• 대한치과보철학회지
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• 제27권2호
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• pp.201-218
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• 1989

The purpose of this study was to evaluate the influence of attachment technique on mechanical properties and microstructures of wrought wires. The wires tested in this study were precious metal wires: PGP (Platinum-Gold -Palladium), Elastic #12, Denture Clasp, Standard, Jelenko No. 2, Degulor-Klammerdraht, DM (Dong Myung) and base metal wire : Ticonium. Each wire was divided into three groups, and each group was heat treated as embedding, cast to, and soldering state. Heat treated sample was evaluated by tensile test, bending test, microhardness test, element analysis and microstructure test. The obtained results were as follows: 1. In tensile test, cast to and soldering procedures have an effect on wrought wire clasp as hardening heat treatment. 2. Maximum bending strength was significantly increased in Elastic #12, Denture Clasp, Standard, and DM in cast to procedure. 3. Ticonium showed the highest Victors hardness number, followed by PGP, and there was no significant difference in other wrought wires. In cast to and soldering procedure, Victors hardness number was significantly increased in precious wrought wires. 4. The precious wrought wire showed typical fibrous structure and this was disappeared in cast to and soldering procedure. But physical properties were not influenced by this phenomenon.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.236-237
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• 2007

Lamination of coated conductor is important to commercialize for electrical stabilizer and mechanical support. It should be known the properties of soldering interface and the variation of superconductivity on coated conductor with various kinds of solders. $SmBa_2Cu_O_x$ thin films were deposited by co-evaporation method (EDDC, Evaporation using Drum in Dual Chambers). 4 kinds of solders were used to investigate interface properties of SmBCO conductors. In-Bi solder could maintain good connection.

• 대한기계학회논문집A
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• 제21권6호
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• pp.951-960
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• 1997

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.

• 한국주조공학회지
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• 제29권4호
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• pp.169-175
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• 2009

Effect of iron and manganese contents on die soldering reaction has been studied in Al-9wt.%Si-0.3wt.%Mg alloy. Ternary ${\alpha}_{hcp}-Al_8Fe_2Si$ and ${\alpha}_{bcc}-Al_8Fe_2Si$ intermetallic compounds formed by interaction diffusion between Al-Si-Mg system alloy melt and SKD61 die steel surface. Thickness of soldering reaction layer in die steel surface decreased as Fe and Mn contents of the melts increased : When Fe content of Al-9wt.%Si-0.3wt.%Mg melts at constant 0.5wt%Mn content was 0.15wt.%, 0.45wt.% and 0.6wt.%, thickness of soldered layer of each alloy was $64.5{\mu}m,\;57.3{\mu}m$ and $46.9{\mu}m$ respectively. For Mn content of the alloy melts at constant 0.45wt.%Fe content was 0.30wt.%, 0.50wt.% and 0.70wt.%, thickness of soldered layer of each alloy was $66.1{\mu}m,\;57.3{\mu}m$ and $48.3{\mu}m$ respectively.

• 대한치과보철학회지
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• 제40권2호
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• pp.156-171
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• 2002

The purpose of this study was to measure and compare the strains produced by screw-tightening implant frameworks fabricated by aye different fabrication methods; (1) one-piece cast using plastic sleeve, (2) one-piece cast using gold cylinder, (3) laser welding, (4) soldering, and (5) electrical discharge machining, and also to measure and compare the strains produced when the order of screw tightening was changed A research model incorporating eighteen strain gages was made to measure the fit of implant frameworks in three dimensions. Three implants aligned in an arc were fixed on the top ends of the L-shape aluminum bars of the research model, and standard abutments were joined to the implants with abutment screws. Five types of implant framework were placed on the abutments and screwed by a torque wrench using 10 Ncm. Under the conditions of this study, the following conclusions were drawn: 1. The electrical discharge machining group showed the smallest magnitude of strain, followed by the soldering group, the laser welding group, the one-piece cast group using gold cylinder, and the one-piece cast group using plastic sleeve. However, among the magnitude of strain for the remaining groups except the electrical discharge machining group, there were not significant differences. 2. When the order of screw tightening was changed, there were not significant differences in the magnitude of strain. 3. In comparison with the electrical discharge machining group, the laser welding group and the one-piece cast groups showed greater horizontal distortion and the soldering group showed greater horizontal and vertical distortion.

