• Korean Chemical Engineering Research
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• 제49권2호
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• pp.161-167
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• 2011

최근 모바일 전자 제품의 많은 사용으로 인하여 전자 기판의 기계적 충격에 대한 기준이 강화되고 있다. 따라서, 전자 기판의 패키징 공정에서 칩과 기판 사이 솔더 볼의 접합방법은 제품의 안정성과 신뢰성 확보를 위하여 기존의 금속간 화합물을 사용하는 방식에서 유기 솔더 보존제(OSP)를 사용하는 방법으로 전환되고 있다. 그러나 기존의 OSP들은 공정상에서의 열안정성 등의 여러 가지 단점이 발견되어 이를 보완하기 위한 새로운 OSP의 개발이 요구되고 있다. 본 연구에서는 폴리(비닐피리딘-co-메틸메타아크릴레이트) 기반 열안정성 OSP를 개발하여 구리 박막에 적용, 분석 및 평가함으로써 구리 박막에 대한 산화방지성, OSP의 열 안정성 및 후융해 공정 시 산 또는 알코올 수용액에 의해서 쉽게 용해되는 특성 등을 조사하였다. 그 결과 합성된 공중합체는 구리 시편과의 접착성이 우수하며 산 또는 알코올 성분에 쉽게 용해되고, 높은 열 안정성 및 산화방지 특성을 갖고 있을 뿐만 아니라 기존의 알릴아민이나 아크릴아마이드 함유 공중합체에 비하여 가격, 취성, 흡습성 면에서 더 좋은 특성을 보여주었다.

• 대한치과보철학회지
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• 제42권4호
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• pp.425-442
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• 2004

Statement of problem: A difficulty in achieving a passive-fitting prosthesis can be overcome by individual crown restoation of multiple implants. But individualized crown has another difficulty in control of contact tightness and stress distribution. Purpose: This in vitro study is to evaluate the stress distribution and the magnitude in the supporting tissues around Endopore implants with different crown lengths, interproximal contact tightness, and the splinting effects. Material & methods: Three Endopore implants($4.1{\times}9mm$) were placed in the mandibular posterior edentulous area distal to the canine and photoelastic model was made with PL-2 resin(Measurements Group, Raleigh, USA). Restorations were fabricated in two crown lengths: 9, 13 mm. For non-splinted restorations, individual crowns were fabricated on three custom-milled titanium abutments. After the units were cemented, 4 levels of interproximal contact tightness were evaluated: open, ideal($8{\mu}m$ shim stock drags without tearing), medium($40{\mu}m$), and heavy($80{\mu}m$). For splinted restorations, 3-unit fixed partial dentures were fabricated. This study was examined under simulated non-loaded and loaded conditions(6.8 kg). Photoelastic stress analysis was carried out to measure the fringe order around the implant supporting structure. Results: 1. When restorations were not splinted, the more interproximal contact tightness was increased among the three implants, the more stress was shown in the cervical region of each implant. When crown length was increased, stresses tended to increase in the apex of implants but there were little differences in stress fringes. 2. When nonsplinted restorations were loaded on the first or third implant, stresses were increased in the apex and cervical region of loaded implant. Regardless of interproximal contact tightness level, stresses were not distributed among the three implants. But with tighter interproximal contact, stresses were increased in the cervical region of loaded first or third implant. 3. When the nonsplinted restorations were not loaded, there were little stresses on the supporting structure of implants, but low level stresses were shown in the splinted restorations even after sectioning and soldering. 4. With splinted restorations, there were little differences in stresses between different crown lengths. When splinted restorations were loaded, stresses were increased slightly on the loaded implant, but relatively even stress distribution occurred among the three implants. Conclusions: Splinting the crowns of adjacent implants is recommended for Endopore implants under the overloading situation.

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.83-90
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• 2017

본 연구에서는 미세피치 패키지 적용을 위한 기초 실험으로 thin ENEPIG(Electroless Nickel Electroless Palladium Immersion Gold) 도금층을 형성하여 솔더링 특성을 평가하였다. 먼저, Sn-3.0Ag-0.5Cu (SAC305) 솔더합금에 대한 thin ENEPIG 도금층의 젖음 특성이 평가되었으며, 순차적인 솔더와의 반응에 대한 계면반응 및 솔더볼 접합 후 고속 전단 시험을 통한 접합부 기계적 신뢰성이 평가되었다. 젖음성 시험에서 침지 시간이 증가함에 따라 최대 젖음력은 증가하였으며, 5초의 침지 시간 이후에는 최대 젖음력이 일정하게 유지되었다. 초기 계면 반응 동안에는 $(Cu,Ni)_6Sn_5$ 금속간화합물과 P-rich Ni 층이 SAC305/ENEPIG 계면에서 관찰되었다. 연장된 계면반응 후에는 P-rich Ni 층이 파괴 되었으며, 파괴된 P-rich Ni 층 아래에는 $(Cu,Ni)_3Sn$ 금속간화합물이 생성되었다. 고속 전단 시험의 경우, 전단속도가 증가함에 따라 취성 파괴율이 증가하였다.

