• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 2001년도 ICCAS
• /
• pp.104.2-104
• /
• 2001

In the intelligent integrated systems, the delay time must be reduced using highly parallel processors, as well as high throughput performance. In this paper, we propose a new concept for building 3D highly parallel processors using multi-layer printed wiring boards with built-in soldering heater (BISH-PWB). The proposed BISH is realized with the long and narrow cupper wiring pattern on the internal layer in the terminal pattern area. Based on the linearity of the cupper resistance vs. temperature, we can measure the BISH, temperature and its calorific value from the heater voltage and current measurements. If we provide the BISH temperature control systems for each BISH, selective multi-point soldering can be realized with same ...

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
• /
• pp.119-124
• /
• 1999

This paper presents new approach to technology pattern recognition of camera back cover and test of soldering. In real-time implementing of pattern recognition camera back cover and test of soldering, the MVB-03 vision board has been used. Image can be captured from standard CCD monochrome camera in resolutions up to 640$\times$480 pixels. Various options re available for color cameras, a synchronous camera reset, and linescan cameras. Image processing os performed using Texas Instruments TMS320C31 digital signal processors. Image display is via a standard composite video monitor and supports non-destructive color overlay. System processing is possible using c30 machine code. Application software can be written in Borland C++ or Visual C++

• 한국신재생에너지학회:학술대회논문집
• /
• 한국신재생에너지학회 2009년도 추계학술대회 논문집
• /
• pp.387-389
• /
• 2009

PV module is manufactured by several steps such as cell sort, tabbing & string, lay-up, lamination processes. In oder to manufacture PV module, solar cell must be placed in high temperature. Soldering Process in high temperature is important because it directly influences electric output performance changes of solar cell in solar cell module. We consider applying momentary high temperature, while soldering solar cell, and expect change electric characteristics of PV module. In this paper, we measure electric output characteristics of solar cells after those are applied with high temperature changes for two seconds. From these results, we confirm with application of high temperature, $I_{sc}$ increase and $V_{oc}$ slightly decreases.

• 대한치과기공학회지
• /
• 제6권1호
• /
• pp.11-14
• /
• 1984

The auther performed this experimental study on cervical margin distortion in preheating method during soldering. 1. In soldering methods, the method using the furnace has less distortion than the method using open-flame and longer the bridge spon, the larger the distortions. 2. Table Ⅰ Showed that buccal margin, lingual margin, mesial margin and distal margin had respectively 0.01mm, 0.02mm, 0.03mm, 0.03mm closer adaptation in 3 unit bridge than in 5 unit bridges. 3. Table II showed that buccal margin, lingual margin, mesial margin and distal margin had respectively 0.06mm, 0.07mm, 0.11mm, 0.05mm closer adaptation in 3 unit bridge than in 5 unit bridges.

• 대한인간공학회지
• /
• 제29권6호
• /
• pp.943-949
• /
• 2010

When PCB soldering is performed with microscope due to the electronic components' microminiaturization, workers' awkward upper body postures and difficulties being in focus among lens, object and eyes are one of reasons for productivity decline. The object of this study is to investigate the level of difficulties of work and the extent of productivity improvement by changing work interfaces from the work using microscope to the work using LCD monitor. Independent variables was usage of microscope and image system and dependent variables were upper body segments including neck, shoulder, back, and waist, task convenience and eye fatigue. The Visual Analogue Scale (10cm) was used for questionnaire and one way ANOVA (two levels) and two sample t-test were conducted. In addition, RULA rating was conducted for working postures. The result showed that interface changes of LCD monitor, suggested by productivity comparison per one Man Hour, highly contributed to work convenience and productivity improvement.

• 반도체디스플레이기술학회지
• /
• 제11권2호
• /
• pp.63-69
• /
• 2012

As decreasing size of chips, the need of wafer level packaging is increased in semi-conductor and display industries. Temperature uniformity is a crucial factor in vacuum soldering process to guarantee quality of bonding between chips and wafer. In this paper, a stepwise iterative algorithm has been suggested to obtain output profile of each heat source. Since this algorithm is based on open-loop stepwise iterative experimental technique, it is easier to implement and cost effective than real time feedback controls. Along with some experiments, it was shown that the suggested algorithm can remarkably improve temperature uniformity of wafer during whole heating process compared with the ordinary manual trial-and error method.

