• Transactions of Materials Processing
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• v.24 no.2
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• pp.95-100
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• 2015

It was confirmed that when phosphor slurry is formed in the cavity of an elastic mold, the pressure distribution of the phosphor slurry varies as a function of the major squeegee parameters (squeegee angle, squeegee velocity, and the viscosity of the phosphor slurry). The higher the slurry viscosity, the faster the squeegee velocity, and the smaller the squeegee angle, the higher the filling completeness of the phosphor slurry. The optimum conditions for complete filling of the phosphor slurry were found when the squeegee angle was between 30 to 45 degrees, squeegee velocity at 40 to 70mm/sec, and the viscosity of the phosphor slurry composite was at 6,556 cps (i.e. phosphor content around 50 wt. %).

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.1
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• pp.26-32
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• 2012

In the present study, the stencil printing process using solder paste are numerically analyzed. The key design parameters in the stencil printing process are the printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of printing conditions including the squeegee angle and squeegee pressure are investigated through finite element (FE) analysis. However, the FE analysis for the stencil printing process requires tremendous computational loads and time because this process carries micro-filling through thousands of micro-apertures in stencil. To overcome this difficulty in simulation, the present study proposes a two-step approach to sequentially perform the global domain analysis and the local domain analysis. That is, the pressure development under the squeegee are firstly calculated in the full analysis domain through the global analysis. The filling stage of the solder paste into a micro-aperture is then analyzed in the local analysis domain based on the results of the preceding global analysis.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.71-77
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• 2011

Main parameters of the screen printing were determined and the printing parameters were optimized for 0402, 0603, and 1005 chips in this study. The solder pastes used in this study were Sn-3.0Ag-0.5Cu and Sn-0.7Cu. The process parameters were stencil thickness, squeegee angle, printing speed, stencil separating speed and gap between stencil and PCB. The printing pressure was fixed at 2 $kgf/cm^2$. From ANOVA results, the stencil thickness and the squeegee angle were determined to be main parameters for the printing efficiency. The printing efficiency was optimized with varying two main parameters, the stencil thickness and the squeegee angle. The printing efficiency increased as the squeegee angle was lowered under 45o for all chips. For the 0402 and the 0603 chips, the printing efficiency increased as the stencil thickness decreased. On the other hand, for the 1005 chip, the printing efficiency increased as the stencil thickness increased.

• Journal of the Semiconductor & Display Technology
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• v.11 no.1
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• pp.73-78
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• 2012

In this study, the optimal process condition was induced about the pillar arrangement process of applying the screen printing method in the manufacture process of vacuum glazing panel. The high precision screen printing is technology which pushes out the paste and spreads it by using the squeegee on the stainless steel plate in which the pattern is formed. The screen printing method is much used in the flat panel display field including the LCD, PDP, FED, organic EL, and etc for forming the high precision micro-pattern. Also a number of studies of screen printing method have been conducted as the method for the cost down through the improvement of productivity. The screen printing method has many parameters. So we used Taguchi method in order to decrease test frequencies and optimize this parameters efficiently. In this study, experiments of pillar arrangement were performed by using Taguchi experimental design. We analyzed experimental results and obtained optimal conditions which are 4 m/s of squeegee speed, $40^{\circ}$ of squeegee angle and distance between metal mask and glass.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.4
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• pp.209-216
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• 2014

The screen printed technique is one of the electrode forming technologies for crystalline silicon solar cell. It has the advantage that can raise the production efficiency due to simple process. The electrode technology is the core process because the electrode feature is given a substantial factor (for solar cell efficiency). In this paper, we tried to change conditions such as squeegee angle $55{\sim}75^{\circ}$, snap off 0.5~1.75 mm, printing pressure 0.6~0.3 MPa and 1.6~2.0 mm finger spacing. As a result, the screen printing process showed an improved performance with an increased height higher finger height. Optimization of fabrication process has achieved 17.48% efficiency at screen mesh of 1.6 mm finger spacing.

• Current Photovoltaic Research
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• v.5 no.1
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• pp.9-14
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• 2017

The screen printing technique is one of process to form electrode for crystalline silicon solar cell and has been studied a lot, because it has many advantages such as low price, high efficiency and mass production due to simple and fast process. The reason why electrode formation is important is for influence of series resistance and amount of incident light in crystalline silicon solar cell. In this study, electrode was formed by screen printing method with various conditions like squeegee angle, printing speed, snap off, printing pressure. After optimizing various conditions, double printing method was applied to obtain low series resistance and high aspect ratio. As a result, we obtained electrode resistance 45.31 ohm, aspect ratio 4.38, shading loss 7.549% mono-crystalline silicon solar cell with optimal double screen printing condition.