• Korean Chemical Engineering Research
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• v.49 no.2
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• pp.161-167
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• 2011

Recent popularity in mobile electronics requires higher standard on the mechanical strength of electronic packaging. Thus, the method of soldering between chip and substrate in electronic packaging process is changing from conventional method using intermetallic compound to a new method using organic solderability preservatives (OSP) in order to improve the stability and the reliability of final product. Since current OSPs have several serious problems like thermo-stability during packaging process, however, it is necessary to develop new OSPs having thermo-stability. The main purpose of this study is to develop various thermo-stable OSPs based upon poly(vinyl pyridine-co- methylmethacrylate) and to evaluate their anti-oxidation property protecting Cu pad, thermo-stability and solubility to acid- or alcohol-containing aqueous solution during pos-fluxing. All OSPs showed not only good anti-oxidation property, thermo-stability and solubility but also more advantages like low cost, less odor, and less hygroscopic.

• The Journal of Korean Academy of Prosthodontics
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• v.42 no.4
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• pp.425-442
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• 2004

Statement of problem: A difficulty in achieving a passive-fitting prosthesis can be overcome by individual crown restoation of multiple implants. But individualized crown has another difficulty in control of contact tightness and stress distribution. Purpose: This in vitro study is to evaluate the stress distribution and the magnitude in the supporting tissues around Endopore implants with different crown lengths, interproximal contact tightness, and the splinting effects. Material & methods: Three Endopore implants($4.1{\times}9mm$) were placed in the mandibular posterior edentulous area distal to the canine and photoelastic model was made with PL-2 resin(Measurements Group, Raleigh, USA). Restorations were fabricated in two crown lengths: 9, 13 mm. For non-splinted restorations, individual crowns were fabricated on three custom-milled titanium abutments. After the units were cemented, 4 levels of interproximal contact tightness were evaluated: open, ideal($8{\mu}m$ shim stock drags without tearing), medium($40{\mu}m$), and heavy($80{\mu}m$). For splinted restorations, 3-unit fixed partial dentures were fabricated. This study was examined under simulated non-loaded and loaded conditions(6.8 kg). Photoelastic stress analysis was carried out to measure the fringe order around the implant supporting structure. Results: 1. When restorations were not splinted, the more interproximal contact tightness was increased among the three implants, the more stress was shown in the cervical region of each implant. When crown length was increased, stresses tended to increase in the apex of implants but there were little differences in stress fringes. 2. When nonsplinted restorations were loaded on the first or third implant, stresses were increased in the apex and cervical region of loaded implant. Regardless of interproximal contact tightness level, stresses were not distributed among the three implants. But with tighter interproximal contact, stresses were increased in the cervical region of loaded first or third implant. 3. When the nonsplinted restorations were not loaded, there were little stresses on the supporting structure of implants, but low level stresses were shown in the splinted restorations even after sectioning and soldering. 4. With splinted restorations, there were little differences in stresses between different crown lengths. When splinted restorations were loaded, stresses were increased slightly on the loaded implant, but relatively even stress distribution occurred among the three implants. Conclusions: Splinting the crowns of adjacent implants is recommended for Endopore implants under the overloading situation.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

• Journal of Environmental Health Sciences
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• v.8 no.1
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• pp.67-80
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• 1982

In order to evaluate the psychosomatic health status of metal manufacturing industries workers and their working environments, the present study was conducted from March 1, 1981 to the end of September 1981. The data was obtained from the samples of metal manufacturing industries in Kyung-In Area and their 1, 162 employees. In addition, the 803 urban residents including students, office clerks, and general publics were sampled as control groups to compare with factory employees in psychosomatic analysis. The basic tool employed in the present study was the Todai Health Index (THI) which modified CMI and was developed by Tokyo University Research Team of Japan. The results of the present study were summarized as follows: 1. Working environments of the factories 1) The data shows that fabrication shop produced the highest noise level ranging from 91 to 96 dB (A) and iron and steel shop had the lowest noise level ranging from 81 to 86 dB (A). 2) Dust concentration was the highest in iron foundry shop ($3.8 mg/m^3$) and the lowest in fabrication shop ($1.2 mg/m^3$). 3) WBGT above threshold limit values (T.L.V.) was noted in steel shop (38$\circ$C) and iron foundry shop (34$\circ$C) 4) The concentration of Sulfur dioxide ($SO_2$)was 30.5ppm at steel shop and 12.0ppm at iron foundry shop. 5) The concentration of carbon monoxide (CO) was 140.0ppm at steel shop and 110.5ppm at iron foundry shop. 6) The atmospheric lead concentration was $0.49 mg/m^3$ at soldering shop. 2. The responses of psychosomatic complaints were much higher in steel shops group than in other manu-facturing group, except the response of aggressiveness. 3. The responses of psychosomatic complaints were much higher in industrial workers than in urban residents, except the responses of depression and aggressiveness (p < 0.01 ). 4. The psychosomatic symptoms which industrial workers and urban residents complained frequently were nervousness. agressiveness and lie scale in order. 5. The responses of psychosomatic complaints by sex were much higher in female group than in male group, except the response of aggressiveness. 6. The responses of psychosomatic complaints by age were that both the female and male group showed an increasing tendency in the all items, except the response of depression as age was increasing. 7. The responses of psychosomatic complaints by the length of services were that both the female and male group showed a tendency of increasing in physical symptoms as work years increased. 8. The responses of psychosomatic complaints were higher in unmarried group in the score of nervousness, aggressiveness, mental irritability and irregular life.

