• Journal of Powder Materials
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• v.15 no.1
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• pp.23-30
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• 2008

Ni-20Cr-20Fe-5Nb alloy with or without $Y_2O_3$ was manufactured by mechanical alloying process and consolidated by spark plasma sintering (SPS). The grain size of the alloy with $Y_2O_3$ was smaller than that of alloy without $Y_2O_3$ which results from the effect of $Y_2O_3$ suppressing grain growth. The tensile strength at room temperature was increased by the addition of $Y_2O_3$ but decreased abruptly at temperature above $600^{\circ}C$. It seems to result from the change of deformation mechanism due to fine grain size, that is, grain boundary sliding is predominant at above $600^{\circ}C$ while internal dislocation movement is predominant at below $600^{\circ}C$. After conventional heat treatment process of solution treatment and aging, a small amount of ${\delta}(Ni_3Nb)$ phase was formed in Ni-20Cr-20Fe-5Nb alloy while a large amount of ${\gamma}"(Ni_3Nb)$ was formed in Inconel 718 in the previous report. This is due to exhaustion of Nb content by the formation of NbC during consolidation.

• Journal of Powder Materials
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• v.12 no.6 s.53
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• pp.406-412
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• 2005

This work is to present a new synthesis of metallic glass (MG)/metallic glass (MG) composites using gas atomization and spark plasma sintering (SPS) processes. The MG powders of $Cu_{54}Ni_6Zr_{22}Ti_{18}$ (CuA) and $Ni_{59}Zr_{15}Ti_{13}Nb_7Si_3Sn_2Al_1$(NiA) as atomized consist of fully amorphous phases and present a different thermal behavior; $T_g$ (glass transition temperature) and $T_x$ (crystallization temperature) are 716K and 765K for the Cu base powder, but 836K and 890K for the Ni base ones, respectively. SPS process was used to consolidate the mixture of each amorphous powder, being $CuA/10\%NiA\;and\;NiA/10\%CuA$ in weight. The resultant phases were Cu crystalline dispersed NiA matrix composites as well as NiA phase dispersed CuA matrix composites, depending on the SPS temperatures. Effect of the second phases embedded in the MG matrix was discussed on the micro-structure and mechanical properties.

• Journal of Powder Materials
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• v.22 no.3
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• pp.163-168
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• 2015

Ti alloys are extensively used in high-technology application because of their strength, oxidation resistance at high temperature. However, Ti alloys tend to be classified very difficult to cut material. In this paper, The powder synthesis, spark plasma sintering (SPS), bulk material properties such as electrical conductivity and thermal conductivity are systematically examined on $Ti_2AlN$ and $Ti_2AlC$ materials having most light-weight and oxidation resistance among the MAX phases. The bulk samples mainly consisted of $Ti_2AlN$ and $Ti_2AlC$ materials with density close to theoretical value were synthesized by a SPS method. Machining characteristics such as machining time, surface quality are analyzed with measurement of voltage and current waveform according to machining condition of micro-electrical discharge machining with micro-channel shape.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.48.2-48.2
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• 2011

열전재료는 열과 전기에너지의 상호 변환이 가능한 재료로 이를 이용한 응용제품의 개발이 크게 주목을 받고 있으며, 특히 $Bi_2Te_3$계 합금의 경우 상온에서 가장 우수한 성능지수를 가지는 재료로 많은 연구가 진행되고 있다. 그러나 기존의 $Bi_2Te_3$계 합금은 일방향응고법으로 제조되어 많은 시간과 비용을 필요로 하고, 특히 C축의 Van der Waals 결합으로 인해 기계적 강도가 약하다는 단점이 있었다. 최근 분말야금법을 이용하여 기계적강도를 높이고, 격자산란에 의한 열전도도의 감소로 성능지수를 높일수 있는 방법들이 제시되고 있다. 본 연구에서는 급속응고공정인 가스분무법을 이용하여 n-type의 $95%Bi_2Te_3-5%Bi_2Se_3$분말을 제조하였고, 이 재료의 경우 성형조건에 따라 조직이 쉽게 변하기 때문에 이를 제어하기 위해 단시간동안 고압으로 성형가능한 자기펄스압축성형법(Magnetic Pulsed Compaction)을 이용하여 성형체를 제조하였다. 제조된 성형체는 밀도를 증가시키고 결정립성장을 억제시킬수 있는 방전플라즈마소결법(Spark Plasma Sintering)을 이용하여 소결체로 제조되었으며, 각각의 공정이 열전성능에 미치는 영향을 고찰하였다. OM (Optical Microscope) 및 SEM (Scaning Electric Microscope)을 이용하여 미세구조를 관찰하였고 XRD (X-Ray Diffraction)를 이용하여 상의 변화를 분석하였으며, 상온에서 경도를 측정함으로서 공정조건에 따른 기계적강도를 비교하였다. Seebeck계수는 시편의 양단에 온도차를 주어 발생하는 기전압을 측정하여 계산하였고, 전기비저항은 4point probe방법으로 측정하였다. 전하이동도 및 전하농도는 Hall측정으로부터 구하였고 열전도도를 측정하여 종합적인 열전성능을 평가하였다.

