• Title/Summary/Keyword: Surface Mount

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Development of Aqueous/Semi-Aqueous Cleaning Agent and its Field Application to Cleaning Process of Electronic Parts (수계/준수계 세정제의 개발 및 전자부품 세정공정 현장적용 연구)

  • Kim, Han-Seong;Cha, An-Jeong;Bae, Jae-Heum;Lee, Ha-Yeoul;Lee, Myung-Jin;Park, Byeong-Deog
    • Clean Technology
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    • v.10 no.2
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    • pp.61-72
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    • 2004
  • In this study, aqueous/semi-aqueous cleaning agents which consist of organic solvent, surfactant, cosurfactant, and water were developed by changing formulation parameters such as organic solvent type and contents, surfactant type and contents, and cosurfactant/surfactant(A/S) ratio, etc.. And physical properties and flux removal of the formulated cleaning agents have been evaluated. Also, the performance of oil-water separation from the rinse water contaminated during the cleaning process was evaluated for its recycling. The formulated cleaning agents in this work expected to have good penetration because of their low viscosity and low surface tension values of 30.2~32.5 dyne/cm. The flux removal with the terpene type cleaning agent was higher than that with hydrocarbon type cleaning agent and two commercial products (CPA(commercial product A), CPB(commercial product B)). And the performance of oil-water separation by gravity settling from the rinse water contaminated with formulated cleaning agent and soils was shown to be very good. The cleaning agents developed in this work were applied to surface mounting technology(SMT) cleaning process for manufacturing electronic parts at L electronic company. As a result, the newly developed cleaning agents showed two times better cleaning speed for removal of solder cream than the conventional ond containing ethanol and IPA(isopropyl alcohol). In addition, malodor and VOC problems generated by the previous organic cleaning agents have been solved in the manufacturing field through introduction of the non-volatile and environmental-friendly cleaning agents to the field.

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Optimum Design of Liquid Cooling Heat Exchangers and Cooling-Fluid Distributors for a Amplifier Cabinet of Telecommunication Equipment (통신장비용 앰플리파이어 액체냉각장치 및 냉각유체 분배기의 최적설계 및 성능특성)

  • Yun, Rin;Kim, Yong-Chan;Kim, Hyun-Jong;Choi, Jong-Min;Cheon, Deok-Woo
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.18 no.1
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    • pp.24-30
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    • 2006
  • Three liquid cooling heat exchangers for cooling of telecommunication equipment were designed and their cooling performances were tested. The liquid cooling heat exchangers had twelve rectangular channels $(5\times3 mm)$ with different flow paths of 1, 4, and 12. Silicon rubber heaters were used to provide heat flux to the test section. Heat input was varied from 75 to 400 W, while flow rate and inlet temperature of working fluid were altered from 1.2 to 4.0 liter/fin and from 15 to 3$30^{\circ}C$, respectively. The 4-path heat exchanger showed lower and more uniform average inner temperatures between heaters and the surface of heat exchanger than those of the others. To obtain optimal distribution of working fluid to each channels of liquid cooling heat exchangers, 2-3-2 and 4-3 type tube distributors were designed, and their distribution performances of working fluid were numerically and experimentally investigated. The distributor of the 2-3-2 type showed superior distribution performance compared with those of the 4-3 type distributor.

Optimal Design of the Flexure Mounts for Satellite Camera by Using Design of Experiments (실험계획법을 이용한 인공위성 주반사경 플렉셔 마운트의 최적 설계)

  • Kim, Hyun-Jung;Seo, Yu-Deok;Youn, Sung-Kie;Lee, Seung-Hoon;Lee, Deog-Gyu;Lee, Eung-Shik
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.32 no.8
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    • pp.693-700
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    • 2008
  • The primary mirror system in a satellite camera is an opto-mechanically coupled system for a reason that optical and mechanical behaviors are intricately interactive. In order to enhance the opto-mechanical performance of the primary mirror system, opto-mechanical behaviors should be thoroughly investigated by using various analysis procedures such as elastic, thermo-elastic, optical and eigenvalue analysis. In this paper, optimal design of the bipod flexure mounts for high opto-mechanical performance is performed. Optomechanical performances considered in this paper are RMS wavefront error under the gravity and thermal loading conditions and 1st natural frequency of the mirror system. The procedures of the flexure mounts design based on design of experiments and statistics is as follows. The experiments for opto-mechanical analysis are constructed based on the tables of orthogonal arrays and analysis of each experiment is carried out. In order to deal with the multiple opto-mechanical properties, MADM (Multiple-attribute decision making) is employed. From the analysis results, the critical design variables of the flexure mounts which have dominant influences on opto-mechanical performance are determined through analysis of variance and F-test. The regression model in terms of the critical design variables is constructed based on the response surfaceanalysis. Then the critical design variables are optimized from the regression model by using SQP algorithm. Opto-mechanical performance of the optimal bipod flexure mounts is verified through analysis.

