• 구강회복응용과학지
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• 제19권4호
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• pp.269-279
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• 2003

This study investigated the mechanical properties of precious metal-ceramic alloy joined by the laser-welding and the soldering compared with the parent metal. Twenty-four tensile specimens were cast in precious metal-ceramic alloy and divided into three groups of eight. All specimens in the control group(group 1) were left in the as-cast condition. Group 2 and 3 were the test specimens, which were sectioned at the center. Eight of sectioned specimens were joined by soldering with a propane-oxygen torch, and the remaining specimens were joined by laser-welding. After joining, each joint diameter was measured, and then tested to tensile failure on an Instron machine. Failure loads were recorded, and then fracture stress(ultimate tensile strength), 0.2% yield strength and % elongation calculated. These data for three groups were subjected to a one-way analysis of variance(ANOVA). Neuman-Keuls post hoc test was then used to determine any significant differences between groups. The fracture locations, fracture surfaces were examined by SEM(scanning electron microscope). The results were as follows: 1) The tensile strength and 0.2% yield strength of the soldered group($280.28{\pm}49.35MPa$, $160.24{\pm}26.67MPa$) were significantly less than both the as-cast group($410.99{\pm}13.07MPa$, $217.82{\pm}17.99MPa$) and the laser-welded group($383.56{\pm}59.08MPa$, $217.18{\pm}12.96MPa$). 2) The tensile strength and 0.2% yield strength of the laser-welded group were about each 98%, 99.7% of the as-cast group. There were no statistically significant differences in these two groups(p<0.05). 3) The percentage elongations of the soldered group($3.94{\pm}2.32%$) and the laser-welded group($5.06{\pm}1.08%$) were significantly less than the as-cast group($14.25{\pm}4.05%$) (p<0.05). 4) The fracture of the soldered specimens occurred in the solder material and many porosities were showed at the fracture site. 5) The fracture of the laser-welded specimens occurred also in the welding area, and lack of fusion and a large void was observed at the center of the fracture surface. However, the laser-welded specimens showed a ductile failure mode like the as- cast specimens. The results of this study indicated that the tensile strengths of the laser-welded joints were comparable to those of the as-cast joints and superior to those of the soldered joints.

• 대한치과보철학회지
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• 제37권6호
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• pp.730-740
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• 1999

The purpose of this study was to investigate setting and thermal expansion of dental soldering investments. In order to compare expansion rates and to investigate the effect of water/powder ratio on expansion, setting and thermal expansion of low dental soldering investments were measured under three different water/powder ratio conditions. standard, 20% decreased and 20% increased. Setting expansion of investments was measured by use of dialgauge method. Each measurement was started two minutes later from the beginning of spatulation and recorded every one minute for one hour. Thermal expansion of cylindrical test specimens, 10mm diameter, 50mm length, was recorded in a thermodilatometer at heating rate of $10^{\circ}C$ per minute from $25^{\circ}C\;to\;700^{\circ}C$. The results of this study were obtained as follows: 1. Setting expansion rates under the standard water/powder ratio condition were 0.198% in Speed-E, 0.090% in Deguvest, 0.080% in CM and Hi-temp. Setting expansion of Speed-E was significantly different from those of CM, Deguvest and Hi-temp, and setting expansion of Deguvest was significantly different from those of CM and Hi-temp(p<.05). 2. Under the decreased water/powder ratio condition, there was significant increase in setting expansion of 4 dental soldering investments (p<.05). 3. There were no significant differences in setting expansions of investments except Hi-temp between standard and increased water/powder ratio condition(p<.05). 4. Thermal expansion rates under the standard water/powder ratio condition were 1.923% in Deguvest, 1.629% in Speed-E, 1.619% in Hi-temp and 1.580% in CM. No significant differences in thermal expansions under the standard water/powder ratio condition existed only between Speed-I and Hi-temp(p<.05) 5. Under the decreased water/powder ratio condition, there was significant increase in thermal expansion of CM and Deguvest but decrease in thermal expansion of Speed-E (p<.05). 6. Under the increased water/powder ratio condition, there was significant decrease in thermal expansion of CM, Deguvest and Speed-I but decrease in thermal expansion of Hi-temp(p<.05).

