • 2006
  • The experimental investigation was performed to find the associated changes in characteristics of fretting wear with various water temperatures. The fretting wear tests were carried out using the zirconium alloy tubes and the grids with increasing the water temperature. The tube materials in water of $20^{\circ}C,\;50^{\circ}C\;and\;80^{\circ}C$ were tested with the applied load of 20 N and the relative amplitude of $200{\mu}m$. The worn surfaces were observed by SEM, EDX analysis and 2D surface profiler. As the water temperature increased, the wear volume was decreased, but oxide layer was increased on the worn surface. The abrasive wear mechanism was observed at water temperature of $20^{\circ}C$ and adhesive wear mechanism occurred at water temperature of $50^{\circ}C,\;80^{\circ}C$. As the water temperature increased, surface micro-hardness was decreased, but wear depth and wear width were decreased due to increasing stick phenomenon. Stick regime occurred due to the formation of oxide layer on the worn surface with increasing water temperatures

Characteristics of Al Films Prepared by Oblique Angle Deposition (빗각 증착으로 제조한 Al 박막의 특성)

  • Park, Hye-Sun;Yang, Ji-Hoon;Jung, Jae-Hun;Song, Min-A;Jeong, Jae-In
    • Journal of the Korean institute of surface engineering
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    • v.45 no.3
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    • pp.111-116
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    • 2012
  • Oblique angle deposition (OAD) is a physical vapor deposition method which utilizes non-normal angles between the substrate and the vaporizing source. It has been known that tilting the substrate changes the properties of the film deposited on it, which was thought to be a result of morphological change of the film. In this study, OAD has been applied to prepare single and multilayer Al films by magnetron sputtering. The magnetron sputtering source of 4 inch diameter was used to deposit the films. Al films have been deposited on Si wafers and cold-rolled steel sheets. The multilayer films were prepared by changing the tilting angle upside down at each layer interval, which means that when the first layer was deposited at an angle of $+45^{\circ}$, the second layer was deposited at an angle of $-45^{\circ}$, and vice versa. The microstructure, surface roughness and reflectance of the films were investigated using a scanning electron microscope, a surface profiler and a spectrophotometer, respectively. The corrosion resistance was measured and compared using the salt spray test. The single layer film prepared at an oblique angle of $60^{\circ}$ prepared at other angles. However, for the multilayer films, the film prepared at an oblique angle of $45^{\circ}$ showed the most compact and featureless structure. The multilayer films were found to exhibit higher corrosion resistance than the single layer films.

Back Surface Field Properties with Different Surface Conditions for Crystalline Silicon Solar Cells (후면 형상에 따른 결정질 실리콘 태양전지의 후면전계 형성 및 특성)

  • Kim, Hyun-Ho;Kim, Seong-Tak;Park, Sung-Eun;Song, Joo-Yong;Kim, Young-Do;Tark, Sung-Ju;Kwon, Soon-Woo;Yoon, Se-Wang;Son, Chang-Sik;Kim, Dong-Hwan
    • Korean Journal of Materials Research
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    • v.21 no.5
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    • pp.243-249
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    • 2011
  • To reduce manufacturing costs of crystalline silicon solar cells, silicon wafers have become thinner. In relation to this, the properties of the aluminium-back surface field (Al-BSF) are considered an important factor in solar cell performance. Generally, screen-printing and a rapid thermal process (RTP) are utilized together to form the Al-BSF. This study evaluates Al-BSF formation on a (111) textured back surface compared with a (100) flat back surface with variation of ramp up rates from 18 to $89^{\circ}C$/s for the RTP annealing conditions. To make different back surface morphologies, one side texturing using a silicon nitride film and double side texturing were carried out. After aluminium screen-printing, Al-BSF formed according to the RTP annealing conditions. A metal etching process in hydrochloric acid solution was carried out to assess the quality of Al-BSF. Saturation currents were calculated by using quasi-steady-state photoconductance. The surface morphologies observed by scanning electron microscopy and a non-contacting optical profiler. Also, sheet resistances and bulk carrier concentration were measured by a 4-point probe and hall measurement system. From the results, a faster ramp up during Al-BSF formation yielded better quality than a slower ramp up process due to temperature uniformity of silicon and the aluminium surface. Also, in the Al-BSF formation process, the (111) textured back surface is significantly affected by the ramp up rates compared with the (100) flat back surface.