• The korean journal of orthodontics
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• v.26 no.5 s.58
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• pp.591-599
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• 1996

This study was undertaken to investigate the cytotoxicity of orthodontic wires after doing various treatments to the wires. 018x025 inch Stainless steel(A) and Co-Cr(B) wires were used and each of them were divided into 4 groups. A-1 and B-1 groups were as received state, and A-2 and B-2 groups were heat treated. A-3 and B-3 groups were electropolished after heat treatment, and A-4 and B-4 groups were soldered with Ag-solder. Each group had 3 wires and these were sterilized with Ethylene Oxide gas. We used human gingival fibroblast cell culture and agar overlay technique to investigate the cytotoxicity of each group of wires. The cytotoxicity of wire was assessed using reaction index (zone index/lysis index). The findings of this study were as follows. 1. Both of the stainless steel wire and Co-Cr wire showed no cytotoxicity in as received state. 2. Heat treatment or electropolishing of the wires had no effect on the cytotoxicity of the wires 3. Soldered stainless steel wires showed a little wider zone of discoloration than soldered Co-Cr wires, but the zone index and cytotoxicity(reaction index) was not different. 4. Soldered wires showed moderate cytotoxicity in both of the wires.

• Journal of Conservation Science
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• v.28 no.2
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• pp.175-184
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• 2012

A purpose of this research is to find out characteristic of bronze artifacts and gold ornaments excavated from Xiongnu tombs No. 2~4 at Duurlig Nars in Mongolia through scientific analysis of them. The Tombs are comparatively small. There were still lots of relics remaining although the tombs had been already robbed. Also the tombs are evaluated important since the origin of them show coexisting of chinese and northern style. First of all, an analysis result about bronze vessels found in this site, they have high lead(Pb) content and relatively low tin(Sn) content, as compared with the Bronze Han Mirror and End-fittings of Bronze Parasol Rib. Especially in case of bronze tray and bronze lamp from the no. 2 tomb and also bronze cauldron from the no. 4 tomb contain only 1wt% of tin which means binary alloy composition(Cu-Pb). Also, in the case of gold ornaments found in the no. 2 tomb, they have comparatively high purity. And the research suppose that the high possibility of that they were used soldering using alloy of Au-Cu or diffused bonding(using malachite and copper oxide) for joining gold grains of gold granulation ornament. Further scientific research and analysis in Mongolia and other countries will provide more clues to solve mystery of Xiongnu culture.

• Journal of Welding and Joining
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• v.30 no.5
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• pp.64-69
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• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Journal of the Korea Fashion and Costume Design Association
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• v.10 no.2
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• pp.139-147
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• 2008

This study aims to investigate and analyze sewing methods according to the shape of the inner collar among women's jeogories in order to understand such sewing techniques, which has emerged during modern Korea, and has utilized diversly for the shape of the jeogori's inner collar and as part of the inner collar. The study was conducted on relics possessed between 1900 to 1990, or 515 pieces of jeogories. Jeogories were classified into single-layered and double-layered jeogories according to the shape of their composition. Inner collar shapes of jeogories have also been categorized. It was found that single-layered jeogories comprise 49 inner collars with shapes identical to those of the outer collars. Double-layered jeogories comprise of the following three types: 43 pieces of godae close, 18 pieces in which the inner collar of the outer bodice are cut without a connecting line and the inner collar of the godae and inner bodice are suspended, and 405 pieces in which the share of the inner collar is identical to that of the outer collar. From the shapes of inner collars mentioned above, the following sewing methods have been derived: 1. To sew the inner collar of single-layered jeogories, a seaming technique had been used. 2. Among the inner collars of a double-layered jeogori, godae close was sewn with only a short part of the godae by using a lining, and then finished with overage and blind stitches. Godae close was a covenient way to attach inner collars, and also saved much time. 3. Inner collars with shapes identical to the outer collar are divided into two groups: those with outer collars cut out fellowing the cloth without seam and shifted towards the linings and used as an inner collar, and those with outer collars made of outer linings and inner collar of inner linings. To sew the collar, paste and needlework had been employed, where the methods of needlework were divided into blind stitch, overage stitch, and catch stitch. In sewing with paste, only godae was blind stitched or overage stitched, and the remainder had been painted with paste or the collar had been finished with heated soldering iron after the entire inner collar was painted with paste.

• Conservation Science in Museum
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• v.26
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• pp.143-160
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• 2021

The Seoul Baekje Museum has been conducting excavations at the Ancient Tomb Complex in Seokchon-dong, Seoul (Historic Site No. 243), known to be tombs of the royal family and the ruling class during the Hanseong period of the Baekje Kingdom. In this study, gold earrings that were revealed during the excavation underwent scientific analysis and conservation treatment. Stereo microscopy, SEM, X-ray imaging, CT, and XRF were applied in the analysis, and the characteristics, internal structure, and composition of the earrings as well as their production method were investigated. The results confirmed that the main hoops of the gilt-bronze earrings were made of copper cores gilt using mercury amalgamation. The findings also revealed that the hexahedron in the middle pendant was made by connecting small rings using molten gold powder, and the pendant sphere at the end was formed by soldering two hemispheres. As for the two thin-hoop earrings, they showed similar surface compositions but were made using different methods, with one made from a copper core wrapped with a gold plate and the other made by bending a gold rod. The gold content varied depending on the item and the place of measurement, but overall the earrings showed a relatively high gold content of approximately 19 to 21K. The purity of the golden earrings and the sophisticated manufacturing techniques applied indicate the high status of the buried person and of the tomb complex in Seokchong-dong.