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 B
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• pp.741-742
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• 2006

This paper deals with an efficient superconducting joint method between 2G high superconducting(HTS) wire, YBCO coated conductor(CC). Recently CC is one of the most promising superconducting wire due to high n-value and critical current independency from external magnetic field. It is expected to be used many superconducting application such as fault current limiter, persistent current system and cable etc. In most HTS applications, superconducting magnet is used, and it is necessary to joint between superconducting wire to fabricate superconducting magnet system. A CC tape used in this research consists of copper stabilizer, silver layer, YBCO layer, buffer and substrate. Direct joint using soldering method was inefficient due to resistance of copper, then copper lamination is removed by chemical etching method to reduce resistance between CC tapes. Jointed tapes were fabricated and tested. Transport current through jointed area and induced voltage were measured to characterize the I-V curve. Resistance between CC wire using chemical etching was compared with resistance of direct jointed tapes using soldering method in this paper.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.161-162
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• 2005

2G HTS coated conductor wire consists of textured substrate, buffer layer, superconduct layer, Ag cap layer, stabilizer. For practical application filed, coated conductor have mechanical and electrical stability and environment protection properties. This property Cu and stainless steel strip is laminated to Ag cap layer as stabilizer materials. Lamination process join stabilizer material strip and Ag cap layer with soldering method. we have laminated HTS with continuous dipping soldering process different stabilizer Cu and stainless steel strip and changed lamination process condition. The effect of lamination stabilizer and process condition has been investigated mechanical and electrical properties.

• Journal of Welding and Joining
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• 제19권3호
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• pp.305-310
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• 2001

UBM-coated Si-wafer was fluxlessly soldered with glass substrate in $N_2$ atmosphere using plasma cleaning method. The bulk Sn-37wt.%Pb solder was rolled to the sheet of $100\mu\textrm{m}$ thickness in order to bond a solder disk by fluxless 1st reflow process. The oxide layer on the solder surface was analysed by AES(Auger Electron Spectroscopy). Through rolling, the oxide layer on the solder surface became thin, and it was possible to bond a solder disk on the Si-wafer with fluxless process in $N_2$ gas. The Si-wafer with a solder disk was plasma-cleaned in order to remove oxide layer formed during 1st reflow and soldered to glass by 2nd reflow process without flux in $N_2$ atmosphere. The thickness of oxide layer decreased with increasing plasma power and cleaning time. The optimum plasma cleaning condition for soldering was 500W 12min. The joint was sound and the thicknesses of intermetallic compounds were less than $1\mu\textrm{m}$.

• 구강회복응용과학지
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• 제19권2호
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• pp.75-86
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• 2003

The purpose of this study was to evaluate their mechanical properties after laser-welding or soldering of precious and non-precious dental alloys. For this study, 30 Co-Cr alloy specimens, 15 gold alloy specimens, 15 palladium alloy specimens were casted and seperated on the middle area. 15 sperated Co-Cr specimens and 15 seperated gold alloy specimens were laser welded (GW Group). 15 sperated Co-Cr specimens and 15 sperated gold alloy specimens were soldered by coventional soldering method (GS Group). 15 sperated Co-Cr specimens and 15 seperated palladium alloy specimens were laser welded (PW Group). 15 sperated Co-Cr specimens and 15 sperated palladium alloy specimens were soldered by coventional soldering method (PS Group). Tensile strength, 0.2% yield strength, % elongation were recorded in nine specimens of each group. Bending strength were record in six specimens of each group. These data for four groups were subjected to a two-way analysis of variance(ANOVA). The fracture locations, fractured surfaces were examined by SEM(scanning electron microscope). The results were as following: 1) In the same alloy combination, the tensile strength and 0.2% yield strength and of the laser welded group with same metal combination were significantly less than soldered groups(p<0.05). 2) In the combination of Co-Cr/Palladium, the bending strength of laser welded group were significantly less than that of soldered groups(p<0.05). In the combination of Co-Cr/Gold, the bending strength of laser welded group were significantly higher than that of soldered groups(p<0.05). 3) In the same method of joint, the tensile strength and 0.2% yield strength and bending strength of the Co-Cr/gold were significantly higher than Co-Cr/palladium(p<0.05). 4) There was no significantly statistical difference between each group in the % elongation(p>0.05). 5) The fracture of the laser welded specimens occured in the welding area and a large void was observed at the center of the fracture surface. 6) The fracture of the soldered specimens occured also inthe soldered area and many porpsities were showed at the fracture sites.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.464-466
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• 2009

