• Title/Summary/Keyword: Step-curing

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Permeation Properties of Surface Modified Nanofiltration Membrane (표면 개질된 나노복합막의 투과 특성)

  • Tak Tae-Moon;Park Hyung-Kiu;Jang Gyung-Gug
    • Membrane Journal
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    • v.14 no.3
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    • pp.207-217
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    • 2004
  • In this study, we prepared nanofiltration membrane by applying the interfacial polymerization method as a way of manufacturing composite membranes. We have examined the effects of various preparation factors such as monomer concentration and composition, thermal curing condition, post treatment condition. In addition to preparation conditions, we also monitored the effects of operation conditions such as feed solution concentration and operation pressure on the permeation properties of the resulting nanofiltration membrane. We intended to increase the permeation rate of nanofiltration membrane by the enlargement of effective surface area using additives during interfacial polymerization step. With increasing the monomer concentration, membrane permeation rate are decreased with maintaining almost constant rejection. With respect to curing condition, with increasing the curing temperature both permeation rate and rejection are decreased. With increasing the ratio of MPD in amino monomer composition, permeation rate decreased drastically with high rejection. With increasing the feed solution concentration, both permeation rate and rejection decreased. Both permeation rates and rejection increased with increasing the operating pressure. Nanofiltration membrane have higher surface roughness with increasing additive concentration in the case of using MPD contained amine composition than using piperazine alone. Permeation rates are much lower than the nanofiltration membrane prepared by piperazine.

Preparation and Mechanical Properties of PMMA Panels (PMMA 판재의 제조 및 기계적 특성)

  • 길기승;김의식;김대수
    • Polymer(Korea)
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    • v.27 no.2
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    • pp.142-151
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    • 2003
  • PMMA panels are made by two fabrication methods; cell molding and belt molding processes. But these methods have disadvantages in productivity and cost. So plastic processing engineers are very interested in developing a new production method for PMU panels using plastic films as molds because the new method can reduce production cost of belt molding method as well as can improve productivity of cell molding method. To give a solution for developing such a new molding method, the effects of melthyl methacrylate compound composition and curing reaction condition on the processability and mechanical strength of PMMA panels were investigated in this study. Poly(vinyl acetate) film was used as molds in producing PMMA panels. To determine an MMA compound showing good processability and good mechanical properties after curing, ingredients and their compositions were optimized step by step. Acrylic acid, as a coupling agent and a modifier, played an important role in increasing mechanical strength of PMMA panels.

Effect of Die Attach Film Composition for 1 Step Cure Characteristics and Thermomechanical Properties (다이접착필름의 조성물이 1단계 경화특성과 열기계적 물성에 미치는 영향에 관한 연구)

  • Sung, Choonghyun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.21 no.12
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    • pp.261-267
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    • 2020
  • The demand for faster, lighter, and thinner portable electronic devices has brought about a change in semiconductor packaging technology. In response, a stacked chip-scale package(SCSP) is used widely in the assembly industry. One of the key materials for SCSP is a die-attach film (DAF). Excellent flowability is needed for DAF for successful die attachment without voids. For DAF with high flowability, two-step curing is often required to reduce a cure crack, but one-step curing is needed to reduce the processing time. In this study, DAF composition was categorized into three groups: cure (epoxy resins), soft (rubbers), hard (phenoxy resin, silica) component. The effect of the composition on a cure crack was examined when one-step curing was applied. The die-attach void and flowability were also assessed. The cure crack decreased as the amount of hard components decreased. Die-attach voids also decreased as the amount of hard components decreased. Moreover, the decrease in cure component became important when the amount of hard component was small. The flowability was evaluated using high-temperature storage modulus and bleed-out. A decrease in the amount of hard components was critical for the low storage modulus at 100℃. An increase in cure component and a decrease in hard component were important for the high bleed-out at 120℃(BL-120).

Antibacterial effect of self-etching adhesive systems on Streptococcus mutans

  • Kim, Seung-Ryong;Shin, Dong-Hoon
    • Restorative Dentistry and Endodontics
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    • v.39 no.1
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    • pp.32-38
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    • 2014
  • Objectives: In this study, we evaluated the antibacterial activity of self-etching adhesive systems against Streptococcus mutans using the agar diffusion method. Materials and Methods: Three 2-step systems, Clearfil SE Bond (SE, Kuraray), Contax (CT, DMG), and Unifil Bond (UnB, GC), and three 1-step systems, Easy Bond (EB, 3M ESPE), U-Bond (UB, Vericom), and All Bond SE (AB, BISCO) were used. 0.12% chlorhexidine (CHX, Bukwang) and 37% phosphoric acid gel (PA, Vericom) were used as positive controls. Results: The antibacterial activity of CHX and PA was stronger than that of the other groups, except SE. After light activation, the inhibition zone was reduced in the case of all 2-step systems except CT. However, all 1-step systems did not exhibit any inhibition zone upon the light activation. Conclusions: SE may be better than CT or UnB among the 2-step systems with respect to antibacterial activity, however, 1-step systems do not exhibit any antibacterial activity after light curing.