• 한국환경보건학회지
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• 제8권1호
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• pp.67-80
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• 1982

In order to evaluate the psychosomatic health status of metal manufacturing industries workers and their working environments, the present study was conducted from March 1, 1981 to the end of September 1981. The data was obtained from the samples of metal manufacturing industries in Kyung-In Area and their 1, 162 employees. In addition, the 803 urban residents including students, office clerks, and general publics were sampled as control groups to compare with factory employees in psychosomatic analysis. The basic tool employed in the present study was the Todai Health Index (THI) which modified CMI and was developed by Tokyo University Research Team of Japan. The results of the present study were summarized as follows: 1. Working environments of the factories 1) The data shows that fabrication shop produced the highest noise level ranging from 91 to 96 dB (A) and iron and steel shop had the lowest noise level ranging from 81 to 86 dB (A). 2) Dust concentration was the highest in iron foundry shop ($3.8 mg/m^3$) and the lowest in fabrication shop ($1.2 mg/m^3$). 3) WBGT above threshold limit values (T.L.V.) was noted in steel shop (38$\circ$C) and iron foundry shop (34$\circ$C) 4) The concentration of Sulfur dioxide ($SO_2$)was 30.5ppm at steel shop and 12.0ppm at iron foundry shop. 5) The concentration of carbon monoxide (CO) was 140.0ppm at steel shop and 110.5ppm at iron foundry shop. 6) The atmospheric lead concentration was $0.49 mg/m^3$ at soldering shop. 2. The responses of psychosomatic complaints were much higher in steel shops group than in other manu-facturing group, except the response of aggressiveness. 3. The responses of psychosomatic complaints were much higher in industrial workers than in urban residents, except the responses of depression and aggressiveness (p < 0.01 ). 4. The psychosomatic symptoms which industrial workers and urban residents complained frequently were nervousness. agressiveness and lie scale in order. 5. The responses of psychosomatic complaints by sex were much higher in female group than in male group, except the response of aggressiveness. 6. The responses of psychosomatic complaints by age were that both the female and male group showed an increasing tendency in the all items, except the response of depression as age was increasing. 7. The responses of psychosomatic complaints by the length of services were that both the female and male group showed a tendency of increasing in physical symptoms as work years increased. 8. The responses of psychosomatic complaints were higher in unmarried group in the score of nervousness, aggressiveness, mental irritability and irregular life.

• 대한치과교정학회지
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• 제26권5호
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• pp.591-599
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• 1996

본 연구는 널리 이용되고 있는 두 종류의 교정용 호선에 다양한 처리를 가한 후 호선의 세포독성을 비교, 평가하고자 시행하였다. 018x025 inch 굵기의 stainless steel 호선과 Co-Cr 호선을 실험 재료로 선택하여 stainless steel 호선을 A 호선, Co-Cr호선을 B 호선이라 칭하였으며 각각의 호선을 다시 가해진 처리에 따라 4군으로 나누었다. A-1군과 B-1군은 제작된 상태 그대로의 호선을 이용하였으며 A-2, B-2군은 기기를 이용하여 $850^{\circ}\;F$에서 4분간 열처리하였다. A-3, B-3군은 같은 방법으로 열처리한 후 표면의 불순물을 제거하기 위해 전해연마를 시행하였고 A-4, B-4군은 소량의 은납(Ag-solder)을 납착(soldering) 하였다. 사람의 치은 섬유아세포를 배양하고 agar overlay법을 이용하여 각군의 호선의 세포독성을 검사하였으며 세포독성을 반응지수(탈색지수/용해지수)로 평가하여 다음의 결론을 얻었다. 1. stainless steel 호선과 Co-Cr 호선 모두 제작된 그대로의 상태에서는 세포독성을 나타내지 않았다. 2. 두 호선에 대한 열처리나 전해연마는 호선의 세포독성에 영향을 미치지 못하였다. 3. 은납이 납착된 stainless steel호선은 은납이 납착된 Co-Cr호선에 비해 더 넓은 범위의 탈색을 나타냈으나 탈색지수와 세포독성(반응지수)에서는 차이를 보이지 않았다. 4. 은납이 납착된 호선은 두 호선 모두에서 중증도의 세포독성을 나타냈다.

