• 제목/요약/키워드: Spin-coated film

검색결과 212건 처리시간 0.029초

Hydrogen-Bonding Induced Alternating Thin Films of Dendrimer and Block Copolymer Micelle

  • Park, Chi-Young;Rhue, Mi-Kyo;Im, Min-Ju;Kim, Chul-Hee
    • Macromolecular Research
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    • 제15권7호
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    • pp.688-692
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    • 2007
  • The hydrogen-bonding induced alternating multilayer thin films of dendrimers and block copolymer micelles were demonstrated. The block copolymer micelles derived from amphiphilic poly(2-ethyl-2-oxazoline)block-$poly({\varepsilon}-carprolactone)$ (PEtOz-PCL) in aqueous phase have a core-shell structure with a mean hydrodynamic diameter of 26 nm. The hydrogen bonding between the PEtOz outer shell of micelle and the carboxyl unit of poly(amidoamine) dendrimer of generation 4.5 (PAMAM-4.5G) at pH 3 was utilized as a driving force for the layerby-layer alternating deposition. The multilayer thin film was fabricated on the poly(methyl methacrylate) (PMMA) thin film spin-coated on silicon wafer or glass substrate by the alternate dipping of PEtOz-PCL micelles and PAMAM dendrimers in aqueous solution at pH 3. The formation of multilayer thin film was characterized by using ellipsometry, UV-vis spectroscopy, and atomic force microscopy. The PEtOz outer shell of PEtOz-PCL micelle provided the pH-responsive hydrogen bonding sites with peripheral carboxylic acids of PAM AM dendrimer. The multilayer thin film was reversibly removed after dipping in aqueous solution at $pH{\geq}5.6$ due to dissociation of the hydrogen bonding between PEtOz shell of PEtOz-PCL micelle and peripheral carboxyl units of PAMAM dendrimer.

졸-겔법에 의한 $GdAlO_3$ 버퍼층의 제조 (DFabrication of $GdAlO_3$ Buffer Layers by Sol-Gel Processing)

  • 방재철
    • 한국산학기술학회논문지
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    • 제7권5호
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    • pp.801-804
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    • 2006
  • [ $YBa_2Cu_3O_{7-{\delta}}(YBCO)$ ]계 초전도 선재용 $GdAlO_3(GAO)$ 버퍼층을 졸-겔(sol-gel) 공정에 의해 제조하였다. 전구체 용액은 Gd 질산염과 Al 질산염을 1:1 화학양론비로 하여 메탄올에 용해하여 준비하였다. 전구체 용액을 $SrTiO_3(STO)$ (100) 단결정 기판위에 스핀 코팅하고, 수분이 포함된 $N_2-5%\; H_2$ 분위기에서 $1000^{\circ}C$에서 2시간 열처리 하였다. 열처리 후 GAO 층의 표면에 대한 주사전자현미경 관찰에 의해 GAO 층이 에피택셜의 특징인 각면 형상을 갖는 것을 알 수 있었다. X-선 회절분석에 의하면 GAO 버퍼층은 c-축으로 우선 배향된 에피택셜 박막으로써 반가폭이 각각 (002)면에서 $0.29^{\circ}(out-of-plane)$, {112}지면에서 $1.10^{\circ}(in-plane)$의 우수한 배향성을 나타내었다.

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박테리아 셀룰로오스 기반 전도성 막의 전도도 향상을 위한 PEDOT:PEG와 황산혼합액 코팅의 영향 (Effect of Coating with the Mixture of PEDOT:PEG and Sulfuric Acid to Enhance Conductivity of Bacterial Cellulose Platform Film)