• Journal of the Korean Ceramic Society
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• v.51 no.1
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• pp.43-50
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• 2014

We fabricated undoped and Sb-doped $SnO_2$ thin films on glass substrates by a pulsed laser deposition (PLD) process. Undoped and 2 - 8 wt% $Sb_2O_3$-doped $SnO_2$ targets with a high density level of ~90% were prepared by the spark plasma sintering (SPS) process. Initially, the effects of the deposition temperature on undoped $SnO_2$ thin films were investigated in the region of $100-600^{\circ}C$. While the undoped $SnO_2$ film exhibited the lowest resistivity of $1.20{\times}10^{-2}{\Omega}{\cdot}cm$ at $200^{\circ}C$ due to the highest carrier concentration generated by the oxygen vacancies, 2 wt% Sb-doped $SnO_2$ film exhibited the lowest resistivity value of $5.43{\times}10^{-3}{\Omega}{\cdot}cm$, the highest average transmittance of 85.8%, and the highest figure of merit of 1202 ${\Omega}^{-1}{\cdot}cm^{-1}$ at $400^{\circ}C$ among all of the doped films. These results imply that 2 wt% $Sb_2O_3$ is an optimum doping content close to the solubility limit of $Sb^{5+}$ substitution for the $Sb^{4+}$ sites of $SnO_2$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.7
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• pp.454-458
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• 2017

$Bi_2Te_3$-based alloys have been intensively investigated as active materials for thermoelectric power generation devices from low-temperature (< $250^{\circ}C$) waste heat. In the present study, we fabricated Pb-doped, p-type $Bi_{0.48}Sb_{1.52}Te_3$ polycrystalline bulks by using meltsolidification and spark plasma sintering techniques, and evaluated their thermoelectric transport properties in an effort to develop optimized composition for low-temperature power generation applications. The electronic and thermal transport properties of $Bi_{0.48}Sb_{1.52}Te_3$ could be manipulated by Pb doping. As a result, the temperature for a peak thermoelectric performance (zT) gradually shifted toward higher temperatures with Pb content, suggesting that thermoelectric power generation efficiency can be enhanced by controlled Pb doping.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.10
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• pp.665-670
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• 2016

Prevailing dissemination of machine tools and cutting technology have caused drastic developments of high speed dry machining with work materials of high hardness, and demands on the high-hardness-materials with high efficiency have become increasingly important in terms of productivity, cost reduction, as well as environment-friendly issue. Addition of Si to TiAlN has been known to form nano-composite coating with higher hardness of over 30 GPa and oxidation temperature over $1,000^{\circ}C$. However, it is not easy to add Si to TiAlN by using conventional PVD technologies. Therefore, Ti-Al-Si-N have been prepared by hybrid process of PVD with multiple target sources or PVD combined with PECVD of Si source gas. In this study, a single composite target of Ti-Al-Si was prepared by powder metallurgy of MA (mechanical alloying) and SPS (spark plasma sintering). Properties of he resulting alloying targets were examined. They revealed a microstructure with micro-sized grain of about $1{\sim}5{\mu}m$, and all the elements were distributed homogeneously in the alloying target. Hardness of the Ti-Al-Si-N target was about 1,127 Hv. Thin films of Ti-Al-Si-N were prepared by unbalanced magnetron sputtering method by using the home-made Ti-Al-Si alloying target. Composition of the resulting thin film of Ti-Al-Si-N was almost the same with that of the target. The thin film of Ti-Al-Si-N showed a hardness of 35 GPa and friction coefficient of 0.66.

