• Proceedings of the KSR Conference
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• 2008.06a
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• pp.311-315
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• 2008

Ground systems set the reference voltage level of circuit and system, and suppress Ground Potential Rise (GPR) by flowing fault currents to ground safely. There are several parameters which evaluate the performance of ground systems as ground resistance, touch voltage and step voltage. The touch and step voltages are especially important to ensure safety of human body. In this paper, we measured the touch and step voltages by injection of power frequency and surge current. Also correlation between touch and step voltages is compared and analyzed for the same ground systems.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2003.05a
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• pp.208-216
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• 2003

ISO 14649 (data model for STEP-NC) is a new interface scheme or language for CAD-CAM-CNC chain under established by ISO TC184 SCI. Up to this point, the new language is mainly made for milling and turning, and other processes such as EDM will be completed in the future. Upon completion, it will be used as the international standard language for e-manufacturing paradigm by replacing the old machine-level language, so called M&G code used since 1950's. With the rich information contents included in the new language, various intelligent functions can be made by the CNC as the CNC knows what-to-make and how-to-make. In particular, On-Machine Inspection required for quality assurance in the machine level, can be done based on the information of feature­based tolerance graph. Previously, On-Machine inspection has been investigated mainly for milling operation, and only a few researches were made for turning operation without addressing the data model. In this thesis, we present a feature-based on-machine inspection process by the 4 Tasks: 1) proposing a new schema for STEP-NC data model, 2) converting the conventional tolerance scheme into that of STEP-NC, 3) modifying the tolerance graph such that the tolerance can be effectively measured by the touch probe on the machine, and 4) generating collision-free tool path for actual measurement. Task 1 is required for the incorporation of the presented method in the ISO 14649, whose current version does not much include the detailed schema for tolerance. Based on the presented schema, the tolerance represented in the conventional drafting can be changed to that of STEP-NC (Task 2). A special emphasis was given to Task 3 to make the represented tolerance accurately measurable by the touch probe on the machine even if the part setup is changed. Finally, Task 4 is converting the result of Task into the motion of touch probe. The developed schema and algorithms were illustrated by several examples including that of ISO 14649 Part 12.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.10
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• pp.172-181
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• 1999

The objective of this research is to develop a measurement error model for sculptured surfaces in On-Machine Measurement (OMM) process based on a closed-loop configuration. The geometric error model of each axis of a vertical CNC Machining center is derived using a 4${\times}$4 homogeneous transformation matrix. The ideal locations of a touch-type probe for the scupltured surface measurement are calculated from the parametric surface representation and X-, Y- directional geometric errors of the machine. Also, the actual coordinates of the probe are calculated by considering the pre-travel variation of a probe and Z-directional geometric errors. Then, the step-by-step measurement error analysis method is suggested based on a closed-loop configuration of the machining center including workpiece and probe errors. The simulation study shows the simplicity and effectiveness of the proposed error modeling strategy.

• International Journal of Reliability and Applications
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• v.9 no.1
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• pp.7-15
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• 2008

The dimensional measurement equipment, such as Coordinate Measurement Machine (CMM), Optical Coordinate Measurement Machine (OCMM), and Checking Fixture (CF), take multiple dimensional measurements for each part in an automobile industry. Measurements are also recorded under different measurement systems to see if the responses differ significantly over these systems. Each measurement system (CMM, OCMM, and CF) will be considered as different treatments. This set-up provides massive amounts of process data which are multivariate in nature. Therefore, the multivariate statistical analysis is required to analyze data that are dependent on each other. This research provides step by step methodology for the evaluation procedure of the compatibility of measurement systems and clarify a systematic analyzation among the different measurement system's compatibility followed by number of case studies for each methodologies provided.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.3
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• pp.250-255
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• 2011

This paper dealt with the design, fabrication and application of a risk voltage measurement system (RVMS) which analyzes the step and touch voltages in electrical grounding systems. The RVMS supply 300 V and 1.4 A in ranges from 40 Hz to 1 kHz as the test power source. A DAQ module having resolution of 400 kS/s and 16 bit is equipped with 7 inputs for measuring voltage and current. Also, a noise elimination algorithm of digital filter was applied to reduce the measurement error caused by external noises as a commercial frequency current. The performance of the RVMS was evaluated by measurement of the step and touch voltage according to the IEEE standard 80 and 81 in a grounding system with a 10 m counterpoise. The result showed that the RVMS analyzes the risk voltage with the error below 5%.