A Study on the reduction of surface roughness by analyzing the thickness of photocurable sculpture (광조형물의 패턴두께에 따른 표면 거칠기 저감을 위한 공정연구)

  • Kim, Young-Su;Yang, Hyoung-Chan;Kim, Go-Beom;Dang, Hyun-Woo;Doh, Yang-Hoi;Choi, Kyung-Hyun
    • Journal of Power System Engineering
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    • v.20 no.4
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    • pp.75-82
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    • 2016
  • In this paper, we developed a 3D printing system using a photo-curing resin in order to reduce the surface roughness of a sculpture produced with the 3D printer. Using the pattern of the resulting variable thickness, that gave rise to a stepped shape, and the area error of the photo-curable sculpture, a study was carried out for the process to reduce the surface roughness. At a given value of stage velocity (40~70 mm/s) and output air pneumatic pressure (20~60 kPa), the minimum pattern thickness of the pattern was achieved $65{\mu}m$ and the maximum pattern thickness of up to $175{\mu}m$. To increases the pattern resolution to about $40{\mu}m$, the process conditions should be optimized. 3D surface Nano profiler was used to find the surface roughness of the sculpture that was measured to be minimum $4.7{\mu}m$ and maximum $8.7{\mu}m$. The maximum surface roughness was reduced about $1.2{\mu}m$ for the maximum thickness of the pattern. In addition, a FDM was used to fabricate the same sculpture and its surface roughness measurements were also taken for comparison with the one fabricated using photo-curing. Same process conditions were used for both fabrication setups in order to perform the comparison efficiently. The surface roughness of the photo-curable sculpture is $5.5{\mu}m$ lower than the sculpture fabricated using FDM. A certain circuit patterns was formed on the laminated surface of the photo-curable sculpture while there was no stable pattern on the laminated surface of the FDM based sculpture the other hand.

Pad Surface Characteristics and their Effect on Within Wafer Non-Uniformity in Chemical Mechanical Polishing (화학 기계적 연마에서 패드표면 특성이 웨이퍼 불균일도에 미치는 영향)

  • Jeong, Suk-Hoon;Lee, Hyun-Seop;Jeong, Moon-Ki;Shin, Woon-Ki;Lee, Sang-Jik;Park, Boum-Young;Kim, Hyoung-Jae;Jeong, Hae-Do
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.58-58
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    • 2009
  • Uniformity related issues in chemical mechanical polishing (CMP) are within wafer non-uniformity (WIWNU), wafer to wafer non-uniformity (WTWNU), planarity and dishing/erosion. Here, the WIWNU that originates from spatial distribution of independent variables such as temperature, sliding distance, down force and material removal rate (MRR) during CMP, relies to spatial dependency. Among various sources of spatial irregularity, hardness and modulus of pad and surface roughness in sources for pad uniformity are great, especially. So, we investigated the spatial variation of pad surface characteristics using pad measuring system (PMS) and roughness measuring system. Reduced peak height ($R_{pk}$) of roughness parameter shows a strong correlation with the removal rate, and the distribution of relative sliding distance onwafer during polishing has an effect on the variation of $R_{pk}$ and WIWNU. Also, the results of pad wear profile thorough developed pad profiler well coincides with the kinematical simulation of conditioning, and it can contribute for the enhancement of WIWNU in CMP process.

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Finite Element Simulation and Experimental Study on the Electrochemical Etching Process for Fabrication of Micro Metal Mold (미세금형 가공을 위한 전기화학식각 공정의 유한요소 해석 및 실험결과 비교)

