• Title/Summary/Keyword: Sticking Condition

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Nucleation and Growth Mechanism of Sticking Phenomenon in Ferritic Stainless Steel (페라이트계 스테인레스강의 STICKING 발생 및 성장기구)

  • Jin, W.;Choi, J.Y.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 1999.08a
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    • pp.373-382
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    • 1999
  • Nucleation and growth process of sticking particle in ferritic stainless steels was investigated using a two disk type hot rolling simulator. The sticking behavior was strongly dependent on the surface roughness of a high speed steel roll(HSS) and the oxidation resistance of the ferritic stainless steels. A hot rolling condition with the lower oxidation resistance of the stainless steel and the higher surface roughness of HSS roll was more sensitive to sticking occurrence. It was also illucidated that the initial sticking particles were nucleated at the scratches formed on the roll surface and were served as the sticking growth sites. As rolling proceeded, the sticking particles grew sites. As rolling proceeded, the sticking particles grew by the process that the previous sticking particles provided the sticking growth sites.

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Role of Redeposition of Sputtered Mg Particles in Image Sticking

  • Nikishin, Nikolay;Manakhov, Anton;Kim, Yoon-Kyung;Hur, Min;Heo, Eun-Gi
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.381-383
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    • 2008
  • One of important factors responsible for image sticking in AC PDP is a sputtering of MgO layer under ionic bombardment. Sputtered Mg particles can migrate to the neighbor cells, where the migration makes a change of discharge condition. It leads to the local non-uniformity of a luminescence in the panel, resulting in the image sticking.

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Investigation of Adhesion Mechanism at the Metal-Organic Interface Modified by Plasma Part I

  • Sun, Yong-Bin
    • Journal of the Microelectronics and Packaging Society
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    • v.9 no.4
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    • pp.31-34
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    • 2002
  • For the mold die sticking mechanism, the major explanation is that the silica as a filler in EMC (epoxy molding compound) wears die surface to be roughened, which results in increase of adhesion strength. As the sticking behavior, however, showed strong dependency on the EMC models based on the experimental results from different semiconductor manufacturers, chemisorption or acid-base interaction is apt to be also functioning as major mechanisms. In this investigation, the plasma source ion implantation (PSII) using $O_2, N_2$, and $CF_4$ modifies sample surface to form a new dense layer and improve surface hardness, and change metal surface condition from hydrophilic to hydrophobic or vice versa. Through surface energy quantification by measuring contact angle and surface ion coupling state analysis by Auger, major governing mechanism for sticking issue was figured out to be a complex of mechanical and chemical factors.

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Characteristics of Image Sticking Observed During Background Display in AC-PDP (AC PDP의 배경광 잔상특성)

  • 류재화;임성현;김동현;김중균;이호준;박정후
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.53 no.2
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    • pp.91-96
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    • 2004
  • In darkroom condition, it was observed that a white picture pattern lasted several minutes leaves a recognizable trace in subsequent black background picture. Although this is not a serious problem for the most current public display or home TV applications, the image sticking should be minimized for future high quality multimedia display applications. In order to characterize this picture memory effect having relatively long time scale, spatially resolved luminance measurement and light waveform measurement have been performed. Pixels located at the outer boundary of white pattern previously displayed shows highest luminance. These cells also shows fastest ignition at the ramp up reset sequence. The luminance and ignition voltage differences between boundary cells and the other cells are increased with display duration and number of sustain-pulse. It is speculated that image sticking observed at the boundary cell is originated from the transport of charged particles and re-deposition of reactive species such as Mg, O provided from strong sustain discharge region.

Investigation of Adhesion Mechanism at the Metal-Organic Interface Modified by Plasma - Part I

  • Sun, Yong-Bin
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2002.11a
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    • pp.123-126
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    • 2002
  • For the mold die sticking mechanism, the major explanation is that EMC filler of silica wears die surface roughened, which results in increase of adhesion strength. As big differences in experimental results from semiconductor manufacturers are dependent on EMC models, however, chemisorptions or acid-base interaction is apt to be also functioning as major mechanisms. In this investigation, the plasma source ion implantation (PSII) using $O_2$, $N_2$, and $CF_4$ modifies sample surface to form a new dense layer and improve surface hardness, and change metal surface condition from hydrophilic to hydrophobic and vice versa. Through surface energy quantification by measuring contact angle and surface ion coupling state analysis by Auger, major governing mechanism for sticking issue was figured out to be a complex of mechanical and chemical factors.