  • 임은채;김성준
    • Korean Chemical Engineering Research
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    • 제54권1호
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    • pp.114-119
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    • 2016
  • 본 연구에서는 박테리아 셀룰로오스(BC)와 같은 천연고분자에 전도성 고분자 PEDOT:PEG와 graphene, 은나노와이어(AgNW)를 코팅하여 전도성을 부여하고자 하였다. 미리 PEDOT:PEG와 황산을 10~20%를 혼합하여 그 용액을 전자 스핀 코팅으로 BC 기판에 코팅하였다. 그 후, 전도성을 향상시키고자 graphene과 AgNW로 코팅하여 hall effect로 측정하였다. 그 결과, 대조군 PEDOT:PEG로 코팅한 BC 막의 전자농도($2.487{\times}10^{10}/cm^3$)에 비해 PEDOT:PEG에 황산을 10%로 혼합하여 코팅시킨 BC막($8.093{\times}10^{15}/cm^3$) 쪽이 $3.25{\times}10^5$배 높은 값을 나타내는 것으로 전도도가 대폭 향상되었음을 알 수 있었다. 또한, SEM분석으로 PEDOT:PEG가 황산처리에 의해 폴리머 형상으로 변화된 것을 확인 할 수 있었다. 분자구조의 변화를 FTIR분석결과 $1200cm^{-1}$ 파장의 S-O그룹이 황산처리 전에 비해 황산 혼합한 쪽에서 크게 상승된 것이 확인되었다. 이 방법을 이용하여 소량의 PEDOT:PEG사용으로 투명성을 확보할 수 있으며 미리 황산을 처리하는 것으로 제조공정을 단순하게 할 것으로 사료된다.

졸-겔 스핀코팅법에 의한 반사방지 및 정전기방지 복층막의 제조 및 특성 (Preparation and Characterization of Anti-reflective and Anti-static Double Layered Films by Sol-Gel Spin-Coating Method)

  • 이준종;최세영
    • 한국세라믹학회지
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    • 제34권1호
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    • pp.79-87
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    • 1997
  • 졸-겔 스핀코팅법을 이용하여 VDT 기판에 반사방지 및 정전기방지 복층막을 코팅하고 코팅졸과 겔분말의 특성 및 코팅막의 전기적, 광학적, 기계적 특성을 조사하였다. 1층막은 복층막의 간섭조건을 만족시키는 굴절율을 얻기위해 투명 전도성 재료인 ATO(Antimony doped Tin Oxide) 졸과 SiO2 졸을 몰비 68:32로 혼합한 ATO-SiO2 복합졸을, 2층막에는 저굴절율의 SiO2 졸을 사용하였다. 각 코팅막을 45$0^{\circ}C$에서 30분간 열처리하였을 때 잔류 유기물은 완전히 제거되었다. ATO막의 표면저항은 3mol%의 Sb 첨가시 약 6$\times$107$\Omega$/$\square$로 최소를 나타내었고 SiO2 졸과의 혼합시 약 30mol% 까지는 표면저항이 완만히 증가하다가 그 이후에는 급격히 증가하는 경향을 나타내었으며, 간섭조건을 만족시키는 조성인 32mol%에서는 약 3$\times$108$\Omega$/$\square$를 나타내었다. 복층막의 반사율은 550nm의 기준파장에서 약 0.64%를 나타내었으며 광투과율은 약 3.20% 증가하였다. 복층막의 미소경도는 약 471.4kg.f/mm2로 코팅하지 않은 VDT기판의 경도와 유사한 값을 나타내었다.

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ESD 스프레이를 이용한 OPV 제작 기법 (Fabrication Method of OPV using ESD Spray Coating)

  • 김정수;조정대;김동수
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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    • pp.84.2-84.2
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    • 2010
  • PEMS (printed electro-mechanical system) is fabricated by means of various printing technologies. Passive and active components in 2D or 3D such as conducting lines, resistors, capacitors, inductors and TFT, which are printed with functional materials, can be classified in this category. And the issue of PEMS is applied to a R2R process in the manufacturing process. In many electro-devices, the vacuum process is used as the manufacturing process. However, the vacuum process has a problem: it is difficult to apply toa continuous process as a R2R printing process. In this paper, we propose an ESD (electro static deposition) printing process has been used to apply an organic solar cell of thin film forming. ESD is a method of liquid atomization by electrical forces, anelectrostatic atomizer sprays micro-drops from the solution injected into the capillary, with electrostatic force generated by electric potential of about tens of kV. ESD method is usable in the thin film coating process of organic materials and continuous process as a R2R manufacturing process. Therefore, we experiment the thin films forming of PEDOT:PSS layer and Active layer which consist of the P3HT:PCBM. The result of experiment, organic solar cell using ESD thin film coated method is occurred efficiency of about 1.4%. Also, the case of only used to ESD method in the active layer coating is occurred efficiency of about 1.86% as the applying a spin coating in the PEDOT:PSS layer. We can expect that ESD method is possible for continuous process to manufacture in the organic solar cell or OLED device.