• 청정기술
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• 제14권2호
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• pp.103-109
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• 2008

본 연구에서는 솔더페이스트(solder paste)로 솔더링후 표면에 잔류하는 플럭스(flux)의 효과적인 세정성능 평가방법 개발을 목적으로 하였다. 솔더링시 플럭스의 퍼짐오차를 줄이기 위해 본 연구에서 고안한 금속치구를 이용하여 1,1,1-TCE 및 플럭스 제거용 몇 가지 대표 준수계 대체세정제에 대하여 세정시간에 따른 플럭스 제거율을 무게측정법으로 측정, 비교하였다. 세정시간 변화에 따른 각 세정제의 세정효율을 측정한 결과 측정값들의 상대표준편차(RSD)가 약 4%이하로 data의 신뢰성이 확인되었다. 따라서 솔더페이스트로 솔더링후 대체세정제의 잔류플럭스의 세정성능 평가시험에 본 연구에서 적용한 금속치구(metal test tool)를 이용한 평가방법이 유력한 방법으로 적용가능할 것으로 판단된다. 그리고 이 평가방법을 적용한 결과 현재 상용화 되어 있는 우수하다고 알려진 몇 가지 대표 준수계 대체세정제 중 ST100SX와 750H가 고활성 플럭스에 대한 세정력이 우수한 성능을 나타냈으나 기존의 1,1,1-TCE에 비해서는 현저히 떨어짐을 확인할 수 있었다.

• 보존과학연구
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• 통권22호
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• pp.81-92
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• 2001

The replica experiment of golden bell excavated from the East Three-Story Pagoda at the Gamunsa temple was carried out in order to know the handiwork technique of ancient granule. The size of 0.3mm granule was attached to the golden bell which was 3.4mm bell body by soldering. When we tried to attach the granule by a modern metalwork, we could know that this technique was hard to make the replica bell. We could prove how to adhere strongly to the golden granule by tension testing. First of all, we made the soldering of the same composition as the golden bell excavated from the Gamunsa temple and then prepared specimens for testing to measure the tension strength. It showed that the broken position was not a soldering part. This result showed how the ancient granule could maintain without a break for a long time.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.89-98
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• 2001

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shock teal. $(Cu,Ni)_6Sn_5$-type intermetallic compound of which thickness is about 5 micron was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was found at the solder joint and the newly developed product was superior to conventions; one in terms of productivity and reliability.

• 한국군사과학기술학회지
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• 제23권6호
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• pp.574-581
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• 2020

This paper describes the stacking effect for Ceramic Column Grid Array(CCGA) packages used for satellites. Reflow Soldering Process suitable for CCGA package with back structure was set as the process development goal to meet European Cooperation for Space Standardization(ECSS) standard. After analyzing the stacking effect according to the type of CCGA, it is verified by applying it to the CCGA Reflow Soldering Process. In order to confirm the validity of the staking effect analyzed in terms of vibration and thermal characteristics, it is verified through actual specimen production. It analyzes the cause of crack occurrence in the CCGA package and estimates the crack generation point using previously acquired inspection data.

• Journal of Welding and Joining
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• 제15권2호
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• pp.36-42
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• 1997

In this paper, stability of initial strength at solder joint with lead free solders, such as Sn-In (52-48%) and Sn-Ag (96.5-3.5wt%) was studied. To obtain at solder joint with high quality, it is very important to control the temperature at the interface of solder joints. It is found that the thermal EMF (electro motive force) occurs betwee lead frame and copper pad on a substrate during reflow soldering process using heated tip. As a result of control the temperature at interface of solder joints, variation of initial strength at solder joint decreases from about $\pm40%$ to $\pm20%$, and it is realized Pb free soldering process using Sn/In and Sn-Ag solder paste.