• Title/Summary/Keyword: Sputtering conditions

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Preparation of ATO Thin Films by DC Magnetron Sputtering (I) Deposition Characteristics (DC Magnetron Sputtering에 의한 ATO 박막의 제조 (I)증착특성)

  • Yoon, C.;Lee, H.Y.;Chung, Y.J.
    • Journal of the Korean Ceramic Society
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    • v.33 no.4
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    • pp.441-447
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    • 1996
  • Sb doped SnO2(ATO:Antinomy doped Tin Oxide) thin films were prepared by a DC magnetron spttuering method using oxide target and the deposition characteristics were investigated. The experimental conditions are as follows :Ar flow rate : 100 sccm oxygen flow rates ; 0-100 sccm deposition temperature ; 250 -40$0^{\circ}C$ DC sputter powder ; 150~550 W and sputtering pressure ; ; 2~7 mTorr. Deposition rate greatly depends not on the deposition temperature but on the reaction pressure oxygen flow rate and sputter power,. when the sputter powder is low ATO thin films with (110) preferred orientation are deposited. And when the sputter power is high (110) prefered orientation appeares with decreasing of oxygen flow rate and increasing of suputte-ring pressure.

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Charaterization of GaN Films Grown on Si(100) by RF Magnetron Sputtering (RF magnetron sputtering 방법에 의해 Si(100) 기판 위에 성장된 GaN 박막의 특성에 대한 연구)

  • 이용일;성웅제;박천일;최우범;성만영
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.570-573
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    • 2001
  • In this paper, GaN films have been grown on SiO$_2$/Si(100) substrates by RF magnetron sputtering. To obtain high quality GaN films, we used ZnO buffer layer and modified the process conditions. The charateristics of GaN films on RF power, substrate temperature and Ar/N$_2$gas ratio have been investigated by Auger electron spectroscopy and X-ray diffraction analysis. At RF power 150W, substrate temperature 500 $^{\circ}C$ and Ar/N$_2$=1:2 gas ratio, we could grow high quality GaN films. Through the atomic force microscope and photoluminescence analysises, it was observed that the crystallization of GaN films was improved with increasing annealing temperature and the optimal crystallization of GaN films was found at 1100 $^{\circ}C$ annealing temperature.

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Growth of Large Area $YBa_{2}$$Cu_{3}$ $O_{7-x}$Thin Films by Hollow Cathode Discharge Sputtering System (할로우 캐소드 방전 스퍼터링 시스템을 이용한 대면적 $YBa_{2}$$Cu_{3}$ $O_{7-x}$박막 성장)

  • 서정대;강광용;곽민환
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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    • 1999.02a
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    • pp.26-29
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    • 1999
  • Superconducting $YBa_{2}$$Cu_{3}$ $O_{7-x}$(YBCO) thin films were deposited on MgO(100) substrates using a hollow cathode discharge sputtering system. Influence of the sputtering conditions such as substrate temperature and discharge sputtering gas pressure on electrical and structural properties were investigated. It was found that YBCO thin films with zero resistance temperature higher than 85 K were obtained to the pressure 200 mToorr(Ar/O2=0.9), substrate temperature of $760^{\circ}C$, and target-substrate distance of 10 mm during film deposition. Homogeneous large area YBCO films with 2 inch diameter were also sucessfully fabricated by this method.

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Crystallography properties of $ZnO/AZO/SiO_2/Si$ thin film for FBAR (FBAR용 $ZnO/AZO/SiO_2/Si$ 박막의 결정학적 특성에 관한 연구)

  • Kang, Tai-Young;Keum, Min-Jong;Son, In-Hwan;Kim, Kyung-Hwan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07b
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    • pp.880-883
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    • 2003
  • ZnO thin films for Film Bulk Acoustic Resonator(FBAR) were prepared by FTS (Facing Target Sputtering) system. The FTS methode enable to generate high density plasma, and it has a high deposition rate at 1mTorr pressure. Therefore, the ZnO thin films were deposited on $AZO/SiO_2/Si$ substrates with oxygen gas flow rate, and the other sputtering conditions were fixed such as a sputtering current of 0.8A, a substrate temperature at room temperature. AZO bottom electrode were deposited on $SiO_2/Si$ substrate and by Zn:Al(Al:2wt%) metal target. ZnO thin film thickness and the c-axis preferred orientation of ZnO thin film were evaluated by ${\alpha}-step$ and XRD.

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The Study of Electrical and Structural Performance of Aluminum Thin Film Deposited by Sputtering Method (스퍼터링법에 의해 증착된 알루미늄 박막의 전기적·구조적 특성에 관한 연구)

  • Kim, Doyoung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.33 no.2
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    • pp.114-117
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    • 2020
  • In this study, we performed the deposition of Al thin film using a DC magnetron sputtering method. To evaluate electrical and structural properties, the growth conditions were changed in terms of two functions, namely, sputtering power ranging from 41.6 to 216 W and film growth rate ranging from 5.35 to 26.39 nm/min. The growth rate and the microstructure were characterized by a scanning electron microscopy and X-ray diffraction analysis. The plane of crystalline growth showed that the preferential (111) direction and defects due to the grain boundary increased with DC power. The resistivity of the Al film over 50 nm showed a constant value by horizontal grain growth. Our results can be applicable for the preparation of nano-templates for anodic aluminum oxide.