• Proceedings of the KIEE Conference
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• 2000.11c
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• pp.416-418
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• 2000

Thin films of phase-pure perovskite $(Pb_{0.72}La_{0.28})Ti_{0.93}O_3$ (PLT) were deposited in-situ onto Pt/Ti/$SiO_2$/Si substrates by pulsed laser deposition. We have systematically investigated the variation of grain sizes depending on the process condition. Both in-situ annealing and ex-situ annealing treatments have been compared depending on the annealing time. The grain sizes of PLT thin films were successfully controlled 260 to 350 nm by changing process parameters. Microstructural and electrical properties of the film were investigated by C-V measurement, leakage current measurement and SEM. Two-step process to grow $(Pb_{0.72}La_{0.28})Ti_{0.93}O_3$ (PLT) films was adopted and verified to be useful to enlarge the grain size of the film and to enhance the leakage current characteristics.

• Journal of the Semiconductor & Display Technology
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• v.13 no.1
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• pp.51-55
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• 2014

In this paper, an hybrid automatic focusing method has been proposed for speedy and reliable measurement and inspection in industry. It can improve reliability of focusing position by using not a focusing measure but the hybrid one that is incorporated with sobel operator and auto-correlation. Also, it can not only reduce control time of focusing position using adaptive step size, but also improve accuracy of focusing position by gaussian interpolation. Its performance is verified by experiments. It is expected that it can apply to optical system for measurement and inspection in industry fields.

• Journal of Korean Academy of Oral and Maxillofacial Radiology
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• v.29 no.2
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• pp.397-405
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• 1999

Purpose: To clarify the usefulness and the limitation of Digora system/sup (R)/ by evaluating the physical characteristics as the quantitative image on Image Plate(Ip). Materials and Methods: Radiograms were taken by Heliodent MD(Siemens Co.. Germany) with the image plate for adult. Cu-step wedge as reference material. and three pieces of dry mandibular bone. Image analysis was performed by single color enhancement. density measurement with histogram. The relationship between the exposure conditions and the distribution of the pixel values of the image. the variation of pixel values of each step of Cu-step wedge at two different area and Cu-equivalent value of three pieces of dry mandibular bone measure by the conversion equation. Results: There was no linear relationship between the exposure condition and the average pixel value of the image. of which the distribution was not even. The pixel value differences between the center portion and the periphery were ranged from 60 to 70 in vertical plane and from 15 to 26 in horizontal plane. Two plot profile formed at two different areas of the Cu-step wedge were different. The measured Cu-equivalent values showed the discrepancy among the times of measurement. Conclusion: As above results. Image Plate(Ip) of Digora system/sup (R)/ showed the limitation as the quantitative image. The physical property of IP was expected to need to be compensated for the quantitative evaluation of the bone or others

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.426-429
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• 1999

In this paper, we have provided the measurement technique of the grounding mesh resistance by field measurements. The standard of measurement is specified in the IEEE Std 81.2-1991 and JEAC 5001-1988, which is the the fall-of-potential method by test-current injection, but this method is difficult to apply at field, where is small around a electric power substation of domestic. For the convenient measurement method, space of assistant probe and quantity of test-current injection are changed step for step. As the result, ' the proposed measurement technique of grounding mesh resistance is that the space of current and potential probes must be fixed at 150rn from a grounding mesh, the test-current injection has to keep 5A or more.

• Proceedings of the Optical Society of Korea Conference
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• 2004.02a
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• pp.254-255
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• 2004