• Tribology and Lubricants
• /
• v.22 no.2
• /
• pp.105-111
• /
• 2006

The floating ring seal which is used in the high pressure turbo pump is frequently used in the oxidizer pump and the fuel pump of the turbo pump of the liquid propulsion rocket, because it is able to minimize clearance to decrease the leakage flow rate. Compared with contact seal, the floating ring seal has advantage of minimizing clearance without rubbing phenomenon. But, the floating ring seal has a tendency to increase instability in operating condition in the high speed region. In this research, we devised floating ring seal which is inserted bump in the outer surface in order to improve the stability in the high speed region. Through this work, we expect to improve stability of floating ring seal with increasing the direct damping coefficient of seal and decreasing the eccentricity ratio.

• 유체기계공업학회:학술대회논문집
• /
• 2001.11a
• /
• pp.469-474
• /
• 2001

The feasibility of a oil-free motor-driven two-stage centrifugal compressor supported by air bump bearings is investigated. This centrifugal compressor is driven by 75kW motor at an operating speed of 39,000RPM md a pressure ratio of the compressor is up to 4. The analysis is performed, based upon bearing equilibrium position, bearing stiffness, Campbell diagram, unbalance response and stability. It is demonstrated in this paper that air bump bearings can be adopted well to a oil-free motor-driven centrifugal compressor.

• 유체기계공업학회:학술대회논문집
• /
• 2001.11a
• /
• pp.129-134
• /
• 2001

The paper presents the optimal design of a oil-free two-stage compressor, which is driven by 75 kW motor at an operating speed of 39,000 rpm, and the pressure ratio of which is up to 4. First, an attempt is made to obtain the optimal design of a bump bearing which supports a compressor rotor. Second, bump bearings and shaft are considered simultaneously, and the weighted sum of rotor weight and frictional torque is minimized. Finally, the optimal geometry of compressor wheel is considered. The mean efficiency and the - minimum efficiency are maximized respectively. The results presented in this paper provide important design information necessary to reduce the energy loss.

• Journal of the Korean Society of Industry Convergence
• /
• v.12 no.4
• /
• pp.215-219
• /
• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• Journal of Welding and Joining
• /
• v.26 no.3
• /
• pp.30-36
• /
• 2008

A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

• 유체기계공업학회:학술대회논문집
• /
• 2001.11a
• /
• pp.475-481
• /
• 2001

Foil bearings have been successfully used for small high speed rotors, such as ACM(Air Cycle Machine), turbo charger, turbo compressor, high speed motor, etc. Recently advanced researches are concentrated on the high load capacity and the extreme temperature foil bearings to extend the application boundary. Some bearings are already adopted into cryogenic machines and micro gas turbines. In this paper, a foil journal bearing designed for high load capacity, which is under development, is introduced. The bearing is for the turbo refrigerator which has a rotor of 18${\~}$25 kgf rotating at 23,000${\~}$38,000 rpm. This application is well beyond conventional spectrum of foil bearings because the rotor is relatively heavy and the rotational speed is low. Therefore, the development is challenging. The foil bearing is a bump type, the size is 60mm in diameter and 50mm in length, the operating fluid is air and rotational speed is 26,000 rpm. In-house software was developed and used for bearing design. Tested maximum load capacity is 80kgf, 0.62 in terms of load capacity coefficient, and testing is being continued.

• Journal of Institute of Control, Robotics and Systems
• /
• v.18 no.1
• /
• pp.62-68
• /
• 2012

In this paper, a detection method of a pedestrian safety road marking was proposed. The proposed algorithm uses laser range and reflectivity of a range finder (LRF). For a detection of crosswalk marking and stop line, the DFT (Discrete Fourier Transform) of reflectivity and cross-correlation method between the reference replica and the measured reflectivity are used. A speed bump is detected through measuring an altitude difference of two LRFs which have the different tilted angle. Furthermore, we proposed a velocity constrained a detection method of a speed bump. Finally, the proposed methods are tested in on-line, on the pavement of a road. The considered road markings are wholly detected. The localization errors of both road markings are smaller than 0.4 meter.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.4 no.3
• /
• pp.189-195
• /
• 2004

A 10 Gb/s limiting amplifier IC with the emitter area of $1.5{\times}10{\mu}m^2$ for optical transmission system was designed and fabricated with a AIGaAs/GaAs HBTs technology. In this stud)', we evaluated fine pitch bump using WL-CSP (Wafer Level-Chip Scale Packaging) instead of conventional wire bonding for interconnection. For this we developed WL-CSP process and formed fine pitch solder bump with the $40{\mu}m$ diameter and $100{\mu}m$ pitch on bonding pad. To study the effect of WL-CSP, electrical performance was measured and analyzed in wafer and package module using WL-CSP. In a package module, clear and wide eye diagram openings were observed and the riselfall times were about 100ps, and the output" oltage swing was limited to $600mV_{p-p}$ with input voltage ranging from 50 to 500m V. The Small signal gains in wafer and package module were 15.56dB and 14.99dB respectively. It was found that the difference of small signal gain in wafer and package module was less then 0.57dB up to 10GHz and the characteristics of return loss was improved by 5dB in package module. This is due to the short interconnection length by WL-CSP. So, WL-CSP process can be used for millimeter wave GaAs MMIC with the fine pitch pad.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.21 no.1
• /
• pp.41-48
• /
• 2022

Vehicle vibration was introduced in the time and frequency domains using fast Fourier transform (FFT) analysis. In particular, a vibration mode analysis and characteristics of the frequency response function (FRF) in a sport utility vehicle (SUV) passing over a bump barrier at different speeds was performed systematically. The response behavior of the theoretical acceleration was obtained using a numerical method applied to the forced vibration model. The amplitude and frequency of the external force on the vehicle cause various power spectra with individual intrinsic system frequencies. In this regard, several modes of power spectra were acquired from the spectra and are discussed in this paper. The proposed technique can be used for monitoring the acceleration in a vehicle passing over a bump barrier. To acquire acceleration signals, various experimental runs were performed using the SUV. These acceleration signals were then used to acquire the FRF and to conduct mode analysis. The vehicle characteristics according to the vehicle condition were analyzed using FRF. In addition, the vehicle structural system and bump passing frequencies were discriminated based on their power spectra and other FRF spectra.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.39 no.10
• /
• pp.1029-1037
• /
• 2015

Recently, the importance of rotordynamic stability has been increased because of the tendency to employ ultra-high speeds in rotating machinery. In particular, the dynamic characteristics of gas bearings for high-speed rotating machinery need to be identified at various excitation frequencies to predict the rotor's behavior. In this study, we perform dynamic loading tests for gas-foil bearings (GFBs) to determine the bump foil structure and an air-film combined bump-foil structure for varying excitation frequencies. We calculate the dynamic characteristics from the measured force and displacement data. The air film is generated by a pressurized air supply. Based on the results, the stiffness coefficients of the bump structure and the air-film combined bump structure increased, while the damping coefficients decreased at increasing excitation frequencies. Further, the stiffness and damping coefficients of the air-film combined structure show lower values than those of the bump structure. Consequently, we identify the frequency-dependent dynamic characteristics of the bump structure and the effect of gas film on the dynamic characteristics of GFBs. Furthermore, to reveal the effectiveness of the proposed method, we perform experiments and discuss two methods of extracting the dynamic characteristics from the measured data.