• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.6
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• pp.449-453
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• 2021

Interest and investment in renewable energy have increased worldwide, highlighting the need for renewable energy. Solar energy was the most promising energy of all renewable energy sources, and it has the highest investment value. Because photovoltaics require a certain amount of area for installation, high density and high output performance are required. Shingled module is a promising technology in that they are featured by higher density and higher output compared to the conventional modules. Shingled technology uses a laser scribing to divide solar cells that are to be bonded with electrically conductive adhesive (ECA) to produce and connect strings, which has a higher output in the same area than the conventional modules. In the process of producing solar modules, metal ribbons are used to interconnect cells, but they are also needed for string connections in shingled solar cells. Accordingly, in this study, we researched the interconnection that best suits the connector that joins the string to the string. The module outputs produced under the conditions of the string interconnection were compared and analyzed.

• Korean Journal of Metals and Materials
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• v.47 no.12
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• pp.842-851
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• 2009

The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.

• Korean Journal of Metals and Materials
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• v.49 no.8
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• pp.635-641
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• 2011

The effect of high shear speed on shear force, shear energy and fracture surface was investigated for the solder joint of a $Sn-_{3.0}Ag-_{0.5}Cu$ ball. For both ENIG and OSP pads, the shear force increased with an increase in shearing speed to 0.3 m/s. However, for an ENEPIG pad, the shear force increased with an increase in shear speed to 0.6 m/s and kept almost constant afterward. The shear energy decreased with an increase in shearing speed for ENIG and OSP pads. For the ENEPIG pad, however, the shear energy almost remained constant in a shearing speed range 0.3-3.0 m/s. The fracture mode analysis revealed that the amount of brittle fracture for the ENIG and the OSP pads increased with shearing speed, and a complete brittle fracture appeared at 1.0 m/s for ENIG and 2.0 m/s for OSP. However, the ENEPIG pad showed only a ductile fracture until 0.25 m/s, and a full brittle fracture didn't occur up to 3.0 m/s. The fracture mode matched well with the shear energy. The results from the high speed shear test of SAC305 were similar to those of SAC105.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.73-79
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• 2022

In this study, a reaction study between Ga, which has recently been spotlighted as a low-temperature bonding material, and Cu, a representative electrode material, was conducted to investigate information necessary for low-temperature soldering applications. Interfacial reaction and intermetallic compound (IMC) growth were observed and analyzed by reacting Ga and Cu/Au substrates in the temperature range of 80-200℃. The main IMC growing at the reaction interface was CuGa₂ phase, and AuGa₂ IMC with small particle sizes was formed on the upper part and Cu₉Ga₄ IMC with a thin band shape on the lower part of the CuGa₂ layer. CuGa₂ particles showed a scallop shape, and the particle size increased without significant shape change as the reaction time increased, similar to the case of Cu₆Sn₅ growth. As a result of analyzing the CuGa₂ growth mechanism, the time exponent was calculated to be ~3.0 in the temperature range of 120-200℃, and the activation energy was measured to be 17.7 kJ/mol.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.11-18
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• 2022

Recently, as flexible electronic device-related technologies have received worldwide attention, the development of wiring and bonding technologies using liquid metals is required in order to improve problems such as formability in the manufacturing process of flexible devices and performance and durability in the bending state. In response to these needs, various studies are being conducted to use gallium and gallium-based alloys (eutectic Ga-In and eutectic Ga-In-Sn, etc.) liquid metals, with low viscosity and excellent electrical conductivity without toxicity, as low-temperature bonding materials. In this paper, the latest research trends of low-temperature bonding technology using gallium and gallium-based alloys are summarized and introduced. These technologies are expected to become important base technologies for practical use in the fields of manufacturing flexible electronic devices and low-temperature bonding in microelectronic packages in the future.

• Industry Promotion Research
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• v.8 no.3
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• pp.111-123
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• 2023

The purpose of this study is to examine the structural relationship and confirm the effect of labor as a civil servant in charge of civil affairs how excessive social support and delayed tension affect psychological exhaustion. The results are as follow. First, as a result of analyzing the structural relationship between Emotional Labor, social support, perceived stress, and psychological exhaustion of Civil Affairs Officials, Emotional Labor of civil Civil Affairs Officials has a positive effect on social support, perceived stress, and psychological exhaustion. Social support had a significant negative effect on psychological exhaustion. Perceived stress was found to have a positive effect on psychological exhaustion. Second, as a result of soldering the labor effect of social support and involved tension in the relationship between labor and psychological burnout of public officials in charge of financial resources, a partial mediating effect was confirmed.The object should be used to first respond to and show the reinforcement of social support and the reduction of painted pressure, identified as labor variables, before farmers appear.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.1
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• pp.35-42
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• 2024

Recently, with the miniaturization and high integration of semiconductor chips, the bump bridge phenomenon caused by fine pitches is drawing attention as a problem. Accordingly, Cu pillar bump, which can minimize the bump bridge phenomenon, is widely applied in the semiconductor package industry for fine pitch applications. When exposed to a high-temperature environment, the thickness of the intermetallic compound (IMC) formed at the joint interface increases, and at the same time, Kirkendall void is formed and grown inside some IMC/Cu and IMC interfaces. Therefore, it is important to control the excessive growth of IMC and the formation and growth of Kirkendall voids because they weaken the mechanical reliability of the joints. Therefore, in this study, isothermal aging evaluation of Cu pillar bump joints with a CS (Cu+ Sn-1.8Ag Solder) structure was performed and the corresponding results was reported.

