• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.22 no.4
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• pp.35-40
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• 2022

This paper proposes an antenna that is located outside the PCB substrate of an electronic product to enable wireless communication in the ISM band. The PCB designed the T-shaped OPEN-STUB power supply line to be miniaturized so that it does not interfere with parts or interfere with design. The characteristics of the antenna were confirmed in the 2.4GHz and 5.8GHz bands using a T-shaped stub feeder and a spiral structure. The size of the antenna is 5mm in width × 6.5mm in length, and the thickness of the PCB is 1.2T. As a result of measurement of the manufactured antenna, it was possible to obtain a return loss of -10dB or more at 2.4GHz and 5.8GHz. In the E-plane, the gain was -4.45 dBi, and in the H-plane, the gain was -1.05 dBi. Therefore, the proposed small antenna for wireless communication showed excellent performance.

• Journal of IKEEE
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• v.27 no.1
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• pp.19-24
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• 2023

Since silicon having a band gap energy of about 1.12 eV are limited to a maximum operating temperature of less than 250 ℃, the sample with MIS structure based on the SiC substrate of wide-band gap energy was manufactured and the hydrogen response characteristics at high temperatures were investigated. The dielectric layer applied here is a tantalum oxide layer that is highly permeable to hydrogen gas and shows stability at high temperatures. It was formed by RTO at a temperature of 900 ℃ with tantalum. The thickness, depth profiles, and leakage current of the tantalum oxide layer were analyzed through TEM, SIMS, and leakage current characteristics. For the hydrogen gas response characteristics, the capacitance change characteristics were investigated in the temperature range from room temperature to 400 ℃ for hydrogen gas concentrations from 0 to 2,000 ppm. As a result, it was confirmed that the sample exhibited excellent sensitivity and a response time of about 60 seconds.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.29 no.5A
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• pp.503-510
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• 2009

Latex modified concrete (LMC) is a successful polymer-portland cement concretes, which have been developed and used for many years, in overlaying bridge decks and resurfacing industrial floors. The excellent bond strength to substrate, easy application and high resistance to impact, abrasion, wear, aggressive chemicals and freeze-thaw deterioration have made this material used widely. The objective of this study was to determine experimentally the load-deflection response and ultimate strength of reinforced RC beams. The cracking patterns and the mode of failure were observed. Because of excellent bond strength and repairing effects, the RC beams repaired by LMC at compression or tension zone showed over 100% recovery from damaged structures. The RC beams overlaid by LMC showed significant improvement at load carrying capacity as overlay thickness increases. However, the beams repaired of tension zone without shear stirrups almost showed no strengthen effect, and indicated an interfacial failures. The interfacial behavior was estimated by numerical method adopting the concept of shear flow.

• Journal of Convergence Korean Medicine
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• v.2 no.1
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• pp.5-12
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• 2021

Objectives: The purpose of this study is to fabricate an ultra-fine ginsenoside particle atomizer that can provide a new treatment method by delivering ginsenoside components that have a therapeutic effect on respiratory diseases directly to the lungs. Methods: We fabricated the AAO vibrating mesh by using the micromachining process. The starting substrate of an AAO wafer has a 350nm pore diameter with 50㎛ thickness. A photomask having several 5㎛ opening holes with a 100㎛ pitch was used to separate each nanopore nozzle. The photoresist structure was optimized to pattern the nozzle area during the lift-off process precisely. The commercial vibrating mesh was removed from OMRON's NE-U100 product, and the fabricated AAO vibrating mesh was installed. A diluted sample of 20mL with 30% red ginseng concentrate was prepared to atomize from the device. Results: As a result of liquid chromatography analysis before spraying the ginsenoside solution, ginsenoside components such as 20S-Rg3, 20R-Rg3, and Rg5 were detected. After spraying through the AAO vibrating mesh, ginsenosides of the same component could be detected. Conclusion: A nutrient solution containing ginsenosides was successfully sprayed through the AAO vibrating mesh with 350 nm selective pores. In particular, during the atomizing experiment of ginsenoside drug solution having excellent efficacy in respiratory diseases, it was confirmed that atomizing through the AAO vibrating mesh while maintaining most of the active ingredients was carried out.

• Journal of Advanced Navigation Technology
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• v.26 no.6
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• pp.516-521
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• 2022

In this paper, a compact 4-bit chipless RFID(radio frequency identification) tag using a modified ELC(electric field-coupled inductive-capacitive) resonator and multiple slot resonators is proposed. The modified ELC resonator uses an interdigital-capacitor structure in the conventional ELC resonator to lower the resonance peak frequency of the RCS. The multiple slot resonators are designed by etching three slots with different lengths into an inverted U-shaped conductor. The resonant peak frequency of the RCS for the modified ELC resonator is 3.216 GHz, whereas those of the multiple slot resonators are set at 4.122 GHz, 4.64 GHz, and 5.304 GHz, respectively. The proposed compact four-bit tag is fabricated on an RF-301 substrate with dimensions of 50 mm×20 mm and a thickness of 0.8 mm. Experiment results show that the resonant peak frequencies of the fabricated four-bit chipless RFID tag are 3.285 GHz, 4.09 GHz, 4.63 GHz, and 5.31 GHz, respectively, which is similar to the simulation results with errors in the range between 0.78% and 2.16%.

