• 대한금속재료학회지
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• 제49권3호
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• pp.237-242
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• 2011

The effect of shearing speed on the shear force and energy of Sn-0Ag-0.5Cu solder ball was investigated. Various UBM (under bump metallurgy)'s on Cu pads were used such as ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold; Ni/Pd/Au), ENIG (Electroless Nickel, Immersion Gold; Ni/Au), OSP (Organic Solderability Preservative). To fabricate a shear test specimen, a solder ball, $300{\mu}m$ in diameter, was soldered on a pad of FR4 PCB (printed circuit board) by a reflow soldering machine at $245^{\circ}C$. The solder bump on the PCB was shear tested by changing the shearing speed from 0.01 m/s to 3.0 m/s. As experimental results, the shear force increased with a shearing speed of up to 0.6 m/s for the ENIG and the OSP pads, and up to 0 m/s for the ENEPIG pad. The shear energy increased with a shearing speed up to 0.3 m/s for the ENIG and the OSP pads, and up to 0.6 m/s for the ENEPIG pad. With a high shear speed of over 0 m/s, the ENEPIG showed a higher shear force and energy than those of the ENIG and OSP. The fracture surfaces of the shear tested specimens were analyzed, and the fracture modes were found to have closer relationship with the shear energy than the shear force.

• Current Photovoltaic Research
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• 제8권4호
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• pp.124-128
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• 2020

Output power of photovoltaic (PV) modules installed outdoors decreases every year due to environmental conditions such as temperature, humidity, and ultraviolet irradiations. In order to promote the installation of PV modules, the reliability must be guaranteed. One of the important factors affecting reliability is intermetallic compounds (IMC) layer formed in ribbon solder joint. For this reason, various studies on soldering properties between the ribbon and cell have been performed to solve the reliability deterioration caused by excessive growth of the IMC layer. However, the IMC layer of the PV module interconnected by multi-wires has been studied less than using the ribbon. It is necessary to study soldering characteristics of the multi-wire module for improvement of its reliability. In this study, we analyzed the growth of IMC layer of the PV module with multi-wire and the degradation of output power through damp-heat test. The fabricated modules were exposed to damp-heat conditions (85 ºC and 85 % relative humidity) for 1000 hours and the output powers of the modules before and after the damp-heat test were measured. Then, the process of dissolving ethylene vinyl acetate (EVA) as an encapsulant of the modules was performed to observe the IMC layer. The growth of IMC layer was evaluated using OM and FE-SEM for cross-sectional analysis and EDS for elemental mapping. Based on these results, we investigated the correlation between the IMC layer and output power of modules.

• 마이크로전자및패키징학회지
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• 제29권1호
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• pp.7-16
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• 2022

최근 자동차 산업은 친환경, 편리함, 안전성과 같은 키워드를 중심으로 기술 발전이 이뤄지면서 빠르게 변화하고 있다. 친환경에 대한 관심과 맞물려 그린 카(green car)가 이목을 끌고 사용자 편의를 위한 첨단 기술 및 기능을 갖춘 고성능 자동차가 시장에 출시되고 있다. 발전하는 차량 성능으로 인해서 이에 맞는 전장품의 개발 또한 필수적이다. 자동차용 전장품은 고온, 고습, 열충격, 진동, 오염 등 복합적인 환경에서 사용되기 때문에 여타 산업에 비해 높은 수준의 신뢰성 검증이 필요하다. 특히, 부품 내 접합부의 신뢰성을 확보하여 무리없이 기능을 수행하고 운전자의 안전을 보장하는 것이 핵심이다. 따라서 저자는 차량 전장품의 최근 동향을 살펴보고 신뢰성을 향상시킬 수 있는 접합 방법으로 솔더링, TLP 접합 및 소결접합을 소개하였다.

• Current Photovoltaic Research
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• 제11권2호
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• pp.44-48
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• 2023

In heterojunction technology (HJT) solar cells, low-temperature curing paste is used because the passivation layer deteriorates at high temperatures of 200℃ or higher. However, manufacturing HJT photovoltaic (PV) modules is challenging due to the weak peel strength between busbar electrodes and cells after soldering process. For this issue, the electrode thicknesses of the busbars of the HJT solar cell were analyzed, and the peel strengths between electrodes and wires were measured after soldering using an infrared (IR) lamp. As a result, the electrodes printed by the screen printing method had a difference in thickness due to screen mask. Also, as the thickness of the electrode increased, the peel strength of the wire increased.