• Journal of Powder Materials
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• v.22 no.4
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• pp.254-259
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• 2015

$Bi_2Te_3$ related compounds show the best thermoelectric properties at room temperature. However, n-type $Bi_2Te_{2.7}Se_{0.3}$ showed no improvement on ZT values. To improve the thermolectric propterties of n-type $Bi_2Te_{2.7}Se_{0.3}$, this research has Cu-doped n-type powder. This study focused on effects of Cu-doping method on the thermoelectric properties of n-type materials, and evaluated the comparison between the Cu chemical and mechanical doping. The synthesized powder was manufactured by the spark plasma sintering(SPS). The thermoelectric properties of the sintered body were evaluated by measuring their Seebeck coefficient, electrical resistivity, thermal conductivity, and hall coefficient. An introduction of a small amount of Cu reduced the thermal conductivity and improved the electrical properties with Seebeck coefficient. The authors provided the optimal concentration of $Cu_{0.1}Bi_{1.99}Se_{0.3}Te_{2.7}$. A figure of merit (ZT) value of 1.22 was obtained for $Cu_{0.1}Bi_{1.9}Se_{0.3}Te_{2.7}$ at 373K by Cu chemical doping, which was obviously higher than those of $Cu_{0.1}Bi_{1.9}Se_{0.3}Te_{2.7}$ at 373K by Cu mechanical doping (ZT=0.56) and Cu-free $Bi_2Se_{0.3}Te_{2.7}$ (ZT=0.51).

• Journal of Powder Materials
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• v.17 no.4
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• pp.319-325
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• 2010

Electrical discharge machining (EDM) is an attractive machining technique but it requires electrically conductive ceramic materials. In this study, Alumina matrix composites reinforced with CNTs were fabricated through CNT purification, mixing, compaction and spark plasma sintering (SPS) processes. $Al_2O_3$ nanocomposites with the different CNT concentrations were synthesized. The mechanical and electrical characteristics of $Al_2O_3$/CNTs composites were examined in order to apply the materials to the EDM process. In addition, micro-EDM using wire electrical discharge grinding (WEDG) was conducted under the various EDM parameters to investigate the machining characteristics of machined hole by Field Emission Scanning Electron Microscope (FE-SEM). The results show that $Al_2O_3$/CNTs 10%Vol. was more suitable than the other materials because high conductivity and large discharge energy caused violent sparks resulting in bad machining accuracy and surface quality.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.259-259
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• 2012

Mo-Cu 합금은 열전도도, 전기전도도가 우수하고 합금조성에 따라 열팽창계수의 조절이 가능하여 반도체소재, 방열소재, 접점소재 등에 적용가능성이 높은 재료로 주목받고 있다. 또한 상태도 상에서 고용도가 전혀 없기 때문에 박막을 제작하였을 경우, 나노 복합체 형성이 용이하고 질소 분위기에서는 MoN-Cu로 상분리가 가능하여 하드상과 소프트상의 물성을 동시에 보유한 박막 제작이 가능하다. 또한 고온에서 산화반응에 의해 생기는 $MoO_3$, $CuO_3$와 같은 준안정상의 산화물들은 육방정계 구조(HCP)를 가지며 전단특성이 우수하여 자동차 저마찰 코팅재료로써 많은 연구가 진행되고 있다. 반면, Mo-Cu 는 상호간에 고상은 물론 액상에서도 고용도가 전혀 없기 때문에 일반적인 방법으로는 합금화 또는 복합화가 어렵다. 또한 Mo-Cu 박막을 제작할 경우 복수의 타겟을 이용해야 하기 때문에 성분조절과 구조적 제어가 불리하고 공정의 복잡화라는 단점을 가지고 있으며 추가적으로 다른 원소를 첨가하여 3원계, 4원계 이상의 박막을 형성하는 것에 한계가 있다. 따라서 본 연구에서는 위와 같은 문제점을 해결하기 위하여 상호간의 고용도가 없는 재료의 합금화가 용이한 기계적 합금화법(Mechanical Alloying)을 이용하여 Mo-Cu 합금분말을 제조하였고, 준안정상태의 구조의 유지가 가능한 방전 플라즈마 소결법(Spark Plasma Sintering)을 이용하여 합금타겟을 제작하였다. Mo-Cu 박막은 제작된 합금타겟을 사용하여 DC 스퍼터링 공정으로 제작하였다. Mo-Cu 박막의 공정조건으로는 타겟조성, 공정분위기, 가스 비율로 정하여 실험을 진행하였다. 제작된 박막은 자동차 코팅재료로써의 적용가능성을 보기 위해서 내열성, 내식성, 내마모성의 특성을 평가하였다.