• Proceedings of the KIPE Conference
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• 1997.07a
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• pp.318-321
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• 1997

This paper is about improving characteristic of plant by using micro-step driver method in 5 phase step motor for satisfying the condition of low oscillation and high accuracy in soldering machine. We choose open loop control method for minimizing hardware system and use one chip microprocessor, power MOSFET nd some device to realize accurate micro-step driver system.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.221.2-221.2
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• 2005

• Proceedings of the KIPE Conference
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• 1998.10a
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• pp.97-100
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• 1998

In this paper, micro step driving method is used for the high performance motion control and low vibration and low noise in an X-Y axis soldering machine for factory automation. The improvement of the electrical and mechanical driving characteristic of a stepping motor is achieved by applying microstep driver.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.10a
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• pp.25-26
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• 2006

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.7
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• pp.4065-4071
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• 2014

The analysis results of the temperature distribution and deformation at the PV cell with a thickness of $200{\mu}m$ according to hot-air temperature at the soldering process of a PV cell and ribbon tend to agree somewhat with the experimental measured values. The best result of the electrical efficiency appears in the module soldered at a hot-air temperature of $390^{\circ}C$. An analysis of the soldering PV cell with a thickness of $150{\mu}m$ at a hot-air temperature of $350^{\circ}C$ confirmed that the maximum deformation was approximately 5.9mm. As the temperature of hot air is set to decrease, the deformation is reduced and it is predicted that the electrical efficiency can be improved.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.10
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• pp.31-36
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• 2018

Fuses are used to protect electric circuits or devices from excess current. Glass-tube fuses are typically used, but problems have arisen due to the mandated switch from conventional solder to lead-free solder. This study used CFD to simulate the phenomenon of molten solder being poured out of a fuse during the soldering process for a fuse cap and fuse element. In addition, a method is proposed to prevent solder from overflowing, and its effectiveness was verified based on the analysis results. The results show that a sufficient increase of the temperature inside the glass tube before soldering and gravity can help to prevent the solder from overflowing.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12
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• pp.1142-1149
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• 2003

The strength and characteristics of the soldering interface of the power semiconductor chip in a power module has been firstly surveyed by the peel strength measurement method. A power module is combined with several power chips which generally has 30∼400$\textrm{mm}^2$ chip area to allow several tens or bigger amps in current rating, so that the traditional methods for interface characterization like shear test could not be applied to high power module. In this study power diode modules were fabricated by using lead-tin solder with 10${\times}$10$\textrm{mm}^2$ or 7${\times}$7$\textrm{mm}^2$ soldering interface. The peel strengths of soldered interfaces were measured and then the microscopic investigation on the fractured surfaces were followed. The peel test indicated that the crack propagated either through the bulk of the soft lead-tin solder which has 55-60 kgf/cm peel strength or along the interface between the solder and the plated nickel layer which has much lower 22 kgf/cm strength. This study showed that the peel test would be a useful method to quantify the solderability as well as to recognize which is the worst interface or the softest material in a power module with a large soldering area.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.9-18
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• 1999

In this study, Metallugical properties between Sn-3.5Ag, Sn-37Pb eutectic solders and Au/Ni/cu substrate according to time span above the melting point were investigated. A conventional reflow soldering machine wert used for this study and time span above the melting point was determined by changing peak soldering temperature and conveyor speed. As results, scallop type intermetallic compounds of $Ni_3Sn_4$ were formed at joint interface and no Cu-Sn compounds were found at all; Ni layer performed as a barrier for Cu diffusion. As the peak soldering temperature increased, thickness of the intermetallic compound layer increased; maximum thickness of the scallop-layer was 2.2$\mu\textrm{m}$. The shape of scallops were transformed from hemi-sphere type to elliptical shape with smaller size. Micro-hardness of the solder joint decreased as the eutectic structure of Sn-3.5Ag and Sn-37Pb increased.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.37-42
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• 2003

In soldering of electronic packaging, the research on substituting lead-free solder materials for Pb-Sn alloys has become active due to environmental and health concerns over the use of lead. The reliability of the solder joint is very important in the development of solder materials and it is known that it is related to wettability of the solder over the substrate and microstructural evolution during soldering. It is also highly affected by type and extent of the interfacial reaction between solder and substrate and therefore, it is necessary to understand the interfacial reaction between solder and substrate completely. In order to predict the intermetallic compound (IMC) phase which forms first at the substrate/solder interface during the soldering process, a thermodynamic methodology has been suggested. The activation energy for the nucleation of each IMC phases is represented by a function of the interfacial energy and the driving force for phase formation. From this, it is predicted that the IMC phase with the smallest activation energy forms first. The grain morphology of the IMC at the solder joint is also explained by the calculations which use the energy. The Jackson parameter of the IMC grain with a rough surface is smaller than 2 but it is larger than 2 in the case of faceted grains.

• Safety and Health at Work
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• v.11 no.2
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• pp.235-240
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• 2020

Background: Cadmium exposure may induce chronic intoxication with renal damage. Silver soldering may be a source of cadmium exposure. Methods: We analyzed working environment measurement data and periodic health screening data from a small-scale silver soldering company with ten workers. Concentrations of cadmium in air from working environment measurement data were obtained. Concentrations of blood and urinary cadmium, urine protein, and urine β2-microglobulin (β2M) were obtained. The generalized linear model was used to identify the association between blood and urine cadmium and urine β2M concentrations. Clinical features of chronic cadmium intoxication focused with toxicological renal effects were described. Results: The mean duration of work was 8.5 years (standard deviation [SD] = 6.9, range = 3-20 years). Cadmium concentrations in air were ranged from 0.006 to 0.015 mg/㎥. Blood cadmium concentration was elevated in all ten workers, with a highest level of 34.6 ㎍/L (mean = 21.288 ㎍/L, SD = 11.304, range = 9.641-34.630 ㎍/L). Urinary cadmium concentration was elevated in nine workers, with a highest level of 62.9 ㎍/g Cr (mean = 22.151 ㎍/g creatinine, SD = 19.889, range = 3.228-62.971 ㎍/g creatinine). Urine β2M concentration was elevated in three workers. Urinary cadmium concentration was positively associated with urine protein concentration (beta coefficient = 10.27, 95% confidence interval = [4.36, 16.18]). Other clinical parameters were compatible with renal tubular damage. Conclusion: Cadmium intoxication may occur at quite low air concentrations. Exposure limit may be needed to be lowered.