• Proceedings of the KWS Conference
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• 1997.05a
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• pp.162-164
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• 1997

• Proceedings of the KWS Conference
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• 1997.05a
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• pp.159-161
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• 1997

• Proceedings of the KWS Conference
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• v.43
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• pp.40-42
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• 2004

• Proceedings of the KWS Conference
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• 1997.10a
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• pp.29-32
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• 1997

• Journal of Welding and Joining
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• v.23 no.3
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• pp.61-67
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• 2005

Since lead (Pb)-free solders for electronics have higher melting points than that of eutectic Sn-Pb solder, they need higher soldering temperatures. In order to decrease the soldering temperature we tried to coat Sn-Bi layer on $Sn-3.5\%Ag$ solder by electroplating, which applies the mechanism of transient liquid phase bonding to soldering. During heating Bi will diffuse into the $Sn-3.5\%Ag$ solder and this results in decreasing soldering temperature. As bonding samples, the 1608 capacitor electroplated with Sn, and PCB, its surface was finished with electroless-plated Ni/Au, were selected. The $Sn-95.7\%Bi$ coated Sn-3.5Ag was supplied as a solder between the capacitor and PCB land. The samples were reflowed at $220^{\circ}C$, which was lower than that of normal reflow temperature, $240\~250^{\circ}C$, for the Pb-free. As experimental result, the joint of $Sn-95.7\%Bi$ coated Sn-3.5Ag showed high shear strength. In the as-reflowed state, the shear strength of the coated solder showed 58.8N, whereas those of commercial ones were 37.2N (Sn-37Pb), 31.4N (Sn-3Ag-0.5Cu), and 40.2N (Sn-8Zn-3Bi). After thermal shock of 1000 cycles between $-40^{\circ}C$ and $+125^{\circ}C$, shear strength of the coated solder showed 56.8N, whereas the previous commercial solders were in the range of 32.3N and 45.1N. As the microstructures, in the solder $Ag_3Sn$ intermetallic compound (IMC), and along the bonded interface $Ni_3Sn_4$ IMC were observed.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.58.1-58.1
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• 2010

In solar cell module manufacturing, single solar cells has to be joined electrically to strings. Copper stripes coated with tin-silver-copper alloy are joined on screen printed silver of solar cells which is called busbar. The bus bar collects the electrons generated in solar cell and it is connected to the next cell in the conventional module manufacturing by a metal stringer using conventional hot air or infrared lamp soldering systems. For thin solar cells, both soldering methods have disadvantages, which heats up the whole cell to high temperatures. Because of the different thermal expansion coefficient, mechanical stresses are induced in the solar cell. Recently, the trend of solar cell is toward thinner thickness below 180um and thus the risk of breakage of solar cells is increasing. This has led to the demand for new joining processes with high productivity and reduced error rates. In our project, we have developed a new method to solder solar cells with a laser heating source. The soldering process using diode laser with wavelength of 980nm was examined. The diode laser used has a maximum power of 60W and a scanner system is used to solder dimension of 6" solar cell and the beam travel speed is optimized. For clamping copper stripe to solar cell, zirconia(ZrO)coated iron pin-spring system is used to clamp both joining parts during a scanner system is traveled. The hot plate temperature that solar cell is positioned during lasersoldering process is optimized. Also, conventional solder joints after $180^{\circ}C$ peel tests are compared to the laser soldering methods. Microstructures in welded zone shows that the diffusion zone between solar cell and metal stripes is better formed than inIR soldering method. It is analyzed that the laser solder joints show no damages to the silicon wafer and no cracks beneath the contact. Peel strength between 4N and 5N are measured, with much shorter joining time than IR solder joints and it is shown that the use of laser soldering reduced the degree of bending of solar cell much less than IR soldering.