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인쇄전자 기술을 이용한 유기 태양전지 기술 개발 (Development of the Organic Solar Cell Technology using Printed Electronics)

  • 김정수;유종수;윤성만;조정대;김동수
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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    • pp.113.1-113.1
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    • 2011
  • PEMS (printed electro-mechanical system) is fabricated by means of various printing technologies. Passive and active compo-nents in 2D or 3D such as conducting lines, resistors, capacitors, inductors and TFT(Thin Film Transistor), which are printed withfunctional materials, can be classified in this category. And the issue of PEMS is applied to a R2R process in the manu-facturing process. In many electro-devices, the vacuum process is used as the manufacturing process. However, the vacuum process has a problem, it is difficult to apply to a continuous process such as a R2R(roll to roll) printing process. In this paper, we propose an ESD (electro static deposition) printing process has been used to apply an organic solar cell of thin film forming. ESD is a method of liquid atomization by electrical forces, an electrostatic atomizer sprays micro-drops from the solution injected into the capillary with electrostatic force generated by electric potential of about several tens kV. ESD method is usable in the thin film coating process of organic materials and continuous process as a R2R manufacturing process. Therefore, we experiment the thin films forming of PEDOT:PSS layer and active layer which consist of the P3HT:PCBM. The organic solar cell based on a P3HT/PCBM active layer and a PEDOT:PSS electron blocking layer prepared from ESD method shows solar-to-electrical conversion efficiency of 1.42% at AM 1.5G 1sun light illumination, while 1.86% efficiency is observed when the ESD deposition of P3HT/PCBM is performed on a spin-coated PEDOT:PSS layer.

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Evaluation of Flexible Complementary Inverters Based on Pentacene and IGZO Thin Film Transistors

  • Kim, D.I.;Hwang, B.U.;Jeon, H.S.;Bae, B.S.;Lee, H.J.;Lee, N.E.
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.154-154
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    • 2012
  • Flexible complementary inverters based on thin-film transistors (TFTs) are important because they have low power consumption and high voltage gain compared to single type circuits. We have manufactured flexible complementary inverters using pentacene and amorphous indium gallium zinc oxide (IGZO) for the p-channel and n-channel, respectively. The circuits were fabricated on polyimide (PI) substrate. Firstly, a thin poly-4-vinyl phenol (PVP) layer was spin coated on PI substrate to make a smooth surface with rms surface roughness of 0.3 nm, which was required to grow high quality IGZO layers. Then, Ni gate electrode was deposited on the PVP layer by e-beam evaporator. 400-nm-thick PVP and 20-nm-thick ALD Al2O3 dielectric was deposited in sequence as a double gate dielectric layer for high flexibility and low leakage current. Then, IGZO and pentacene semiconductor layers were deposited by rf sputter and thermal evaporator, respectively, using shadow masks. Finally, Al and Au source/drain electrodes of 70 nm were respectively deposited on each semiconductor layer using shadow masks by thermal evaporator. The characteristics of TFTs and inverters were evaluated at different bending radii. The applied strain led to change in voltage transfer characteristics of complementary inverters as well as source-drain saturation current, field effect mobility and threshold voltage of TFTs. The switching threshold voltage of fabricated inverters was decreased with increasing bending radius, which is related to change in parameters of TFTs. Throughout the bending experiments, relationship between circuit performance and TFT characteristics under mechanical deformation could be elucidated.

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Hybrid complementary circuits based on organic/inorganic flexible thin film transistors with PVP/Al2O3 gate dielectrics