• Journal of Advanced Navigation Technology
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• v.25 no.6
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• pp.530-535
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• 2021

In this paper, the design method for a chipless RFID tag using ELC resonators is proposed. A four-bit chipless RFID tag is designed in a two by two array configuration using three ELC resonators with different resonant peak frequencies and one compact IDC resonator. The resonant peak frequency of the bistatic RCS for the IDC resonator is 3.125 GHz, whereas those of the three ELC resonators are adjusted to be at 4.225 GHz, 4.825 GHz, and 5.240 GHz, respectively, by using the gap between the capacitor-shaped strips in the ELC resonator. The spacing between the resonators is 1 mm. Proposed four-bit tag is fabricated on an RF-301 substrate with dimensions of 50 mm×20 mm and a thickness of 0.8 mm. It is observed from experiment results that the resonant peak frequencies of the fabricated four-bit chipless RFID tag are 3.290 GHz, 4.295 GHz, 4.835 GHz, and 5.230 GHz, respectively, which is similar to the simulation results with errors in the range between -2.3% and 0.2%.

• Journal of Advanced Navigation Technology
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• v.27 no.6
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• pp.815-820
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• 2023

In this paper, the design method of a miniaturized chipless RFID tag using a modified bent H-shaped slot was proposed. The proposed modified bent H-shaped slot was appended on the rectangular conductor plate printed on one side of a 20 mm × 50 mm FR4 substrate with a thickness of 0.8 mm. The resonant dip frequency of the bistatic RCS for the proposed modified bent H-shaped slot was compared with the cases when the H-shaped, U-shaped slot, and bent H-shaped slots were added, respectively, on the conductor plate. The simulated resonant dip frequencies for H-shaped, U-shaped, and bent H-shaped slots were 5.907 GHz, 4.918 GHz, and 4.364 GHz, respectively. When the proposed modified bent H-shaped slot was added, the resonant dip frequency was decreased to 3.741 GHz, and, therefore, the slot length was reduced by 36.7% compared to the H-shaped slot case. Experiment results show that the resonant dip frequency of the fabricated modified bent H-shaped slot was 3.9 GHz.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.34 no.2
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• pp.55-60
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• 2024

Two-dimensional (2D) RuO₂ nanosheets with nanometer thickness were synthesized using a chemical exfoliation method. The synthesized 2D-RuO₂ was hybridized with Ag-nanowire (NW), which is attracting attention as a next-generation transparent electrode material. After coating Ag-NW on the substrate, 2D-RuO₂ was subsequently coated on the Ag-NW. Although there was a decrease in optical transmittance, the hybridization of 2D-RuO₂ confirmed the effect of reducing sheet resistance. Furthermore, the flexibility of the fabricated transparent electrodes was also studied. It was confirmed by the change in sheet resistance after bending. The additional coating of 2D-RuO₂ improved the flexibility of the transparent electrodes.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.1-10
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• 2018

Recently, there has been rapid development in the field of flexible electronic devices, such as organic light emitting diodes (OLEDs), organic solar cells and flexible sensors. Encapsulation process is added to protect the flexible electronic devices from exposure to oxygen and moisture in the air. Using numerical simulation, we investigated the effects of the encapsulation layer on mechanical stability of the silicon chip, especially the fracture performance of center crack in multi-layer package for various loading condition. The multi-layer package is categorized in two type - a wide chip model in which the chip has a large width and encapsulation layer covers only the chip, and a narrow chip model in which the chip covers both the substrate and the chip with smaller width than the substrate. In the wide chip model where the external load acts directly on the chip, the encapsulation layer with high stiffness enhanced the crack resistance of the film chip as the thickness of the encapsulation layer increased regardless of loading conditions. In contrast, the encapsulation layer with high stiffness reduced the crack resistance of the film chip in the narrow chip model for the case of external tensile strain loading. This is because the external load is transferred to the chip through the encapsulation layer and the small load acts on the chip for the weak encapsulation layer in the narrow chip model. When the bending moment acts on the narrow model, thin encapsulation layer and thick encapsulation layer show the opposite results since the neutral axis is moving toward the chip with a crack and load acting on chip decreases consequently as the thickness of encapsulation layer increases. The present study is expected to provide practical design guidance to enhance the durability and fracture performance of the silicon chip in the multilayer package with encapsulation layer.