This study tried to examine the suitability of strip casting process such as PFC (Planar Flow Casting) method for soldering Au-Sn strip. The effect of heat treatment on the tensile behavior and mechanical properties of an Au-Sn strip was investigated through tensile test, micro hardness test, X-ray diffraction (XRD), SEM, and TEM observations. It was apparent that 20-mm width Au-Sn strip could be well produced by using planar flow casting process. Tensile results showed that tensile strength increased from 338.3MPa to 310MPa and plastic strain improved from 0% to 1.5% with heat treatment ($170^{\circ}C$/70 hrs.). The microstructure of Au-Sn strip mainly consisted of two phases; $Au_5Sn(\zeta)$ and AuSn($\sigma$). It was also found that inhomogeneous amorphous local structure continuously changed to the homogeneous two phases microstructure with heat treatment. The fractographical observation after tensile test indicated the cleavage fracture mode of as-casted Au-Sn strip. On the other hand, the heat treated Au-Sn strip showed that fracture propagated along interface between brittle AuSn and ductile $Au_5Sn$ phases. The deformation behavior of strip casted Au-Sn alloy with microstructural evolution and the improve method for ductility of this alloy was also suggested.

• 한국태양에너지학회 논문집
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• 제38권1호
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• pp.45-55
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• 2018

Environmentally benign lead-free solder coated ribbon (e. g. SnCu, SnZn, SnBi${\cdots}$) has been intensively studied to interconnect cells without lead mixed ribbon (e. g. SnPb) in the crystalline silicon(c-Si) photovoltaic modules. However, high melting point (> $200^{\circ}C$) of non-lead based solder provokes increased thermo-mechanical stress during its soldering process, which causes early degradation of PV module with it. Hence, we proposed low-temperature conductive paste (CP) based tabbing method for lead-free ribbon. Modules, interconnected by the lead-free solder (SnCu) employing CP approach, exhibits similar output without increased resistivity losses at initial condition, in comparison with traditional high temperature soldering method. Moreover, 400 cycles (2,000 hour) of thermal cycle test reveals that the module integrated by CP approach withstands thermo-mechanical stress. Furthermore, this approach guarantees strong mechanical adhesion (peel strength of ~ 2 N) between cell and lead-free ribbons. Therefore, the CP based tabbing process for lead free ribbons enables to interconnect cells in c-Si PV module, without deteriorating its performance.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
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• pp.543-548
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• 2000

In this study, an interactive programming method for robot in electronic part assembly task is proposed. Many of industrial robots are still taught and programmed by a teach pendant. The robot is guided by a human operator to the desired application locations. These motions are recorded and are later edited, within the robotic language using in the robot controller, and play back repetitively to perform robot task. This conventional teaching method is time-consuming and somewhat dangerous. In the proposed method, the operator teaches the desired locations on the image acquired through CCD camera mounted on the robot hand. The robotic language program is automatically generated and downloaded to the robot controller. This teaching process is implemented through an off-line programming software. The OLP is developed for an robotic assembly system used in this study. In order to transform the location on image coordinates into robot coordinates, a calibration process is established. The proposed teaching method is implemented and evaluated on an assembly system for soldering electronic parts on a circuit board. A six-axis articulated robot executes assembly task according to the off-line teaching in the system.

• 한국태양에너지학회 논문집
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• 제23권2호
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• pp.91-98
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• 2003

Experimental study for a porous aluminum heat dissipator/or heat sink made by casting method is conducted to evaluate the performance of the porous aluminum heat sinks. The parameters applied for the present study are the manufacturing method. various bonding materials for the bottom plate of heat sink, and their different material, pore size, etc.. The casting method for porous aluminum heat sink is suggested for the best performance of heat dissipation in this experiment. The bottom plate applied by melting aluminum is introduced and proved their excellent characteristics compared with brazing, soldering, and bonding methods. In the present experiment, aluminum with different conductivities, such as AC8A and pure aluminum, are tested and the pure aluminums with the higher conductivity than AC8A shows their improvement of the performance. And the proper dimensions related to the pore size and the height of porous aluminum heat sinks are proposed in the present study.