• 한국재료학회지
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• 제4권1호
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• pp.31-36
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• 1994

Mn-Zn ferrite를 가공하여 VCR헤드의 제조과정에서 비자성체 gap용 $SiO_{2}$증착층과 유리와의 접합시 유리내에 기포 형태의 결함이 발생하는 경우가 있다. 기판의 조도나 $SiO_{2}$의 증착속도의 영향을 분석한 결과, 기포의 생성원인이 $SiO_{2}$ 증착층과 접합유리의 융착시 계면에 존재하는 요철의 불완전한 충진에 의한 것으로 나타났다. 따라서 이러한 기포생성을 억제시키는 위해서는 기판을 최대한 경면 연마시켜 표면조도를 작게하고 $SiO_{2}$증착속도를 조절함으로써 $SiO_{2}$증착층의 표면조도를 작게하여 유리 융착시 계변의 요철 크기를 작게해야 한다. 기판을 0.05$\mu\textrm{m}$알루미나 분말로 경면연마시키고, 10% Osub 2/분압을 갖는 Ar plasma상태하로 조절된 증착속도로 즈악된 $SiO_{2}$증착층과 접합유리의 융착시 기포가 전혀 발생치 않았다.

• 마이크로전자및패키징학회지
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• 제14권1호
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• pp.27-31
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• 2007

휨성 유기박막트랜지스터(organic thin film transistor, OTFT)를 제작하기 위하여 게이트 절연막으로 PVP(poly-4-vinylphenol) 유기막을 이용하여 MIM (metal-insulator-metal) 구조의 캐패시터 소자를 제작하였다. 유기 절연층의 형성은 Al/PES (polyethersulfone) 기판과 ITO/Glass 기판 위에 PVP를 용질로, PGMEA(propylene glycol monomethyl ether acetate)를 용매로 사용하였다 또한 열경화성 수지인 poly(melamine-co-(ormaldehyde)를 사용하여 cross-linked PVP 절연막을 합성하여 스핀코팅법으로 소자를 형성하였다. 제작된 소자에 대해 절연막 두께와 기판 종류에 따른 전기적 특성을 조사한 결과 Al/PES 기판을 사용하였을때 누설전류는 1.3 nA로 ITO/glass 기판을 사용했을때의 27.5 nA보다 크게 개선되었다. 또한 제작된 모든 캐패시터 소자의 정전용량은 $1.0{\sim}1.2nF/cm^2$ 범위로 나타났으며 계산값과 매우 유사한 결과를 얻을 수 있었다.

• 대한금속재료학회지
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• 제50권2호
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• pp.159-163
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• 2012

A TCO-less ruthenium (Ru) catalytic layer on glass substrate instead of conventional Ru/TCO/ glass substrate was assessed as counter electrode (CE) material in dye sensitized solar cells (DSSCs) by examining the effect of the Ru thickness on the DSSC performance. Ru films with different thicknesses (34, 46, 69, and 90 nm) were deposited by atomic layer deposition (ALD) on glass substrates to replace both existing catalyst and electrode layer. In order to make our comparison, we also prepared an Ru catalytic layer by a similar method on FTO/glass substrate. Finally, we prepared the $0.45cm^2$ DSSC device the properties of the DSSCs were examined by cyclic voltammetry (CV), impedance spectroscopy (EIS), and current-voltage (I-V) method. CV measurements revealed an increase in catalytic activity with increasing film thickness. The charge transfer resistance at the interface between the electrolyte and Rudecreased with increasing Ru thickness. I-V results showed that the energy conversion efficiency increased up to 1.96%. Our results imply that TCO-less Ru/glass might perform as both catalyst and electrode layer when it is used in counter electrodes in DSSCs.

• 한국세라믹학회지
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• 제51권5호
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• pp.399-405
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• 2014

Porous alumina with different porosities, 5.2 - 47.5%, were coated with cover-glass having a thickness of $160{\mu}m$, using epoxy adhesive. We investigated the effect of the porosity of the substrate layer on the crack initiation load, and the size of cracks propagated in the coating layer. Hertzian indentations were used to evaluate the damage behavior under a constrained loading condition. Typically, two types of cracks, ring cracks and radial cracks, were observed on the surface of the glass/porous alumina structure. Indentation stress-strain curves, crack initiation loads, crack propagation sizes, and flexural strengths were investigated as a function of porosities. The results indicated that a porosity of less than 30% and a higher substrate elastic modulus were beneficial at suppressing cracks occurrence and propagation. We expect lightweight mechanical components with high strength can be successfully fabricated by coating and controlling porosities in the substrate layer.

