• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.89-93
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• 2020

Complex warpage behavior of the electronic packages causes internal stress so many kinds of mechanical failure occur such as delamination or crack. Efforts to predict the warpage behavior accurately in order to prevent the decrease in yield have been approached from various aspects. For warpage prediction, silicon is generally treated as a homogeneous material, therefore it is described as showing no warpage behavior due to thermal loading. However, it was reported that warpage is actually caused by residual stress accumulated during grinding and polishing in order to make silicon wafer thinner, which make silicon wafer inhomogeneous through thickness direction. In this paper, warpage behavior of the single-side polished wafer at solder reflow temperature, the highest temperature in packaging processes, was measured using 3D digital image correlation (DIC) method. Mechanism was verified by measuring coefficient of thermal expansion (CTE) of both mirror-polished surface and rough surface.

• Journal of the Korean Society for Nondestructive Testing
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• v.30 no.5
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• pp.437-443
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• 2010

In recent years, as nano scale structured thin film technology has emerged in various fields such as the materials, biomedical and acoustic sciences, the quantitative nondestructive adhesion evaluation of thin film interfaces using ultra high frequency scanning acoustic microscopy(SAM) has become an important issue in terms of the longevity and durability of thin film devices. In this study, an effective technique for investigating the interfaces of nano scale structured thin film systems is described, based on the focusing of ultrasonic waves, the generation of leaky surface acoustic waves(LSAWs), V(z) curve simulation and ultra high frequency acoustical imaging_ Computer simulations of the V(z) curve were performed to estimate the sensitivity of detection of micro flaws(i.e., delamination) in a thin film system. Finally, experiments were conducted to confirm that a SAM system operating at a frequency of 1 GHz can be useful to visualize the micro flaws in nano structured thin film systems.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.523-524
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• 2007

This paper discusses the planarization process of thick copper film structure used for power supply device. Chemical mechanical polishing(CMP) has been used to remove a metal film and obtain a surface planarization which is essential for the semiconductor devices. For the thick metal removal, however, the long process time and other problems such as dishing, delamination and metal layer peeling are being issued, Compared to the traditional CMP process, Electro-chemical mechanical planarization(ECMP) is suggested to solve these problems. The two-step process composed of the ECMP and the conventional CMP is used for this experiment. The first step is the removal of several tens ${\mu}m$ of bulk copper on patterned wafer with ECMP process. The second step is the removal of residual copper layer aimed at a surface planarization. For more objective comparison, the traditional CMP was also performed. As an experimental result, total process time and process defects are extremely reduced by the two-step process.

• Tribology and Lubricants
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• v.34 no.6
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• pp.241-246
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• 2018

This research addresses the improvement of tribo-systems, specifically regarding the reduction of friction and wear through tribo-coupling between tetrahedral amorphous carbon (ta-C) with different types of counterpart materials, namely bearing steel (SUJ2), tungsten carbide (WC), stainless steel (SUS304), and alumina ($Al_2O_3$). A second variable in this project is the utilization of different values of duct bias voltage in the deposition of the ta-C coating - 0, 5, 10, 15, and 20 V. The results of this research are expected to determine the optimum duct bias and best counter materials associated with ta-C to produce the lowest friction and wear. Results obtained reveal that the tribo-couple between the ta-C coating and SUJ2 balls produces the lowest friction coefficient and wear rate. In terms of duct bias changes, deposition using 5 V produces the most optimum tribological behavior with lowest friction and wear on the tribo-system. In contrast, the tribo-couple between ta-C with a WC ball causes penetration through the coating surface layer and hence high surface delamination. This study demonstrates that the most effective ta-C coating duct bias is 5 V associated with SUJ2 counter material to produce the lowest friction and wear.

• Tribology and Lubricants
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• v.37 no.6
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• pp.240-245
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• 2021

Ceramic coatings with high hardness and excellent chemical stability have been successfully applied to various machine elements, tools, and implants. However, in the case of monolayer coating on soft substrates, a high-stress concentration at the interface between the coating and the substrate causes delamination of the coating layer. Recently, to overcome this problem, multilayer coatings with a metal layer with a low modulus of elasticity added between the ceramic and the substrate have been widely applied. This study presents the third part of a recent study and focuses on the effect of the number of coating layers on the Brinell hardness of multilayered coating with TiN/Ti, following the two previous studies on a new Brinell hardness test method for a coated surface and on the influence of substrate and coating thickness. Indentation analyses are performed using finite element analysis software, von Mises stress and equivalent plastic strain distributions, load-displacement curves, and residual indentation shapes are presented. The number of TiN/Ti layers considerably affect the stress distributions and indentation shapes. Moreover, the greater the number of TiN/Ti layers, the higher is the Brinell hardness. The stress and plastic strain distributions confirm that the multilayer coatings improve the wear resistance. The results are expected to be used to design and evaluate various coating systems, and additional study is required.

