Thermal Stability of the Interface between TaN Deposited by MOCVD and Electroless-plated Cu Film (MOCVD 방법으로 증착된 TaN와 무전해도금된 Cu박막 계면의 열적 안정성 연구)
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- Journal of the Korean Institute of Electrical and Electronic Material Engineers
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- 제11권12호
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- pp.1091-1098
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- 1998