• The Journal of Korean Academy of Prosthodontics
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• v.23 no.1
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• pp.39-59
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• 1985

The purpose of this study was to investigate how gap distances of 0.13mm, 0.15mm, 0.20mm, and 0.30mm affects solder joint strength from gold alloys and nickel-chromium base alloys and to examine the composition of solder gold, the solder joint of gold alloys and nickel-chromium base alloys. The tensile test specimens were prepared in the split stainless steel mold with a half dumbbell shape 2.5mm in diameter and l2mm in length. 6 pairs of specimens of each gap distance group of gold alloys and nickel-chromium base alloys were made and 48 pairs of all specimens were soldered with solder gold of 666 fineness. All soldered specimens were machined to a uniform diameter and then a tensile load was applied at a cross-head speed of 0.10mm/min using Instron Universal Testing Machine, Model 1115. The fractured specimens at solder gold of solder joint fracture with each gap distance of 0.13mm, 0.15mm, 0.20mm, and 0.30mm were examined under the Scanning Electron Microscope, JSM-35c and the composition of solder gold, the solder joint of gold alloys and nickel-chromium base alloys was analyzed by Electron Probe Micro Analyzer. The results of this study were obtained as follows: 1. In case of soldering of gold alloys, the tensile strength between gold alloys showed $37.33{\pm}2.52kg/mm^2$ at 0.13, $39.14{\pm}3.35kg/mm^2$ at 0.15mm, $43.76{\pm}2.97kg/mm^2$ at 0.20mm, and $49.18{\pm}4.60kg/mm^2$ at 0.30mm. There was statistically significant difference at each gap distance, and so the greater increase of gap distance showed the greater tensile strength. 2. In case of soldering of nickel-chromium base alloys, the tensile strength between nickel-chromium base alloys showed $34.84{\pm}4.26kg/mm^2$ at 0.13mm, $37.25{\pm}2.49kg/mm^2$ at 0.15mm, $42.91{\pm}4.32kg/mm^2$ at 0.20mm, and $46.93{\pm}4.21kg/mm^2$ at 0.30mm. There was not statistically significant difference only between 0.13mm and 0.15mm and bet ween 0.20 mm and 0.30mm, but generally the greater increase of gap distance showed the greater tensile strength. 3. The greater increase of gap distance shoed less porosities in solder gold at solder joint fracture. 4. In solder gold Au, Cu, Ag, Zn, and Sn were composed and Au and Cu were mostly distributed uniformly. 5. In solder joints of solder gold and gold alloys Au, Cu, Ag, Zn, and Sn were composed in solder gold and Au, Cu, Ag, Pt, and Pd were composed in gold alloys. Au and Cu of solder gold and gold alloys were mostly distributed uniformly and the diffusion of other elements except Pt and Pd around the solder joint was not almost found. In solder joints of solder gold and nickel-chromium base alloys Au, Cu, Ag, Zn, and Sn were composed in solder gold and Ni, Cr, and Al were composed in nickel-chromium base alloys. Au and Cu of solder gold and Ni and Cr of nickel-chromium base alloys were mostly distributed uniformly and the diffusion of other elements except Cr around the solder joint was not almost found.

• Conservation Science in Museum
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• v.27
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• pp.147-164
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• 2022

Over 200,000 Korean cultural heritage items are currently located abroad. They have made their way to 22 countries under different circumstances and with unique backgrounds. While some of them continue to contribute to promoting Korean culture around the world, others cannot be exhibited due to damage or poor condition. In view of these circumstances, the Overseas Korean Cultural Heritage Foundation (OKCHF) has since 2013 provided museums and art galleries abroad with support for the conservation, restoration, and utilization of the Korean cultural heritage items that they house. As a part of these efforts and on the occasion of the 120th anniversary of the diplomatic relationship between the Republic of Korea and the Kingdom of Belgium in 2021, a gilt-bronze case for acupuncture needles dating to the Goryeo period (918-1392) from the collection of the Royal Museums of Art and History (RMAH), Belgium was brought to Korea for conservation treatment. The primary purpose of this conservation treatment was to restore the original form of the relic and slow to the degree possible the progress of corrosion. The conservation treatment of the gilt-bronze case followed the fundamental order of conservation treatment: removal of corrosive substances, stabilization, and reinforcement. Since this was the first case of restoring metallic cultural properties under the abovementioned support program by the OKCHF, special methodologies distinct from those available in overseas institutions were required. Diverse scientific methods (e.g., X-ray inspection, CT scanning, 3D microscopy) were applied to identify the metalcraft techniques used in the Goryeo period. The analysis found that several designs, including lotus and scrollwork, were exquisitely engraved on the surface of the case by making dots using a round-edged chisel. A bronze plate engraved with designs was rolled into a cylindrical form. The ends were overlapped by 2 to 3 centimeters and then attached to each other by silver soldering. The overlapping ends were welded flat with nearly no gaps. As the final process in the production, the case was lavishly gilt with gold powder using amalgam gilding. The conservation treatment of the gilt-bronze case for acupunctural needles in the RMAH collection restored the original form of the relic and arrested further corrosion. Above all, it revived the historic and academic value of the overseas Korean cultural heritage through scientific analysis.

• The Journal of Korean Academy of Prosthodontics
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• v.52 no.4
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• pp.331-337
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• 2014

In conventional bar- and clip-retained overdentures, all errors during impression making and cast fabrication result in non-passive fit of bars. SFI bar is prefabricated and assembled in the patient's mouth without the use of soldering, laser welding or conventional bonding techniques, thus reducing stress transmission to, bone loss around the implants and leading to fewer errors and lower costs. A clinical case will be presented below to demonstrate the use of the SFI Bar (Stress Free on Implant Bar) to restore an severe atrophy edentulous maxilla. In this case, no lateral stress could be applied to the implants due to the telescopic design of the bar joints. However, periodic recall check is necessary and long-term clinical results are required.