• 마이크로전자및패키징학회지
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• 제25권3호
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• pp.13-19
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• 2018

본 연구에서는 태양광 접속함 모듈 적용을 위한 유연 솔더(Sn-Pb) 및 무연 솔더(Sn-3.0Ag-0.5Cu 및 Sn-1.0Ag-0.7Cu-1.6Bi-0.2In)의 특성을 비교 평가하였다. 접속함 내에는 전압 및 전류 검출용 모듈, 고내압용 다이오드가 실장된 정류모듈 등 다양한 모듈이 내장되어있다. 본 연구에서는 솔더링특성, 인쇄성, 솔더형상 검사, X-ray를 이용한 솔더 내 void 검사 및 접합강도를 측정하였고, 무연 솔더 합금의 공정최적화는 step 1과 step 2로 구분하여 검토를 실시하였다. Step 1은 유연 솔더와 무연 솔더 페이스트 인쇄 검사 시험을 1차와 2차로 나누어 실험을 진행하였고 printability는 void 함량 및 접합강도의 상관관계로 검토하였다. 전체적으로 유연 솔더의 특성은 무연 솔더에 비하여 상대적으로 우수하였다. Step 2는 리플로우 공정의 최고점 온도 변화에 따른 접합부 특성 변화를 관찰하였다. 리플로우 최고 온도가 증가할수록 접합부 내의 void 함량이 2~4% 정도 감소하였고, 접합강도는 약 0.5 kgf 범위내에서 큰 차이 없이 나타났다. 기판 표면처리종류에 있어서는 ENIG 표면처리가 OSP 및 Pb-free 솔더 표면처리보다 우수한 접합강도를 나타내었다. 1종류의 무연솔더와 OSP 표면처리로 접합된 태양광 접속함 모듈의 500 싸이클 열충격 신뢰성시험 전후에 전기적 특성변화는 0.3% 내의 범위에서 안정적으로 작동함을 확인하였다.

• 한국자동차공학회논문집
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• 제12권2호
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• pp.182-189
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• 2004

The application of adhesively bonded components is increasing in various industries such as automobile, aircraft, IC packages, and soldering techniques. In spite of such wide application in adhesively bonded components, nondestructive test techniques applying to adhesively bonded components have not been clearly established yet. In this paper, characteristics of ultrasonic test on interfaces of adhesively bonded components have been investigated by calculating transmission coefficient theoretically and experimentally. From the experimental results, the optimum conditions to establish frequencies for adhesively bonded homogeneous and dissimilar components are 4∼6 MHz and 2∼4 MHz, respectively.

• 한국초전도ㆍ저온공학회논문지
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• 제3권1호
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• pp.6-10
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• 2001

Stress/stram dependencies of the critical current $I_c$ in AgMgNi sheathed multifilamentary Bi(2212) superconducting tapes were evaluated at 77K, 0T. The external reinforcement was accomplished by soldering Ag-Mg tapes to sin91e side or both sides of the sample. With the external reinforcement. the strength of tapes increased but $I_c$, decreased The $I_c$, degradation characteristic according to the external reinforcement was improved markedly in terms of the stress although it appeared less rectal.table on the basis of the strain. Effects of external reinforcement were discussed in a viewpoint of monitoring sensitivity of cracking in superconducting filaments by considering n-value representing the transport behavior of the current. It is closely associated with the location of them relative to the voltage-monitoring region in the tape.

• ETRI Journal
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• 제35권1호
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• pp.1-6
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• 2013

In this paper, we present an implemented serial 40-Gb/s receiver optical subassembly (ROSA) module by employing a proposed TO-CAN package and flexible printed circuit board (FPCB). The TO-CAN package employs an L-shaped metal support to provide a straight line signal path between the TO-CAN package and the FPCB. In addition, the FPCB incorporates a signal line with an open stub to alleviate signal distortion owing to an impedance mismatch generated from the soldering pad attached to the main circuit board. The receiver sensitivity of the ROSA module measures below -9 dBm for 40 Gb/s at an extinction ratio of 7 dB and a bit error rate of $10^{-12}$.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 The IMAPS-Korea Workshop 2001 Emerging Technology on packaging
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• pp.119-126
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• 2001

Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion(i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) was heated by an UV laser beam transmitted through the glass substrate. The laser energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, forming a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.

• 마이크로전자및패키징학회지
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• 제22권4호
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• pp.15-23
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• 2015

Lead-free bonding has attracted significant attention for automotive power device packaging due to the upcoming environmental regulations. Silver (Ag) is one of the prime candidates for alternative of high Pb soldering owing to its superior electrical and thermal conductivity, low temperature sinterability, and high melting temperature after bonding. In this paper, the bonding technology by Ag paste was introduced. We classified into two Ag paste bonding according to applied pressure, and each bonding described in detail including recent studies.