• The Journal of Korean Academy of Prosthodontics
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• v.34 no.4
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• pp.869-902
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• 1996

Flexion of a metal/ceramic fixed partial denture(EPD) frameworks under function can cause fracture of porcelain or deterioration of the cement seal. This study evaluated the flexion characteristics of three-unit mandibular FPD frameworks, repacing the second pre-molar under compressive load(200g, 400g). Testing was accompished with real-time holographic interferometry, using 6 porcelain fused-to metal frameworks. Tested alloys were non-precious alloy(Heracles, Holland), semi-precious alloy(Degudent U, Germany) and precious alloy(Degudent H, Germany). Changes of the fringe patterns according to the heat treatment(porcelain firing cycle), various loads(200g, 400g), occlusal forms(occlusal porcelain veneering, facial porcelain veneering), various alloys and post-soldering units were compared. Dental study model(Nissan dental products, Inc. D51DP-500A, Japan) and six 3-unit metal/ceramic fixed partial denture frameworks were used as experimental materials. 36 holograms were taken on fixed dental study model by using the 10mW He-Ne laser and real-time holographic interferometry. On the basis of this study, the following conclusions can be drawn : 1. In the frameworks for facial porcelain veneering, the semi-precious alloy framework was least deformed and precious alloy framework, non-precious alloy framework orderly before heat treatment, and the deformation was not shown great difference among three alloys after heat treatment and post-soldering. 2. In the frameworks for occlusal porcelain veneering, the precious alloy framework was greatest deformed and the deformation was not difference between semi-precious alloy framework and non-precious alloy framework before, after heat treatment, and the deformation was not shown great difference among three alloys after post soldering. 3. In the non-precious alloy frameworks for facial porcelain veneering and occlusal porcelain veneering, the deformation was greatly decreased after heat treatment and conversely increased after post-soldering. 4. In the semi-precious alloy framework for facial porcelain veneering, the deformation was not detectable after heat treatment and increased after post-solder. And in the frame-work for occlusal porcelain veneering, the deformation was slightly decreased after heat treatment and increased after post-soldering. 5. In the precious alloy framework for facial porcelain veneering, the deformation was greatly decreased after heat treatment and increased after post-soldering, And in the framework for occlusal porcelain veneering, the deformation was greatly decreased after heat treatment and decreased after post-soldering.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.402-407
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• 2002

Laminate tooling process is a fast and simple method to make metal tools directly for various molding processes such as injection molding in rapid prototyping field. Metal sheets are usually cut, stacked, aligned and joined with brazing or soldering. Through the joining process, all of the metal sheet layers should be rigidly joined. When joining process parameters are not appropriate, there would be defects in the layers. Among various types of defects, non-bonded gaps of the tool surface are of great importance, because they directly affect the surface quality and dimensional accuracy of the final products. If a laminate tool with defects has to be abandoned, it could lead to great loss of time and cost. Therefore a repair method for non-bonded gaps of the surface is essential and has important meaning for rapid prototyping. In this study, a rapid laminate tooling system composed of a CO2 laser, a furnace, and a milling machine was developed. Metal sheets were joined by furnace brazing, dip soldering and adhesive bonding. Joined laminate tools were machined by a high-speed milling machine to improve surface quality. Also, repair brazing and soldering methods of the laminates using the $CO_2$ laser system have been investigated. ill laser repair process, the beam duration, beam power and beam profile were of great importance, and their effects were simulated by [mite element methods. The simulation results were compared with the experimental ones, and optimal parameters for laser repair process were investigated.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.10
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• pp.66-76
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• 2002

Automated welding and soldering are an important manufacturing issue in order to lower the cost, increase the quality, and avoid labor problems. An off-line programming, OLP, is one of the powerful methods to solve this kind of diversity problem. Unless an OLP system is ready for the path optimization in welding and soldering, the waste of time and cost is unavoidable due to inefficient paths in welding and soldering processes. Therefore, this study attempts to obtain path optimization using a genetic algorithm based on artificial intelligences. The problem of welding path optimization is defined as a conventional TSP (traveling salesman problem), but still paths have to go through welding lines. An improved genetic algorithm was suggested and the problem was formulated as a TSP problem considering the both end points of each welding line read from database files, and then the transit problem of welding line was solved using the improved suggested genetic algorithm.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.47-52
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• 2001

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shuck test. $(Cu,Ni)_6/Sn_5$-type intermetallic compound of which thickness is about 5 $\mu\textrm{m}$ was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was fecund at the solder joint. The newly developed product was superior to conventional one in terms of productivity and reliability.