• 마이크로전자및패키징학회지
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• 제7권2호
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• pp.47-53
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• 2000

TSM(Top Surface Metallurgy)이 증착된 유리기판의 Pb-free 솔더에 대한 젖음성을 무플럭스하에서 wetting balance법으로 평가하였다. TSM 층의 젖음성을 단면 증착시편의 wetting balance법으로부터 도출된 새로운 젖음성 지수들로 평가할 수 있었다. 유리기판의 TSM층으로는, Cu를 젖음층으로 하고 Au를 Cu의 산화 방지 층으로 사용하는 경우가 Au 자체를 젖음층으로 사용하는 경우보다 우수하였다. SnSb 솔더는 SnAg, SnBi, SnIn 솔더보다 TSM층에 대한 젖음특성이 우수하였다. 유리기판에 단면 증착된 TSM과 Pb-free솔더의 접촉각을 $F_{s}$와 기울어짐각을 측정하고, 메니스커스의 정적 상태에서 힘의 평형으로부터 유도된 식을 이용하여 계산할 수 있었다.

• 한국전기전자재료학회논문지
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• 제30권3호
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• pp.170-174
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• 2017

In 3 electrode reflective displays using a plastic substrate, unstable packaging induces particle clumping and optical degradation due to external air inflow and electronic ink evaporation. In this work, we fabricate 3 electrode electronic paper using glass wafer, ITO/plastic film, and ITO/glass/gas barrier film as an upper substrate after injecting electronic ink onto the lower substrate. Then, we studied its properties. After operating under stress conditions for 336 hours at $85^{\circ}C$ and 75% humidity, the reflectivity of driven e-paper panels with white color was 25.5% for the panels using glass wafer, 22.5% for plastic film including a gas barrier layer, and 16% for plastic film only. From these optical properties, we conclude that gas barrier film improves upper film isolation as a desirable packaging method.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 추계학술대회 논문집
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• pp.53-56
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• 1998

Electroluminescent(EL) devices based on organic materials have been of great interest due to their possible applications for large-area flat-panel displays, where they are attractive because of their capability of multicolor emission, and low operation voltage. In this study, glass substrate/ITO/Eu(TTA)$_3$(Phen)/Al(A), glass substrate/ITO/TPD/Eu(TTA)$_3$(p-hen)/Al(B) and glass substrate/ITO/TPD/Eu(TTA)$_3$(phen)/AlQ$_3$/Al(C) structures were fabricated by vacuum evaporation method. where aromatic diamine(TPD) was used as a hole transporting material, Eu(TTA)$_3$(phen) as an emitting material. and tris(8-hydroxyquinoline)Aluminum(AlQ$_3$) as an electron transporting layer. Electroluminescent(EL) and I-V characteristics of Eu(TTA)$_3$(Phen) with a various thickness were investigated. This structure shows the red EL spectrum, which is almost the same as the PL spectrum of Eu(TTA)$_3$(phen). I-V characteristics of this structure show that turn-on voltage was 9V and current density was 0.01A/$\textrm{cm}^2$ at a dc operation voltage of 9V. Electrical transporting phenomena of these structures was explained using the trapped- charge-limited current model with I-V characteristics.

• Journal of Electrochemical Science and Technology
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• 제2권2호
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• pp.68-75
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• 2011

In this review, we have investigated the effect of $TiO_2$-based blocking layers (t-BLs), deposited on a transparent conductive oxide (TCO)-coated glass substrate, on the photovoltaic performance of dye-sensitized solar cells (DSSCs). The t-BL was deposited using spin-coating or sputtering technique, and its thicknesses were varied to study the influence of the thin $TiO_2$ layer in between transparent conducting glass and nanocrystalline $TiO_2$ (nc-$TiO_2$). The DSSC with the t-BL showed the improved adhesion and the suppressed charge recombination at a TCO glass substrate than those without the t-BL, which led to the higher conversion efficiency.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1640-1644
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• 2006

The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

• 대한기계학회논문집A
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• 제24권9호
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• pp.2371-2380
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• 2000

In this paper, we developed the proximity exposure system with the vertical structure of glass and mask stage to minimize the mask's warp caused by the pull of gravity. This system, which canirradiate the ultra violet through 1440 H 850 $\textrm{mm}^2$ and 1330X 1015 $\textrm{mm}^2$ exposure area, has the followingcharacteristics. The glass stage can be inclined by 80 degrees at vertical structure to load substrate withsafety on it. When the glass stage is the vertical state, the gap control, alignment control and exposureof ultra violet are executed. So, it enhances the pattern uniformity by minimizing the mask's warp. Theglass stage can also control the gap between the mask and the substrate by the coarse and fine motioncontrol. The mask stage can adjust the posture of photomask to the position of substrate by imageprecessing method. The galss stage for the gap control and the mask stage for the alignment aredesigned independently for each function.