A Study on Spontaneous Ignition Temperature and Activation Energy of Hydroxypropyl Methyl Cellulose (Hydroxypropyl Methyl Cellulose의 자연발화온도와 활성화 에너지에 관한 연구)

  • Lim, Woo-Sub;Choi, Jae-Wook
    • Journal of the Korean Society of Safety
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    • v.22 no.5
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    • pp.77-83
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    • 2007
  • This study is conducted on spontaneous ignition temperature and activation energy of Hydroxypropyl Methyl Cellulose(HMC) powder. HMC is a kind of cellulose derivative and used as additives for building material, surface coating, printing ink, adhesives, cosmetics and medical supplies. So this material has been widely used as important additive in the chemical industry fields and a mount of production has increased year by year. Therefore, it is very important to find out the thermal ignition characteristics of its danger and the critical ignition temperature. This study was performed by the Spontaneous Ignition Tester(SIT) and so on. Based on the data of the SIT-II, the critical ignition point of HMC is about $186^{\circ}C$ which is slightly lower than normal cellulose.

Double Side SMT and Molding Process Development for mPossum Package

  • Kim, ByongJin;Cho, EunNaRa;Kim, ChoongHoe;Lee, YoungWoo;Lee, JaeUng;Ryu, DongSu;Jung, GyuIck;Kang, DaeByoung;Khim, JinYoung;Yoon, JuHoon;Kim, Sun-Joong
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.4
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    • pp.43-48
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    • 2016
  • 3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

Thermal Shock Cycles Optimization of Sn-3.0 Ag-0.5 Cu/OSP Solder Joint with Bonding Strength Variation for Electronic Components (Sn-3.0 Ag-0.5 Cu/OSP 무연솔더 접합계면의 접합강도 변화에 따른 전자부품 열충격 싸이클 최적화)

  • Hong, Won-Sik;Kim, Whee-Sung;Song, Byeong-Suk;Kim, Kwang-Bae
    • Korean Journal of Materials Research
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    • v.17 no.3
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    • pp.152-159
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    • 2007
  • When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

An Electro-magnetic Air Spring for Vibration Control in Semiconductor Manufacturing (반도체 생산에서 진동 제어를 위한 전자기 에어 스프링)

  • Kim, Hyung-Tae;Kim, Cheol-Ho;Lee, Kang-Won;Lee, Gyu-Seop;Son, Sung-Wan
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.20 no.12
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    • pp.1128-1138
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    • 2010
  • One of the typical problems in the precise vibration is resonance characteristics at low frequency disturbance due to a heavy mass. An electro-magnetic(EM) air spring is a kind of vibration control unit and active isolator. The EM air spring in this study aims at removing the low frequency resonance for semiconductor manufacturing. The mechanical and electronic parts in the active isolator are designed to operate under a weight of 2.5 tons. The EM spring is floated using air pressure in a pneumatic elastic chamber and actuated by EM levitation force. The actuator consists of a EM coil and a permanent magnetic plate which are installed inside of the chamber. An air mount was constructed for the experiment with a stone surface plate, 4 active air springs, 4 gap sensors, a DSP controller, and a multi-channel power amp. A PD control method and operating logic was applied to the DSP. Simulation using 1/4 model was carried out and compared with the experiments. The time duration and maximum peak at resonance frequency can be reduced sharply by the proposed system. The results show that the active system can avoid the resonance caused by the natural frequency of the passive system.

A Study on electrical and mechanical reliability assessment of Sn-3.5Ag solder joint (Sn-3.5Ag BGA 솔더 조인트의 전기적, 기계적 신뢰성에 관한 연구)