The Characterization of V Based Self-Forming Barriers on Low-k Samples with or Without UV Curing Treatment

  • Park, Jae-Hyeong;Han, Dong-Seok;Gang, Yu-Jin;Sin, So-Ra;Park, Jong-Wan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.214.2-214.2
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    • 2013
  • Device performance for the 45 and 32 nm node CMOS technology requires the integration of ultralow-k materials. To lower the dielectric constant for PECVD and spin-on materials, partial replacement of the solid network with air (k=1.01) appears to be more intuitive and direct option. This can be achieved introducting of second "labile" phase during depositoin that is removed during a subsequent UV curing and annealing step. Besides, with shrinking line dimensions the resistivity of barrier films cannot meet the International Technology Roadmap for Semiconductors (ITRS) requirements. To solve this issue self-forming diffusion barriers have drawn attention for great potential technique in meeting all ITRS requirments. In this present work, we report a Cu-V alloy as a materials for the self-forming barrier process. And we investigated diffusion barrier properties of self-formed layer on low-k dielectrics with or without UV curing treatment. Cu alloy films were directly deposited onto low-k dielectrics by co-sputtering, followed by annealing at various temperatures. X-ray diffraction revealed Cu (111), Cu (200) and Cu (220) peaks for both of Cu alloys. The self-formed layers were investigated by transmission electron microscopy. In order to compare barrier properties between V-based interlayer on low-k dielectric with UV curing and interlayer on low-k dielectric without UV curing, thermal stability was measured with various heat treatment temperature. X-ray photoelectron spectroscopy analysis showed that chemical compositions of self-formed layer. The compositions of the V based self-formed barriers after annealing were strongly dominated by the O concentration in the dielectric layers.

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Surface and Dielectric Properties of Oriental Lacquer Films Modified by UV-Curable Silicone Acrylate

  • Hong, Jin-Who;Kim, Hyun-Kyoung
    • Macromolecular Research
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    • v.14 no.6
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    • pp.617-623
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    • 2006
  • In order to achieve an oriental lacquer (OL) film with a thick consistency, UV-curable silicone acrylate (SA) was added to OL by a dual curing process. The addition of 5 wt% UV-curable SA to the OL fomulation enabled the preparation via a single drying step of a $77{\mu}m-thick$ film exhibiting excellent surface properties. FTIR-ATR was used to investigate the effect of UV-curable SA on the behavior of film formation during curing, and the relaxation behavior of the produced films was investigated by dielectric spectroscopy. Dielectric properties were measured in the frequency range $10^{-2}-10^5\;Hz$ at various temperatures between -100 and $200^{\circ}C$. The results demonstrated that OL modified by UV-curable SA has a higher glass transition temperature and stronger secondary relaxation at a lower temperature than the conventional OL system. The OL film modified with UV-curable SA was presumed to be harder at the surface and tougher than conventional OL film.

A STUDY ON THE EFFECT OF POLYMERIZATION SHRINKAGE OF SEVERAL COMPOSITE RESIN USING STRAIN GAUGE (스트레인 게이지를 이용한 수종 수복재의 중합수축 영향 평가)

  • Lee, In-Cheon;Kim, Jong-Soo;Yoo, Seung-Hoon
    • Journal of the korean academy of Pediatric Dentistry
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    • v.36 no.1
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    • pp.20-29
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    • 2009
  • This study was performed to evaluate the effect of the shrinkage stress induced by polymerization process of several light curing filling materials according to filling methods. High power light curing unit which has a plasma arc lamp was used and filling materials used were Filtek $Z-250^{(R)}$ composite resin, $Dyract^{(R)}$ AP compomer and $Tetric^{(R)}$ Flow flowable composite resin. Cavities were prepared on the permanent molars with width 3 mm, height 3 mm and depth 1.5 mm and the filling materials were filled with 1 step, 2 step layering technique and 3 step oblique filling methods. The results can be summarized as follows; 1. Strain values showed rapid increase from the start of light curing followed by gradual decrease afterwards with time. 2. Although the shrinkage stress value of $Z-250^{(R)}$ were shown to be relatively higher than $Dyract^{(R)}$ AP and $Tetric^{(R)}$ Flow, no statistically significant could be found between tested materials(p>0.05). 3. There were no statistically significant difference between 3 filling methods when using $Dyract^{(R)}$ AP and $Z-250^{(R)}$(p>0.05). 4. There were no statistically significant difference between shrinkage stress values obtained from samples prepared by different filling methods and materials(p>0.05).