  • Ryu, Heon-Yul;Im, Hyeon-Seung;Cho, Si-Hyeong;Hwang, Byeong-Jun;Lee, Sung-Ho;Park, Jin-Goo
    • Korean Journal of Materials Research
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    • v.22 no.9
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    • pp.482-488
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    • 2012
  • To fabricate a precise micro metal mold, the electrochemical etching process has been researched. We investigated the electrochemical etching process numerically and experimentally to determine the etching tendency of the process, focusing on the current density, which is a major parameter of the process. The finite element method, a kind of numerical analysis, was used to determine the current density distribution on the workpiece. Stainless steel(SS304) substrate with various sized square and circular array patterns as an anode and copper(Cu) plate as a cathode were used for the electrochemical experiments. A mixture of $H_2SO_4$, $H_3PO_4$, and DIW was used as an electrolyte. In this paper, comparison of the results from the experiment and the numerical simulation is presented, including the current density distribution and line profile from the simulation, and the etching profile and surface morphology from the experiment. Etching profile and surface morphology were characterized using a 3D-profiler and FE-SEM measurement. From a comparison of the data, it was confirmed that the current density distribution and the line profile of the simulation were similar to the surface morphology and the etching profile of the experiment, respectively. The current density is more concentrated at the vertex of the square pattern and circumference of the circular pattern. And, the depth of the etched area is proportional to the current density.

Etch Characteristics of CO/NH3 Plasma Gas for Magnetic Random Access Memory in Pulsed-biased Inductively Coupled Plasmas

  • Yang, Gyeong-Chae;Jeon, Min-Hwan;Yeom, Geun-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.200-200
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    • 2013
  • 기존 메모리 반도체에 비교해 빠른 재생속도와 높은 집적도, 비휘발성 등의 특성을 가지는 MRAM (Magnetic Random Access Memory)은 DRAM, flash memory 등을 대체할 수 있는 차세대 기억 소자로서 CoFeB/MgO/CoFeB로 구성된 한 개의 MTJ (Magnetic Tunnel Junction)를 단위 메모리로 사용한다. 이 MTJ 물질들은 고밀도 플라즈마를 이용한 건식 식각공정시 Cl2, BCl3 등과 같은 chlorine 을 포함한 가스를 이용하여 왔으나 식각 후 sidewall에서 발생하는 부식과 식각 선택비 확보의 어려움 등으로 마스크 물질에 제약을 받고 소자 특성이 감소하게 되는 등의 문제가 있다. 따라서 이러한 식각 문제점을 해결하기 위한 대안으로 noncorrosive 가스인 CO/NH3, CH3OH, CH4 등을 이용한 MTJ 식각 연구가 진행되어 오고 있으며 이중 CO/NH3 혼합가스는 부식성이 없고 hard mask와의 높은 선택비를 가지는 기체로 CO gas에 NH3 gas를 첨가하게 되면 etch rate이 증가하는 특성을 보인다. 또한 rf pulse-biased power를 이용하여 이온의 입사를 시간에 따라 제어함으로써 pulse off time 때 etch gas와 MTJ 물질간의 chemical reaction을 향상시킬 수 있다. 따라서 본 연구에서는 CO/NH3 혼합가스를 이용하여 다양한 rf pulse-biased power 조건에서 MTJ 물질인 CoFeB, MgO와 hard mask 물질인 W을 식각 한 뒤 식각특성을 분석하였으며 MTJ surface의 chemical binding state, surface roughness 측정을 진행하였다. 식각 샘플의 측정은 Alpha step profiler, XPS (X-ray Photoelectron Spectroscopy), AFM (Atomic Force Microscopy)를 통해 진행되었다. Time-averaged pulse bias에서는 duty ratio가 감소할수록 etch rate의 큰 감소 없이 CoFeB/W, MgO/W 물질의 etch selectivity가 향상됨을 확인할 수 있었으며 pulse off time 구간에서의 chemical reaction 향상으로 인해 식각부산물의 재증착이 감소하고 CoFeB의 surface roughness가 감소하는 것을 확인하였다.

