• Journal of Power System Engineering
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• v.19 no.3
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• pp.48-54
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• 2015

This paper introduced a design method of soldering station that can control two types of soldering iron heater. At design time, to distinguish two types of soldering iron heater the voltage divider rule has been applied, and the distinguished resistor is inserted to handler of soldering iron to prevent misuse by users. And an algorithm to design a PID controllers is proposed. The proposed controllers parameter which can be easily realized, and are designed by using the input output data from systems, and have outstanding ability making the output response of nonlinear systems similar to the desired one. Temperature control experiments were performed to verify the ability of the suggested controller. As a result, suggested PID controller followed the desired ones, and one soldering station can control the various type of soldering irons in real time.

• 제어로봇시스템학회:학술대회논문집
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• 1990.10a
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• pp.47-51
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• 1990

In the system of contemporary factory, the frequent generation of robot program reduces the efficiency of robot working. In this study, the SIOPS (Soldering and Insertion Offline Programming System) that automatically generates the robot program is presented. The system can change the parameter about soldering and insertion interactively and generate the robot tool path.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10a
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• pp.295-298
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• 1988

For the automation of the manual soldering process through robot technology, two main tasks have to be achieved: Control of various soldering parameters and realization of flexible tool movements like human hands. In this paper a method for attaining these tasks is presented and analyzed.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.153-158
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• 2000

This paper addresses an intelligent robot control system using an off-line programming to teach a precise assembly task of electronic components in a flexible way. The investigated task consists of three job: heat caulking test, soldering on a circuit board, and checking of soldering defects on the back cover of a camera. This study investigates the remodelling of the most complicated cell in terms of the accuracy and fault rate among the twelve cells in a camera back-cover assembly line. We have attempted to enhance back-cover assembly line. We have attempted to enhance soldering quality, to add task flexibility, to reduce failure rate, and to increase product reliability. This study modifies the cell structure, and improves the soldering condition. The developed all system implements the real-time control of assembly with vision data, and realized an easier task teaching on off-line programming.

• 전자공학회논문지 IE
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• v.47 no.1
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• pp.6-11
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• 2010

This research is the result for studding about the IR Rework station which is using a multi-wave IR-heater for soldering and de-soldering on the substrate such as PCB. This IR repair and reflow system is increasing the temperature on the target area under stable temperature control following setting point melting point of solder and lead free solder using IR-heater. So this system is not giving any therrna1 damage on the target PCB and components even closed components. The soldering and de-soldering quality is evaluated through the actual test.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.180.6-180
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• 2001

Welding/soldering automation is one of the most important manufacturing issues in order to lower the cost, increase the quality, and avoid labor problems. An off-line programming, OLP, is one of the powerful methods to solve this kind of diver sity problem, Unless an OLP system is ready for the path optimization in welding/soldering, a waste of time and cost is unavoidable due to an inefficient path in welding/soldering processes. Therefore, this study attempts to obtain path optimization using a genetic algorithm based on artificial intelligences. The problem of the welding path optimization is defined as conventional TSP (traveling salesman problem), but still paths have to go through welding lines. An improved genetic algorithm was suggested and the problem was formulated as a TSP problem considering ...

• Journal of Korea Foundry Society
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• v.29 no.4
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• pp.169-175
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• 2009

Effect of iron and manganese contents on die soldering reaction has been studied in Al-9wt.%Si-0.3wt.%Mg alloy. Ternary ${\alpha}_{hcp}-Al_8Fe_2Si$ and ${\alpha}_{bcc}-Al_8Fe_2Si$ intermetallic compounds formed by interaction diffusion between Al-Si-Mg system alloy melt and SKD61 die steel surface. Thickness of soldering reaction layer in die steel surface decreased as Fe and Mn contents of the melts increased : When Fe content of Al-9wt.%Si-0.3wt.%Mg melts at constant 0.5wt%Mn content was 0.15wt.%, 0.45wt.% and 0.6wt.%, thickness of soldered layer of each alloy was $64.5{\mu}m,\;57.3{\mu}m$ and $46.9{\mu}m$ respectively. For Mn content of the alloy melts at constant 0.45wt.%Fe content was 0.30wt.%, 0.50wt.% and 0.70wt.%, thickness of soldered layer of each alloy was $66.1{\mu}m,\;57.3{\mu}m$ and $48.3{\mu}m$ respectively.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.402-407
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• 2002

Laminate tooling process is a fast and simple method to make metal tools directly for various molding processes such as injection molding in rapid prototyping field. Metal sheets are usually cut, stacked, aligned and joined with brazing or soldering. Through the joining process, all of the metal sheet layers should be rigidly joined. When joining process parameters are not appropriate, there would be defects in the layers. Among various types of defects, non-bonded gaps of the tool surface are of great importance, because they directly affect the surface quality and dimensional accuracy of the final products. If a laminate tool with defects has to be abandoned, it could lead to great loss of time and cost. Therefore a repair method for non-bonded gaps of the surface is essential and has important meaning for rapid prototyping. In this study, a rapid laminate tooling system composed of a CO2 laser, a furnace, and a milling machine was developed. Metal sheets were joined by furnace brazing, dip soldering and adhesive bonding. Joined laminate tools were machined by a high-speed milling machine to improve surface quality. Also, repair brazing and soldering methods of the laminates using the $CO_2$ laser system have been investigated. ill laser repair process, the beam duration, beam power and beam profile were of great importance, and their effects were simulated by [mite element methods. The simulation results were compared with the experimental ones, and optimal parameters for laser repair process were investigated.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.58.1-58.1
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• 2010

In solar cell module manufacturing, single solar cells has to be joined electrically to strings. Copper stripes coated with tin-silver-copper alloy are joined on screen printed silver of solar cells which is called busbar. The bus bar collects the electrons generated in solar cell and it is connected to the next cell in the conventional module manufacturing by a metal stringer using conventional hot air or infrared lamp soldering systems. For thin solar cells, both soldering methods have disadvantages, which heats up the whole cell to high temperatures. Because of the different thermal expansion coefficient, mechanical stresses are induced in the solar cell. Recently, the trend of solar cell is toward thinner thickness below 180um and thus the risk of breakage of solar cells is increasing. This has led to the demand for new joining processes with high productivity and reduced error rates. In our project, we have developed a new method to solder solar cells with a laser heating source. The soldering process using diode laser with wavelength of 980nm was examined. The diode laser used has a maximum power of 60W and a scanner system is used to solder dimension of 6" solar cell and the beam travel speed is optimized. For clamping copper stripe to solar cell, zirconia(ZrO)coated iron pin-spring system is used to clamp both joining parts during a scanner system is traveled. The hot plate temperature that solar cell is positioned during lasersoldering process is optimized. Also, conventional solder joints after $180^{\circ}C$ peel tests are compared to the laser soldering methods. Microstructures in welded zone shows that the diffusion zone between solar cell and metal stripes is better formed than inIR soldering method. It is analyzed that the laser solder joints show no damages to the silicon wafer and no cracks beneath the contact. Peel strength between 4N and 5N are measured, with much shorter joining time than IR solder joints and it is shown that the use of laser soldering reduced the degree of bending of solar cell much less than IR soldering.

• Proceedings of the KIPE Conference
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• 1997.07a
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• pp.318-321
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• 1997

This paper is about improving characteristic of plant by using micro-step driver method in 5 phase step motor for satisfying the condition of low oscillation and high accuracy in soldering machine. We choose open loop control method for minimizing hardware system and use one chip microprocessor, power MOSFET nd some device to realize accurate micro-step driver system.