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Shear strength behaviors of grouts under the blasting induced vibrations

  • Sagong, Myung;Choi, Il Yoon;Lee, Jun S.;Cho, Chung-sik
    • Geomechanics and Engineering
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    • v.21 no.2
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    • pp.207-213
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    • 2020
  • Umbrella Arch Method (UAM) often employed in the tunnel construction under poor rock mass conditions in Korea. Insertion of steel pipes at the periphery of the tunnel and infiltration of grouts along the pipes into the rock masses increases tunnel stability. There are two major effects of grouts expected at the tunnel face: 1) increase of face stability by enhancing the frictional resistance of discontinuities and 2) decrease of permeability along the rock masses. Increase of resistance and decrease of permeability requires a certain curing time for the grout. In Korea, we require 24 hours for curing of grout, which means no progress of excavation for 24 hours after infiltration of grouts. This step delays the tunnel construction sequences. To eliminate such inefficiency, we propose MTG (Method for Tunnel construction using Grouting technology), which uses extended length of steel pipes (14 m) compared to conventional pipe roof method (12 m). The merit of MTG is the reduction of curing time. Because of the approximately 2 m extension of the length of steel pipe, blasting can be done after infiltration of grouting. For this paper, we conducted experiments on the shear strength behaviors of grout infilled rock joint with elapsing of curing time and blasting induced vibration. The results show that blasting induced vibration under MTG does not influence the mechanical features of grout material, which indicates no influence on the mechanical behaviors of grout, contributing to the stability of tunnels during excavation. This result indicates that MTG is a cost effective and fast construction method for tunneling in Korea.

Preparation and Properties of the Fast-Curing γ-Ray-Shielding Materials Based on Polyurethane

  • Ni, Minxuan;Tang, Xiaobin;Chai, Hao;Zhang, Yun;Chen, Tuo;Chen, Da
    • Nuclear Engineering and Technology
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    • v.48 no.6
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    • pp.1396-1403
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    • 2016
  • In this study, fast-curing shielding materials were prepared with a two-component polyurethane matrix and a filler material of PbO through a one-step, laboratory-scale method. With an increase in the filler content, viscosity increased. However, the two components showed a small difference. Curing time decreased as the filler content increased. The minimum tack-free time of 27 s was obtained at a filler content of 70 wt%. Tensile strength and compressive strength initially increased and then decreased as the filler content increased. Even when the filler content reached 60 wt%, mechanical properties were still greater than those of the matrix. Cohesional strength decreased as the filler content increased. However, cohesional strength was still greater than 100 kPa at a filler content of 60 wt%. The ${\gamma}$-ray-shielding properties increased with the increase in the filler content, and composite thickness could be increased to improve the shielding performance when the energy of ${\gamma}$-rays was high. When the filler content was 60 wt%, the composite showed excellent comprehensive properties.

Dentin bond strength of bonding agents cured with Light Emitting Diode (LIGHT EMITTING DIODE로 광조사한 상아질 접착제의 상아질 전단접착강도와 중합률에 관한 연구)

  • Kim Sun-Young;Lee In-Bog;Cho Byeong-Hoon;Son Ho-Hyun;Kim Mi-Ja;Seok Chang-In;Um Chung-Moon
    • Restorative Dentistry and Endodontics
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    • v.29 no.6
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    • pp.504-514
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    • 2004
  • This study compared the dentin shear bond strengths of currently used dentin bonding agents that were irradiated with an LED (Elipar FreeLight, 3M-ESPE) and a halogen light (VIP, BISCO). The optical characteristics of two light curing units were evaluated. Extracted human third molars were prepared to expose the occlusal dentin and the bonding procedures were performed under the irradiation with each light curing unit. The dentin bonding agents used in this study were Scotchbond Multipurpose (3M ESPE), Single Bond (3M ESPE), One-Step (Bisco), Clearfil SE bond (Kuraray), and Adper Prompt (3M ESPE), The shear test was performed by employing the design of a chisel-on-iris supported with a Teflon wall. The fractured dentin surface was observed with SEM to determine the failure mode. The spectral appearance of the LED light curing unit was different from that of the halogen light curing unit in terms of maximum peak and distribution. The LED LCU (maximum peak in 465 nm) shows a narrower spectral distribution than the halogen LCU (maximum peak in 487 nm). With the exception of the Clearfil SE bond (P < 0.05), each 4 dentin bonding agents showed no significant difference between the halogen light-cured group and the LED light-cured group in the mean shear bond strength (P > 0.05). The results can be explained by the strong correlation between the absorption spectrum of camphoroquinone and the narrow emission spectrum of LED.