• 설비공학논문집
• /
• 제14권1호
• /
• pp.1-9
• /
• 2002

The thermal response of electronic components during infrared reflow soldering is studied by a two-dimensional numerical model. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated. Parametric study is also performed to determine the thermal response of electronic components to various conditions such as conveyor velocities, exhaust velocities and emissivities. The results of this study can be used in selecting the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly stresses.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2003년도 하계학술대회 논문집 B
• /
• pp.1365-1367
• /
• 2003

In this paper, element technologies such as soldering. arrangement and lamination processes for photovoltaic module manufacture were examined and described as main processes. Especially solder paste and temperature condition in soldering process, loss factor in arrangement process and process conditions in lamination process are investigated to minimize the electrical loss. As a results, temperature condition in soldering process was found to be critical to contact resistance of electrode and life-time. Productivity of the process decreases dramatically by physical damage during arrangement process. Pressure level and press condition of upper chamber in lamination process were important parameters for the reliability. According to the test result of photovoltaic module, electrical properties dropped about $5{\sim}25%$ after 5 years.

• 한국산학기술학회논문지
• /
• 제17권2호
• /
• pp.325-333
• /
• 2016

본 연구는 솔더링 시스템에서 세라믹 인두기의 온도 제어를 위한 제어기 설계 알고리즘을 제안하고, 제어 실험으로 그 유효성을 보였다. 솔더링 시스템의 세라믹 인두기 온도 응답 특성이 매우 느리며 제어 입력에 비선형인 특성을 갖고 있어 정밀한 모델링과 제어기 설계에 어렵다. 본 연구에서는 전제부 변수가 제어 입력이고 결론부가 전달함수인 퍼지 규칙들로 구성된 TSK 퍼지 모델로 세라믹 인두기 온도 특성을 표현하였다. 퍼지 모델 결론부의 전달함수는 계단 입력 응답으로부터 구한다. 세라믹 인두기 온도 응답 특성이 매우 느리므로 완전한 계단 입력 응답을 구하기가 어렵다. 불완전한 계단 입력 응답으로 전달함수를 구하는 방법으로 유전적 알고리즘(GA)을 사용하는 것을 제안하며, 예제들로 제안한 그 유효성을 보였다. 또한 TSK 퍼지 모델로부터 퍼지 제어기를 설계하는 방법도 제안하며 그 유효성을 예제 시뮬레이션으로 확인하였다. 제안한 방법들을 세라믹 인두기 온도 제어에 적용하여 실험 하였다. 퍼지 모델의 규칙은 7개로 구성되었으며 퍼지 제어기의 결론부는 PI 제어기로 하였다. 제안한 퍼지 제어기의 실험 결과는 선형 제어기보다 우수하였으며 퍼지 PID 제어기를 사용한 기존 연구 결과에 못지않았다.

• 마이크로전자및패키징학회지
• /
• 제7권3호
• /
• pp.55-61
• /
• 2000

직경 0.3 mm의 Sn-37Pb 및 Sn-3.5Ag-0.7Cu 솔더볼을 솔더링 온도와 기판의 이송속도 (conveyer speed)를 변화시켜 가며 리플로 솔더링 하였다. 리플로 솔더링 온도범위는 Sn-37Pb의 경우 220~$240^{\circ}C$, Sn-3.5Ag-0.7Cu의 경우는 230~ $260^{\circ}C$로 하였다. 실험결과, 전단강도 측면에서 최적 솔더링 조건을 Sn-37Pb의 경우 솔더링 온도 및 컨베이어 속도가 각각 $230^{\circ}C$, 0.7~0.8 m/min이고, Sn-3.5Ag-0.7Cu의 경우 각각 $250^{\circ}C$, 0.6 m/min으로 나타났다. 또한 최고 전단강도 값은 Sn-37Pb의 경우는 555 gf 이고 Sn-3.5Ag-0.7Cu의 경우는 617gf이다. 접합계면의 분석결과 Cu6Sn5층의 두께는 Sn-37Pb의 경우는 1.13~1.45 $\mu\textrm{m}$이고 Sn-3.5Ag-0.7Cu의 경우는 2.5~4.3 $\mu\textrm{m}$이다.