• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.53-57
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• 2011

In the modern packaging technologies highly condensed metal interconnects are typically formed by highcost processes. These methods inevitably require the precise controls of mutually dependant process parameters, which usually cause the difficulty of the change in the layout design for interconnects of chip to-chip, or chip-to-substrate. In order to overcome these problems, the unique concept and methodology of self-assembly even in micro-meter scale were developed. In this report we focus on the factors which influenced the self-formed bumps by analyzing the phenomenon experimentally. In case of RMA flux, homogenous pattern was obtained in both plain surface and cross-section surface observation. By using RA flux, the phenomena were accelerated although the self-formtion results was inhomogenous. With ussage of moderate RA flux, reaction rate of the self-formation was accelerated with homogeneous pattern.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.4
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• pp.34-47
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• 2000

Since carbon fiber epoxy composite materials have excellent properties for structures due to their high specific strength, high specific modulus, high damping and low thermal expansion, the hollow shafts made of carbon fiber epoxy composites have been widely used for power transmission shafts for motor vehicles , spindles of machine tools, motor base, bearing mount for tool up and manufacturing. The molded composite machine elements are not usually accurate enough for mechanical machine elements, which require turning drilling , cutting and grinding. The experiment are surface grinding wheel GC60 to the carbon fiber epoxy composite specimen with respect to staking angle [0]nT , [45]nT, [90]nT on the CNC grinding machine. In this paper, the surface grinding characteristics of composite plate, which are surveyed experimentally and analytically with respect to the grinding force, surface roughness and wheel loading according to the variable depth of cut, wheel velocity and table feed rate are investigated.

• Journal of Welding and Joining
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• v.13 no.4
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• pp.30-35
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• 1995

전자기기의 소형화는 앞으로도 계속 진행될 것이므로, 이에 필요한 Fine Pitch 또는 고밀도 실장기술의 개발이 지속적으로 요구될 것으로 생각된다. 앞에서 언급한 3가지 Fine Pitch 표면실장을 위한 Solder 합금의 공급 방법중에서 종래의 Screen Print 방법과 Projected Solder Pre-coat 방법은 0.3mm Pitch가 한계인 것으로 생각되며, Super Solder Pro-coat 방법은 좀 더 Fine Pitch 까지도 사용 가능한 기술 로 생각된다. 이외에도 0.1mm 보다 미세한 Pitch의 표면실장을 위하여, Solder에 의한 접합이 아닌, 이방성 도전 접착제와 같은 도전성 매개체를 통하여 접촉에 의한 표면 실장의 개념도 도입하고 있다.

• 제어로봇시스템학회:학술대회논문집
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• 2002.10a
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• pp.87.5-87
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• 2002

. A high peak power demand at substations will result under This paper deals with the detection of defects at BGA solder joints in PC boards by using X-ray Imaging. . To improve a cost performance and reliability of PC boards, an inspection of BGA is required in the surface mount process. . Contents 2 We attempt to detect the characteristic of the solder bridges based on an image analysis.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.12a
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• pp.155-162
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• 1999

A bare chip packaging technology by an encapsulated flip chip bonding on a build-up printed circuit board has emerged in 1991. Since then, it enabled a high density and low cost semiconductor packaging such as a direct chip bonding on mother board and high density surface mount components, such as BGA and CSP. This technology can respond to various requirements from applications and is considered to take over a main role of semiconductor packaging in the next decade.

• Proceedings of the Optical Society of Korea Conference
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• 2007.02a
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• pp.305-306
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• 2007

• Journal of Institute of Control, Robotics and Systems
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• v.10 no.8
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• pp.711-717
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• 2004

We propose a path planning method to improve the productivity of SMT (surface mount technology) inspection machines with an area camera. A unified method is newly proposed to determine the FOV clusters and camera sequence simultaneously. The proposed method is implemented by a hybrid genetic algorithm to increase the convergence speed. Comparative simulation results are then presented to verify the usefulness of the proposed algorithm.

• Journal of Korean Ophthalmic Optics Society
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• v.17 no.4
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• pp.441-447
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• 2012

Purpose: This paper is about development and design of the 1x optical path relay adapter for the beam splitting prism by us the day & night scope. Methods: To product the day & night scope by using the beam splitting prism and the commercial zoom optical system with the C-mount lens barrel structure, the optical path relay adapter, which doesn't change the image size of the zoom optical system and can stretch the position of the image-forming surface, is needed. We could design the 1x optical path relay adapter by using the CodeV program in which the Lens Module mode is offered. Results: We could design the optical path relay adapter used in the day&night scope with the beam splitting prism, of which characteristics have the EFL of -56.0 mm, the magnification of +1.0x, the distance from the 1st lens surface to the last lens surface of about 20.4 mm. The resolution of this system is characterized by 30 lp/mm at 40% MTF. This is enough to accommodate the designed optical path relay adapter can overcome the resolution of the 3rd generation of image intesifier tubes. Conclusions: By designing and applying the optical path relay adapter of which optical characteristics have the EFL of -56.0 mm, the magnification of +1.0x, the distance from the 1st lens surface to the last lens surface of about 20.4 mm, and the resolution of 30 lp/mm at 40% MTF, we could develop the new type day&night scope consisting of the beam splitting, the commercial zoom optical system with the C-mount lens barrel structure, and the 3rd generation of image intesifier tubes.

• Journal of the Korean Society of Industry Convergence
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• v.1 no.2
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• pp.65-74
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• 1998

The purpose of this paper is to investigate the mount of relief of human solar heat load and thermal comfort in outdoor environment in summer, Six different types of sites, T garden and its neighboring area in Japan, were selected as the experiment sites. The experiments were conducted from 22 to 29 August, 1994 to find the relationship between climatic conditions and human responses, Climatic conditions, subjects's thermal sensation and skin temperature were measured. Radiant heat exchange on the human body was estimated on the basis of the measured air and surface temperature and solar radiation. Thermal index Operative Temperature and New Effective Temperature was modified with the effect of the radiant heat exchange. Human thermal comfort and skin temperature is affected by the solar radiation and the sky factor in an outdoor environment. The effect of tree shade was verified on thermal comfort, The mount of relief of human solar heat load is relation to the existence of shade a solar radiation and the sky factor. The urban garden is one of the effective design element in an urban environmental planning.

• Structural Monitoring and Maintenance
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• v.4 no.3
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• pp.237-253
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• 2017

Among various structural health monitoring technologies, impedance-based damage detection has been recognized as a promising tool for diagnosing critical members of civil structures. Since the piezoelectric transducers used in the impedance-based technique should be bonded to the surface of the structure using bonding layers (e.g., epoxy layer), it is hard to maintain the as-built condition of the bonding layers and to reconfigure the devices if needed. This study presents an experimental investigation by using magnetically attached PZT-interface for the impedance-based damage detection in bolted girder connections. Firstly, the principle of the impedance-based damage detection via the PZT-interface device is outlined. Secondly, a PZT-interface attachment method in which permanent magnets are used to replace the conventional bonding layers is proposed. Finally, the use of the magnetic attraction for the PZT-interface is experimentally evaluated via detecting the bolt-loosening events in a bolted girder connection. Also, the sensitivity of impedance signatures obtained from the PZT-interface is analyzed with regard to the interface's material.