Gas Barrier Properties of Nanolaminated Single Inorganic Film Deposited by Neutral Beam Assisted Sputtering Process

  • Jang, Yun-Sung;Lee, You-Jong;Hong, Mun-Pyo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.465-465
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    • 2012
  • In this study, we developed an Al2O3 nanolaminated single gas barrier layer using a Neutral Beam Assisted Sputtering (NBAS) process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nanocrystal phase with various grain sizes and lead to the formation of a nanolaminated structure in the single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the nanolaminated Al2O3 thin films by NBAS process have improved more than 40% compared with that of conventional Al2O3 layers by the RF magnetron sputtering process under the same sputtering conditions.

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Preparation of AlN thin films on silicon by reactive RF magnetron sputtering (RF 마그네트론 스퍼터링을 이용한 Si 기판상의 AlN 박막의 제조)

  • 조찬섭;김형표
    • Journal of the Semiconductor & Display Technology
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    • v.3 no.2
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    • pp.17-21
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    • 2004
  • Aluminum nitride(AlN) thin films were deposited on silicon substrate by reactive RF magnetron sputtering without substrate heating. We investigated the dependence of some properties for AlN thin film on sputtering conditions such as working pressure, $N_2$ concentration and RF power. XRD, Ellipsometer and AES has been measured to find out structural properties and preferred orientation of AlN thin films. Deposition rate of AlN thin film was increased with an increase of RF power and decreased with an increase of $N_2$ concentration. AES in-depth measurements showed that stoichiometry of Aluminium and Nitrogen elements were not affected by $N_2$ concentration. It has shown that low working pressure, low $N_2$ concentration and high RF power should be maintained to deposit AlN thin film with a high degree of (0002) preferred orientation.

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Photoluminescence of ZnO:Er Thin Film Phosphors Deposited by RF Magnetron Sputtering (RF 마그네트론 스퍼터링법으로 증착한 ZnO:Er 박막형광체의 발광 특성)

  • Song, Hyun-Don;Kim, Young-Jin
    • Korean Journal of Materials Research
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    • v.16 no.7
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    • pp.401-407
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    • 2006
  • ZnO is well-known as a promising material for optical communication systems and electronic displays. ZnO:Er thin films were deposited on c-plane sapphire substrates by rf magnetron sputtering, and the effects of sputtering parameters and the annealing conditions on the luminescence in the visible range were investigated. Luminescent properties depended on the crystallinity of films and annealing atmosphere. Highly c-axis oriented ZnO:Er films showed a strong emission band at 465 nm and a weak emission at 525 nm due to the energy transition of $^{4}I_{15/2}-^{4}F_{5/2}\;and\;^{4}I_{15/2}-^{2}H_{11/2}$, respectively. ZnO:Er thin films annealed at air atmosphere were superior to those annealed in $H_2$ in photoluminescence intensity.

Electrical and Structural Properties of Ti Thin Films on Al2O3 Substrate (Al2O3 기판에 형성된 Titanium 박막의 전기적 및 구조적 특성)

  • 정운조;양현훈;임정명;김영준;박계춘
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.9
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    • pp.753-758
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    • 2003
  • Ti films were deposited onto 100${\times}$100 mm alumina substrates using dc magnetron sputtering under the following conditions; substrate temperature of R.T~400 $^{\circ}C$, annealing temperature of 100~400 $^{\circ}C$, and sputtering gas pressure of 4${\times}$10$^{-3}$ Torr~4${\times}$10$^{-2}$ Torr. And the films were examined by X-ray diffraction analysis (XRD), scanning electron microscopy(SEM) and 4-point measurement system. The best electrical and structural properties was obtained by substrate temperature of ~200 $^{\circ}C$, target-substrate distance of ~14 cm and sputtering pressure of ~1${\times}$10$^{-2}$ Torr. Also at that condition the most excellent adhesion was observed.

Characteristics of Cu Thick Films Deposited by High Rate Magnetron Sputtering Source (고속 스퍼터링 소스를 이용한 구리 후막 제조 및 특성 평가)

  • Jeong, Jae-In;Yang, Ji-Hun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2008.11a
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    • pp.13-14
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    • 2008
  • A high rate magnetron sputtering source (HRMSS) was employed to deposit thick copper films. The HRMSS was manufactured by changing the magnet size, arrangement, and field intensity. For the preparation of thick copper films, the copper sputtering conditions using HRMSS were characterized based on the deposition parameters such as discharge characteristics, I-V characteristics of the source, and change of deposition rate. The deposition rate of copper turned out to be more than 5 times than that of conventional magnetron sputtering source. Thick copper films having thickness of more than $20{\mu}m$ were prepared by using HRMSS. The morphology and orientation of the films were investigated by scanning electron microscopy and x-ray diffraction.

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