• 보존과학회지
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• 제28권2호
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• pp.175-184
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• 2012

본 연구는 몽골 도르릭나르스 유적 2호, 3호 및 4호분에서 출토된 청동제 및 금제 유물에 대한 과학적 분석 결과로부터 각 유적 출토품의 특징을 알아보는데 그 목적이 있다. 몽골의 흉노무덤인 도르릭나르스 유적 2호, 3호 및 4호분은 비교적 소형이고, 도굴 된 상태였음에도 불구하고 많은 유물이 다양하게 출토되었다. 특히 출토 유물에는 중국계 유물과 북방계 유물이 공존하고 있어 매우 중요한 유적으로 평가되고 있다. 먼저 청동 용기류의 경우 중국제인 한경이나 일산살 꼭지의 성분 조성과는 달리 주석에 비하여 납의 함유량이 높은 특징을 보였는데, 특히 2호의 청동쟁반, 청동등잔 그리고 4호의 청동솥의 경우는 주석이 1wt% 정도로 적게 함유되어 있어 Cu-Pb의 2원계 합금 조성을 보였다. 금제품의 경우는 2호분 장식품의 제작에 비교적 높은 순도의 금이 사용된 것으로 조사되었으며, 금제 누금 장식의 금 알갱이의 접합에는 금과 구리를 합금한 금땜이 사용되었거나 확산접합(말라카이트나 산화구리 화합물 가루를 사용함)에 의하여 접합했을 가능성이 높았다. 향후 몽골지역 뿐만 아니라 다른 지역의 흉노 무덤 출토품에 대한 과학적 조사 및 분석이 더 많이 진행된다면 흉노 문화에 대한 더 많은 문제들을 해결할 수 있는 실마리를 제공하게 될 것이다.

• Journal of Welding and Joining
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• 제30권5호
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• pp.64-69
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• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• 한국의상디자인학회지
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• 제10권2호
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• pp.139-147
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• 2008

This study aims to investigate and analyze sewing methods according to the shape of the inner collar among women's jeogories in order to understand such sewing techniques, which has emerged during modern Korea, and has utilized diversly for the shape of the jeogori's inner collar and as part of the inner collar. The study was conducted on relics possessed between 1900 to 1990, or 515 pieces of jeogories. Jeogories were classified into single-layered and double-layered jeogories according to the shape of their composition. Inner collar shapes of jeogories have also been categorized. It was found that single-layered jeogories comprise 49 inner collars with shapes identical to those of the outer collars. Double-layered jeogories comprise of the following three types: 43 pieces of godae close, 18 pieces in which the inner collar of the outer bodice are cut without a connecting line and the inner collar of the godae and inner bodice are suspended, and 405 pieces in which the share of the inner collar is identical to that of the outer collar. From the shapes of inner collars mentioned above, the following sewing methods have been derived: 1. To sew the inner collar of single-layered jeogories, a seaming technique had been used. 2. Among the inner collars of a double-layered jeogori, godae close was sewn with only a short part of the godae by using a lining, and then finished with overage and blind stitches. Godae close was a covenient way to attach inner collars, and also saved much time. 3. Inner collars with shapes identical to the outer collar are divided into two groups: those with outer collars cut out fellowing the cloth without seam and shifted towards the linings and used as an inner collar, and those with outer collars made of outer linings and inner collar of inner linings. To sew the collar, paste and needlework had been employed, where the methods of needlework were divided into blind stitch, overage stitch, and catch stitch. In sewing with paste, only godae was blind stitched or overage stitched, and the remainder had been painted with paste or the collar had been finished with heated soldering iron after the entire inner collar was painted with paste.

• 박물관보존과학
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• 제26권
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• pp.143-160
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• 2021

한성백제박물관에서는 백제 한성기 대표적인 왕실과 중앙세력의 분묘군으로 알려진 사적 제243호 석촌동 고분군의 학술 발굴조사를 실시하고 있으며, 그 과정에서 출토된 금제이식의 과학적 분석 및 보존처리를 실시하였다. 분석은 실체현미경 관찰, SEM, X-선 촬영, CT, XRF 분석을 실시하였고, 이를 통해 유물 특성, 내부 구조와 성분 등을 확인하고 제작 기법을 알아보고자 하였다. 연구결과, 금동이식의 주환은 동심재에 수은 아말감 금도금하였고, 중간식의 육면체는 금 분말을 용융시켜 소환을 이어 붙였으며 수하식 구체는 반구체 두 개를 땜하여 붙인 것을 확인하였다. 세환이식 2건은 표면 성분이 서로 유사하지만 동심재에 금판을 감싸 제작한 것과 금봉을 구부려 제작한 것으로 제작기법에 차이가 있음을 밝혔다. 금 함량은 유물에 따라, 측정 위치에 따라 다르지만 약 19~21K로 비교적 높은 금 함량을 보이며 정교한 공예기술로 만들어진 이식이라는 점에서 피장자의 우월적 지위와 석촌동 고분군의 위상을 판단할 수 있는 자료가 될 것으로 보인다.