• Tribology and Lubricants
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• v.39 no.1
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• pp.8-12
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• 2023

This study presents a molecular simulation of adhesion control between carbon nanotube (CNT) and Ag thin film deposited on silicon substrate. Rough and flat Ag thin film models were prepared to investigate the effect of surface roughness on adhesion force. Heat treatment was applied to the models to modify the adhesion characteristics of the Ag/CNT interface based on thermal wetting. Simulation results showed that the heat treatment altered the Ag thin film morphology by thermal wetting, causing an increase in contact area of Ag/CNT interface and the adhesion force for both the flat and rough models changed. Despite the increase in contact area, the adhesion force of flat Ag/CNT interface decreased after the heat treatment because of plastic deformation of the Ag thin film. The result suggests that internal stress of the CNT induced by the substrate deformation contributes in reduction of adhesion. Contrarily, heat treatment to the rough model increases adhesion force because of the expanded contact area. The contact area is speculated to be more influential to the adhesion force rather than the internal stress of the CNT on the rough Ag thin film, because the CNT on the rough model contains internal stress regardless of the heat treatment. Therefore, as demonstrated by simulation results, the heat treatment can prevent delamination or wear of CNT coating on a rough metallic substrate by thermal wetting phenomena.

• Journal of Advanced Navigation Technology
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• v.28 no.4
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• pp.544-551
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• 2024

In this study, the electrochemical polarization data required for the simulation of the plating process, simulation of plating conditions, and characterization of the plating layer were discussed. The electrochemical polarization data obtained by potentiodynamic polarization tests and potentiostat analysis of Ni and Cu were used to observe changes in the overvoltage distribution with the flow conditions of the plating solution. In the simulation of plating conditions, the current density distribution and plating thickness distribution were evaluated under different variables to analyze the influence of the location and number of contacts on the rack pins on the plating quality. Simulation results under variables such as anode geometry, interpole distance, auxiliary anode placement, and variation of substrate spacing were used to explore ways to improve plating thickness deviation. Additionally, plating layer characterization analyzed the thickness, adhesion, and delamination of the plating layer with and without buffer layer formation. The simulation results can be utilized as important basic data for improving the efficiency and quality of the plating process.

• Journal of the Korea Concrete Institute
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• v.20 no.3
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• pp.283-290
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• 2008

The repair technique using surface impregnation of reactive compound is so effective for deteriorated concrete structures that many researches are recently focused on these works. Particularly, inorganic impregnant is regarded as ecofriendly material because there is no air-pollution during manufacturing process as well as field coating works. Furthermore, The delamination between old concrete and impregnated surface does not occur, resulting from different material characteristics. In order to evaluate the durability performance of surface-impregnated concrete, durability evaluation through the long-term exposure tests is significant, however, experiments are usually limited to the temporary and qualitative laboratorial scope. In this study, durability characteristics for inorganic and organic/inorganic impregnated concrete specimens are evaluated through longterm chloride exposure test. The specimens with 21MPa and 34MPa strength have been prepared and exposed to chloride attack in the atmospheric, tidal, and submerged conditions. Evaluation for compressive strength, chloride penetration, and electrical potential (half cell potential) for steel corrosion are performed for the specimens exposed for 2 years. From the results, no distinct strength gaining is observed but the resistance to chloride penetration and steel corrosion is evaluated to be improved through surface impregnation. The more improved resistance to chloride attack is measured in the inorganic impregnated concrete and the results from atmospheric condition show more improved resistance to chloride attack than those from submerged and tidal condition.

• Composites Research
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• v.18 no.1
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• pp.45-54
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• 2005

The delamination in the filament-wound composite flywheel rotor often lowers the performance of the flywheel energy storage system. A conventional ring type hub usually causes tensile stresses on the inner surface of the composite rotor, resulting in lowering the maximum rotational speed of the rotor. In this work, the stress and strain distributions within a hybrid composite rotor were derived from the two-dimensional governing equation with the specified boundary conditions, and an optimum pressure at the inner surface of the rotor was proposed to minimize the strength ratio and maximize the storage energy. A split type hub was introduced to apply the calculated optimum pressure at the inner surface, and a spin test was performed up to 40,000 rpm to demonstrate the performance of the split type hub with radial and circumferential strains measured using a wireless telemetry system. From the analysis and the test, it was found that the split type hub successfully generates a compressive pressure on the inner surface of the rotor, which can enhance the performance of the composite rotor by lowering the strength ratio within the rotor.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.19-23
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• 2015

In this study, two types of Au/TiW bump samples were fabricated by the electroplating process onto Al/Si and SiN/Si wafers for the COG (Chip On Glass) packaging. TiW was used as the UBM (Under Bump Metallurgy) material of the Au bump and it was deposited by a sputtering method under the sputtering powers ranges from 500 to 5000 Watt. We investigated the delamination phenomenas for the prepared samples as a function of the input sputtering powers. The stable interfacial adhesion condition was found to be 1500 Watt in sputtering power. In addition, the SAICAS (Surface And Interfacial Cutting Analysis System) measurement was used to find the adhesion strength of Au bumps for the prepared samples. TiW UBM films were deposited at the 1500 Watt sputtering power. As a results, there was a similar adhesion strengths between TiW/Au interfacial films on Al/Si and SiN/Si wafers. However, the adhesion strength of TiW UBM sputtering films on Al and SiN under films were 2.2 times differences, indicating 0.475 kN/m for Al/Si wafer and 0.093 kN/m for SiN/Si wafer, respectively.