  • Sung, Ji-Yoon;Lee, Jong-Gun;Yun, Jae-Hyeon;Jung, Seung-Boo
    • Proceedings of the KWS Conference
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    • 2009.11a
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    • pp.80-80
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    • 2009
  • 패키징 구조의 발전이 점차 중요한 문제로 대두되어, 칩의 집적 기술의 발전에 따라 실장기술에서도 고속화, 소형화, 미세피치화, 고정밀화, 고밀도화가 요구되고있다. 최근 선진국을 중심으로 전자 전기기기 및 부품의 실장기술에서도 환경 친화적인 기술을 요구함에 따라, 저에너지 공정 및 무연 실장 기술에 대한 연구가 활발하게 진행되고 있다. 기존의 SOP(Small Out-line Package), QFP(Quad Flat Package) 등은 소형화, 다핀화, 고속화, 실장성에 한계가 있기 때문에, SMT(Surface Mount Technology) 형식으로 된 BGA(Ball Grid Array)가 휴대형 전화를 비롯한 기타 전자 부품 실장에 널리 사용되고 있다. BGA ball shear 법은 BGA 모듈의 생산 및 취급 중에 발생할지도 모르는 기판에 수평으로 작용하는 기계적인 전단력에 BGA solder ball이 견딜 수 있는 정도를 측정하기 위해 사용되는 시험법이다. 전단 시험에 의한 전단 강도의 측정 외에 전기전도도 측정, 파면 관찰, 이동거리(displacement), 유한요소 해석법 등을 병행하여 시험법의 신뢰성 향상에 대한 연구가 이루어지고 있다. 본 실험에서는 지름이 $500{\mu}m$인 Sn-3.5Ag 솔더볼을 이용하여 세라믹 기판을 접합하여 BGA 패키지를 완성하였다. 상부 기판에 솔더볼을 정렬시켜 리플로우 방법으로 접합 한 후 솔더볼이 접합된 상부 기판과 하부 기판을 접합 하여 시편을 제작하였다. 접합된 시편들은 $150^{\circ}C$에서 0~800시간 열처리를 실시하였고, 열처리를 하면서 각각 $3{\times}10^2A/cm^2,\;5{\times}10^3A/cm^2$의 전류를 인가하였다. 시편들을 전단 시험기를 이용하여 솔더볼의 기계적 특성 평가를 하였으며, 계면 반응을 관찰하였다.

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Experimental colonization of Culicoides arakawae in laboratory (Culicoides arakawae의 실험실내 colonization)

  • Choi, sang-ho;Joo, Hoo-don;Wee, Sung-hwan;Kim, Ki-seok;Park, Keun-sik
    • Korean Journal of Veterinary Research
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    • v.33 no.3
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    • pp.471-478
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    • 1993
  • Culicoides arakawae is a kind of the main blood sucking insects of domestic fowls and serves as a vector of Leukocytozoom caulleryi, the causative protozoon of chicken leukocytozoonosis. In this study, the complete life history of C arakawae was cycled by laboratory colonization. Adult midges were collected from various poultry farm by light trap. The laboratory colonization was performed under the conditions of constant temperature of $25{\pm}1^{\circ}C$ and relative humidity of 80% or above. The hatched larvae were cultured in larval medium consisted of rice field mud and activated charcoal powder. The surface of medium was continuously flowed with biologically conditioned water. The fine powder meal composed of pellet feed for mice and equal mount of yeast was supplied for feeding larvae at every 72 hours. The life cycle completed at $25^{\circ}C$ in 35~35 days ; the period of preoviposition, egg. larval and pupal stage was 2~3, 3~4, 28~30 and 3 days, respectively. The measurements of the eggs, the lst instar larvae, the 4th instar larvae and pupae was $36.28{\mu}m{\pm}1.95$, $13.58{\mu}m{\pm}0.72$, $4000{\mu}m{\pm}1.47$ and $219.95{\mu}m{\pm}6.25$ in $mean{\pm}S.D.$, respectively. In order to confirm experimental colonization of C arakawae in laboratory, the colonized adult midges were allowed to suck blood from chicken infected with L caulleryi. The oocysts and sporozoites could be identified in midguts and salivary grands of engorged midges at 72 hours after blood sucking.

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Diethylnitrosamine-induced hepatic tumorigenesis in rats 3. Electron microscopic observation of liver tissue (Diethylnitrosamine을 투여한 rat 간장의 tumorigenesis에 관하여 3. 간장조직의 전자현미경적 관찰)

  • Kwak, Soo-dong;Kim, Chong-sup;Koh, Phil-ok;Yang, Je-hoon;Seo, Deuk-lok
    • Korean Journal of Veterinary Research
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    • v.39 no.6
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    • pp.1057-1065
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    • 1999
  • The study was designated to investigate the electron microscopic findings following diethylnitrosamine (DEN) treatment in rats. Forty four male (Srague Dawley) rats were continuously given water containing 0.01% DEN for 13 weeks and livers of five rats with more tumor lesions at 16 and 17 weeks after initial treatment were used as EM materials. In transmission electron microscopic findings, most small-sized hepatocytes were active cells containing large mount of organelles, but light (pale staining) hepatocytes among small-sized hepatocytes were injured cells containg disorganized organelles. Tumor cells among small-sized hepatocytes were irregularly arranged and have pleomorphic nuclei containing electron dense chromatin but the organelles in cytoplasm were swelled. Large-sized hepatocytes were active cells with condensed chromatin but the cytoplasm of these cells were pale due to be injured and dilated organelles. Dark hepatocytes were apoptotic cells with homogenous pyknotic nuclei and cytoplasm, and the cytoplasm of these cells contained dilated smooth endoplasmic reticulum (sER) but these sER were non-vesiculated. Cholangiocarninoma cells were crowded and were pale by far less number of organelles in cytoplasm and nuclei. In scanning electron microscopic findings, the lumens of portal veins, bile canaliculi, bile ductules, bile ducts and sinusoids were dilated and have irregular folded inner surface by protruded parenchyma.

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