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Sticking Characteristics in Bi2Sr2CanCun+1Ox Thin Films Fabricated by using the Evaporation Method to Improve the Sticking Ratio (부착율 개선을 위해 증발 법으로 제작한 Bi2Sr2CanCun+1Ox 박막의 부착 특성)

  • 천민우;박용필
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.11
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    • pp.1029-1034
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    • 2003
  • The Bi$_2$Sr$_2$Ca$_{n}$Cu$_{n+1}$ O$_{x}$, superconducting thin films arc fabricated by using the sputtering and evaporation method. Because we confirmed the sticking ratio of Bi element in the Bi$_2$Sr$_2$Ca$_{n}$Cu$_{n+1}$ O$_{x}$ superconducting thin film fabricated by using the sputtering method was much lower than the expected value, to get the enough number of the flakes of Bi, faraday cup was used to evaporate Bi clement. As a result of the fabrication, Bi 2201 and Bi 2212 single phases could be made by the optima of deposition condition. And we confirmed the sticking coefficient of Bi element was clearly related to the temperature change of the substrate and the generation of Bi22l2 phase

Hydrogen Reduction of NiO Particles in a Single-Stage Fluidized-Bed Reactor without Sticking

  • Oh, Chang-Sup;Kim, Hang Goo;Kim, Yong Ha
    • Korean Journal of Materials Research
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    • v.26 no.2
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    • pp.79-83
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    • 2016
  • A commercial NiO (green nickel oxide, 86 wt% Ni) powder was reduced using a batch-type fluidized-bed reactor in a temperature range of 500 to $600^{\circ}C$ and in a residence time range of 5 to 90 min. The reduction rate increased with increases in temperature; however, agglomeration and sintering (sticking) of Ni particles noticeably took place at high temperatures above $600^{\circ}C$. An increasing tendency toward sticking was also observed at long residence times. In order to reduce the oxygen content in the powder to a level below 1% without any sticking problems, which can lead to defluidization, proper temperature and residence time for a stable fluidized-bed operation should be established. In this study, these values were found to be $550^{\circ}C$ and 60 min, respectively. Another important condition is the specific gas consumption rate, i.e. the volume amount ($Nm^3$) of hydrogen gas used to reduce 1 ton of Green NiO ore. The optimum gas consumption rate was found to be $5,000Nm^3/ton$-NiO for the complete reduction. The Avrami model was applied to this study; experimental data are most closely fitted with an exponent (m) of $0.6{\pm}0.01$ and with an overall rate constant (k) in the range of 0.35~0.45, depending on the temperature.

Study About Measurement of Interfacial Bonding Strength of STS/Al Clad sheet by Blanking Process (블랭킹 공정을 이용한 STS/Al 클래드 판재의 계면 접합력 측정에 관한 연구)

  • Kim, T.H.;Lee, K.S.;Kim, J.H.;Moon, Y.H.;Lee, Y.S.;Yoon, E.Y.
    • Transactions of Materials Processing
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    • v.27 no.5
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    • pp.267-275
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    • 2018
  • The clad sheet material is produced by a roll-bonding process of one or more materials with different properties. Good formability of clad sheet material is an essential property in to deform a clad metal sheet into a part or component. Performance of the clad sheet material largely depends on interfacial bond strength between different materials. In this study, interfacial bond strength of STS/Al clad sheet was analyzed by varying experimental parameters using a blanking process. Experimental parameters are the punching speed, clearance, and stacking order of plate materials. In addition, blanking test results were compared with bond strengths measured by the T-peel test, that analyzes interface bonding strength of the standard clad sheet. The blanking process was analyzed by the finite element method under the sticking condition of interface of different materials, and experimental results and analysis results were compared.

The Production of Microcapsules containing Cinnamon and Aromatic, Antimicrobial Finishing(Part I) (계피정유를 함유한 마이크로캡슐의 제조 및 방향.항균가공(제1보))

  • 김혜림;송화순
    • Journal of the Korean Society of Clothing and Textiles
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    • v.25 no.3
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    • pp.569-576
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    • 2001
  • The purpose of this study is to develop multifunctional fibers by sticking cinnamon microcapsules on cotton knit. The prepolymer was made from urea-formaldehyde for usage of wall materials of microcapsules. The parameters for adoptable condition are 5000rpm of agitation speed, 1% of dispersions concentration according to the observation with SEM and particle analyzer. The Antimicrobial activity of cotton knit treated with capsule was increased greatly and maintained on the laundering cycle.

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A Study on the Piston Temperatures and Carbon Deposit Formation in LPG Fuelled Engine (LPGdusfy 엔진의 피스톤온도 및 카본디포짓 형성에 관한 연구)

  • 민병순;최재권;박찬준
    • Transactions of the Korean Society of Automotive Engineers
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    • v.6 no.2
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    • pp.100-106
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    • 1998
  • The wide open throttle performance and piston temperatures were measured by the change of fuel : gasoline and liquefied petroleum gas(LPG). Bench test method was developed and experimented to study the effect of temperature on the formation of carbon deposit. The bench test results were confirmed by measuring the piston temperature and observing the deposit production rate at an actual engine running condition. Results show that if the fuel of spark ignition engine is changed from gasoline to LPG, the output power decreases about 10% and the piston temperatures increase about 40~55$^{\circ}C$. In actual engine tests, because of this temperature increase, it was observed that the quantity of carbon deposit in the top ring groove increased in a big degree. Consuquently, it is known that the fing sticking may occur if the gasoline engine was rebuilt to LPG fuelled engine. Therefore, in order to preserve the durability of LPG fuelled engine, it is necessary to lower the piston temperature by hardware modificationor to reduce the carbon deposit by the improvement of engine oil.

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