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SEASONAL AND SUBINERTIAL VARIATIONS IN THE SOYA WARM CURRENT REVEALED BY HF OCEAN RADARS, COASTAL TIDE GAUGES, AND A BOTTOM-MOUNTED ADCP

  • Ebuchi, Naoto;Fukamachi, Yasushi;Ohshima, Kay I.;Wakatsuchi, Masaaki
    • Proceedings of the KSRS Conference
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    • 2008.10a
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    • pp.340-343
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    • 2008
  • The Soya Warm Current (SWC) is a coastal boundary current, which flows along the coast of Hokkaido in the Sea of Okhotsk. Seasonal and subinertial variations in the SWC are investigated using data obtained by high-frequency (HF) ocean radars, coastal tide gauges, and a bottom-mounted acoustic Doppler current profiler (ADCP). The HF radars clearly capture the seasonal variations in the surface current fields of the SWC. The velocity of the SWC reaches its maximum, approximately 1 m/s, in the summer, and becomes weaker in the winter. The velocity core is located 20 to 30 km from the coast, and its width is approximately 50 km. The almost same seasonal cycle was repeated in the period from August 2003 to March 2007. In addition to the annual variation, the SWC exhibits subinertial variations with a period from 10-15 days. The surface transport by the SWC shows a significant correlation with the sea level difference between the Sea of Japan and Sea of Okhotsk for both of the seasonal and subinertial variations, indicating that the SWC is driven by the sea level difference between the two seas. Generation mechanism of the subinertial variation is discussed using wind data from the European Centre for Medium-range Weather Forecasts (ECMWF) analyses. The subinertial variations in the SWC are significantly correlated with the meridional wind component over the region. The subinertial variations in the sea level difference and surface current delay from the meridional wind variations for one or two days. Continental shelf waves triggered by the meridional wind on the east coast of Sakhalin and west coast of Hokkaido are considered to be a possible generation mechanism for the subinertial variations in the SWC.

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The Study of the Roughness of the Pavement on the Bridge Deck and Approach Slab using a 5year(2003 to 2007) Pavement Condition Survey Data (HPMS 데이터를 이용한 고속도로 교량 및 뒷채움구간 평탄성 특성 연구)

  • Park, Sang-Wook;Suh, Young-Chan
    • International Journal of Highway Engineering
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    • v.10 no.3
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    • pp.189-197
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    • 2008
  • Using a 5 year(2003 to 2007) pavement condition survey data from the highway pavement management system(HPMS), the roughness of the bridge deck pavement was analyzed. Based on the result of this analysis, this study tried to identify the factors affecting the deterioration of the bridge deck pavement condition. The data from HPMS indicates that the roughness of the bridge deck pavement is worse than that of the general pavement on the roadbed. The worse roughness of the bridge deck pavement is caused by the settlement of approach slab as well as the surface distress on the bridge deck pavement. In order to improve effectively the roughness of the bridge deck pavement, a management system was established in which not only the regular automated pavement condition survey to check the distress of surface of the bridge deck pavement was adopted but an automated surface profiler to check the degree of settlement of approach slab was applied.

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Resin bonding of metal brackets to glazed zirconia with a porcelain primer

  • Lee, Jung-Hwan;Lee, Milim;Kim, Kyoung-Nam;Hwang, Chung-Ju
    • The korean journal of orthodontics
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    • v.45 no.6
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    • pp.299-307
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    • 2015
  • Objective: The aims of this study were to compare the shear bond strength between orthodontic metal brackets and glazed zirconia using different types of primer before applying resin cement and to determine which primer was more effective. Methods: Zirconia blocks were milled and embedded in acrylic resin and randomly assigned to one of four groups: nonglazed zirconia with sandblasting and zirconia primer (NZ); glazed zirconia with sandblasting, etching, and zirconia primer (GZ); glazed zirconia with sandblasting, etching, and porcelain primer (GP); and glazed zirconia with sandblasting, etching, zirconia primer, and porcelain primer (GZP). A stainless steel metal bracket was bonded to each target surface with resin cement, and all specimens underwent thermal cycling. The shear bond strength of the specimens was measured by a universal testing machine. A scanning electron microscope, three-dimensional optical surface-profiler, and stereoscopic microscope were used to image the zirconia surfaces. The data were analyzed with one-way analyses of variance and the Fisher exact test. Results: Group GZ showed significantly lower shear bond strength than did the other groups. No statistically significant differences were found among groups NZ, GP, and GZP. All specimens in group GZ showed adhesive failure between the zirconia and resin cement. In groups NZ and GP, bonding failed at the interface between the resin cement and bracket base or showed complex adhesive and cohesive failure. Conclusions: Porcelain primer is the more appropriate choice for bonding a metal bracket to the surface of a full-contour glazed zirconia crown with resin cement.