  • Kim, D.I.;Seol, Y.G.;Lee, N.E.;Woo, C.H.;Ahn, C.H.;Ch, H.K.
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.479-479
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    • 2011
  • Flexible inverters based on complementary thin-film transistor (CTFTs) are important because they have low power consumption and other advantages over single type TFT inverters. In addition, integrated CTFTs in flexible electronic circuits on low-cost, large area and mechanically flexible substrates have potentials in various applications such as radio-frequency identification tags (RFIDs), sensors, and backplanes for flexible displays. In this work, we introduce flexible complementary inverters using pentacene and amorphous indium gallium zinc oxide (IGZO) for the p-channel and n-channel, respectively. The CTFTs were fabricated on polyimide (PI) substrate. Firstly, a thin poly-4-vinyl phenol (PVP) layer was spin coated on PI substrate to make a smooth surface with rms surface roughness of 0.3 nm, which was required to grow high quality IGZO layers. Then, Ni gate electrode was deposited on the PVP layer by e-beam evaporator. 400-nm-thick PVP and 20-nm-thick ALD Al2O3 dielectric was deposited in sequence as a double gate dielectric layer for high flexibility and low leakage current. Then, IGZO and pentacene semiconductor layers were deposited by rf sputter and thermal evaporator, respectively, using shadow masks. Finally, Al and Au source/drain electrodes of 70 nm were respectively deposited on each semiconductor layer using shadow masks by thermal evaporator. Basic electrical characteristics of individual transistors and the whole CTFTs were measured by a semiconductor parameter analyzer (HP4145B, Agilent Technologies) at room temperature in the dark. Performance of those devices then was measured under static and dynamic mechanical deformation. Effects of cyclic bending were also examined. The voltage transfer characteristics (Vout- Vin) and voltage gain (-dVout/dVin) of flexible inverter circuit were analyzed and the effects of mechanical bending will be discussed in detail.

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Solution-Processed Inorganic Thin Film Transistors Fabricated from Butylamine-Capped Indium-Doped Zinc Oxide Nanocrystals

  • Pham, Hien Thu;Jeong, Hyun-Dam
    • Bulletin of the Korean Chemical Society
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    • 제35권2호
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    • pp.494-500
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    • 2014
  • Indium-doped zinc oxide nanocrystals (IZO NCs), capped with stearic acid (SA) of different sizes, were synthesized using a hot injection method in a noncoordinating solvent 1-octadecene (ODE). The ligand exchange process was employed to modify the surface of IZO NCs by replacing the longer-chain ligand of stearic acid with the shorter-chain ligand of butylamine (BA). It should be noted that the ligand-exchange percentage was observed to be 75%. The change of particle size, morphology, and crystal structures were obtained using a field emission scanning electron microscope (FE-SEM) and X-ray diffraction pattern results. In our study, the 5 nm and 10 nm IZO NCs capped with stearic acid (SA-IZO) were ligand-exchanged with butylamine (BA), and were then spin-coated on a thermal oxide ($SiO_2$) gate insulator to fabricate a thin film transistor (TFT) device. The films were then annealed at various temperatures: $350^{\circ}C$, $400^{\circ}C$, $500^{\circ}C$, and $600^{\circ}C$. All samples showed semiconducting behavior and exhibited n-channel TFT. Curing temperature dependent on mobility was observed. Interestingly, mobility decreases with the increasing size of NCs from 5 to 10 nm. Miller-Abrahams hopping formalism was employed to explain the hopping mechanism insight our IZO NC films. By focusing on the effect of size, different curing temperatures, electron coupling, tunneling rate, and inter-NC separation, we found that the decrease in electron mobility for larger NCs was due to smaller electronic coupling.

유연성 유기 박막트랜지스터 적용을 위한 다층 게이트 절연막의 전기적 및 기계적 특성 향상 연구 (Improvement of Electrical and Mechanical Characteristics of Organic Thin Film Transistor with Organic/Inorganic Laminated Gate Dielectric)

  • 노화영;설영국;김선일;이내응
    • 한국표면공학회지
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    • 제41권1호
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    • pp.1-5
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    • 2008
  • In this work, improvement of mechanical and electrical properties of gate dielectric layer for flexible organic thin film transistor (OTFT) devices was investigated. In order to increase the mechanical flexibility of PVP (poly(4-vinyl phenol) organic gate dielectric, a very thin inorganic $HfO_2$ layers with the thickness of $5{\sim}20nm$ was inserted in between the spin-coated PVP layers. Insertion of the inorganic $HfO_2$ in the laminated organic/inorganic structure of PVP/$HfO_2$/PVP layer led to a dramatic reduction in the leakage current compared to the pure PVP layer. Under repetitive cyclic bending, the leakage current density of the laminated PVP/$HfO_2$/PVP layer with the thickness of 20-nm $HfO_2$ layer was not changed, while that of the single PVP layer was increased significantly. Mechanical flexibility tests of the OTFT devices by cyclic bending with 5 mm bending radius indicated that the leakage current of the laminated PVP/$HfO_2$(20 nm)/PVP gate dielectric in the device structure was also much smaller than that of the single PVP layer.