• 구강회복응용과학지
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• 제19권4호
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• pp.269-279
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• 2003

This study investigated the mechanical properties of precious metal-ceramic alloy joined by the laser-welding and the soldering compared with the parent metal. Twenty-four tensile specimens were cast in precious metal-ceramic alloy and divided into three groups of eight. All specimens in the control group(group 1) were left in the as-cast condition. Group 2 and 3 were the test specimens, which were sectioned at the center. Eight of sectioned specimens were joined by soldering with a propane-oxygen torch, and the remaining specimens were joined by laser-welding. After joining, each joint diameter was measured, and then tested to tensile failure on an Instron machine. Failure loads were recorded, and then fracture stress(ultimate tensile strength), 0.2% yield strength and % elongation calculated. These data for three groups were subjected to a one-way analysis of variance(ANOVA). Neuman-Keuls post hoc test was then used to determine any significant differences between groups. The fracture locations, fracture surfaces were examined by SEM(scanning electron microscope). The results were as follows: 1) The tensile strength and 0.2% yield strength of the soldered group($280.28{\pm}49.35MPa$, $160.24{\pm}26.67MPa$) were significantly less than both the as-cast group($410.99{\pm}13.07MPa$, $217.82{\pm}17.99MPa$) and the laser-welded group($383.56{\pm}59.08MPa$, $217.18{\pm}12.96MPa$). 2) The tensile strength and 0.2% yield strength of the laser-welded group were about each 98%, 99.7% of the as-cast group. There were no statistically significant differences in these two groups(p<0.05). 3) The percentage elongations of the soldered group($3.94{\pm}2.32%$) and the laser-welded group($5.06{\pm}1.08%$) were significantly less than the as-cast group($14.25{\pm}4.05%$) (p<0.05). 4) The fracture of the soldered specimens occurred in the solder material and many porosities were showed at the fracture site. 5) The fracture of the laser-welded specimens occurred also in the welding area, and lack of fusion and a large void was observed at the center of the fracture surface. However, the laser-welded specimens showed a ductile failure mode like the as- cast specimens. The results of this study indicated that the tensile strengths of the laser-welded joints were comparable to those of the as-cast joints and superior to those of the soldered joints.

• 대한치과보철학회지
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• 제37권6호
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• pp.730-740
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• 1999

The purpose of this study was to investigate setting and thermal expansion of dental soldering investments. In order to compare expansion rates and to investigate the effect of water/powder ratio on expansion, setting and thermal expansion of low dental soldering investments were measured under three different water/powder ratio conditions. standard, 20% decreased and 20% increased. Setting expansion of investments was measured by use of dialgauge method. Each measurement was started two minutes later from the beginning of spatulation and recorded every one minute for one hour. Thermal expansion of cylindrical test specimens, 10mm diameter, 50mm length, was recorded in a thermodilatometer at heating rate of $10^{\circ}C$ per minute from $25^{\circ}C\;to\;700^{\circ}C$. The results of this study were obtained as follows: 1. Setting expansion rates under the standard water/powder ratio condition were 0.198% in Speed-E, 0.090% in Deguvest, 0.080% in CM and Hi-temp. Setting expansion of Speed-E was significantly different from those of CM, Deguvest and Hi-temp, and setting expansion of Deguvest was significantly different from those of CM and Hi-temp(p<.05). 2. Under the decreased water/powder ratio condition, there was significant increase in setting expansion of 4 dental soldering investments (p<.05). 3. There were no significant differences in setting expansions of investments except Hi-temp between standard and increased water/powder ratio condition(p<.05). 4. Thermal expansion rates under the standard water/powder ratio condition were 1.923% in Deguvest, 1.629% in Speed-E, 1.619% in Hi-temp and 1.580% in CM. No significant differences in thermal expansions under the standard water/powder ratio condition existed only between Speed-I and Hi-temp(p<.05) 5. Under the decreased water/powder ratio condition, there was significant increase in thermal expansion of CM and Deguvest but decrease in thermal expansion of Speed-E (p<.05). 6. Under the increased water/powder ratio condition, there was significant decrease in thermal expansion of CM, Deguvest and Speed-I but decrease in thermal expansion of Hi-temp(p<.05).

• 한국산학기술학회논문지
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• 제11권3호
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• pp.866-872
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• 2010

본 논문에서는 전기인두기(soldering iron)의 히터에 공급되는 전압을 제어하여 안정적인 전원을 공급하는 PID 제어기를 이용한 전기인두기의 온도 제어 시스템을 개발하였다. 제안 시스템은 사용자가 설정한 온도에 빠르게 수렴하고, 외부 요인에 의한 열 손실을 빠르게 회복하도록 PID 제어기를 설계하였다. Ziegler- Nichols의 튜닝방법에 의해 설계된 PID 제어기는 히터에 인가되는 AC 24V 전원의 위상을 제어하기 위해 설정온도와 인두기의 현재 온도를 이용하여 트라이악의 구동 타이밍을 결정한다. 또한 그래픽 LCD를 내장하여 현재 인두의 온도 및 설정온도, 작업 진행 시간 등을 표시하는 기능을 부여하였으며, 작업을 하지 않는 휴지시간에는 적정온도로 낮추어 소비전력 감소와 인두팁의 수명연장을 고려하였다. 제안 방법의 성능을 확인하기 위하여 $25^{\circ}C$의 실내에서 두 가지 실험을 실시하였다. 먼저 $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$, $480^{\circ}C$에 도달하는 시간 실험에서는 각각 12초, 12초, 16초, 18초씩 소요되어 기존의 방법보다 설정온도에 도달하는 시간이 단축됨을 확인하였다. 다음으로 $300^{\circ}C$, $400^{\circ}C$, $480^{\circ}C$의 정상상태에서 부하 실험에서는 각각 $3.8^{\circ}C$, $4.1^{\circ}C$, $4.5^{\circ}C$의 온도가 감소되어 기존의 방법보다 온도 편차가 적음을 확인 하였다.

• 마이크로전자및패키징학회지
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• 제29권3호
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• pp.55-61
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• 2022

본 연구에서는 용융온도가 중온계 무연 솔더인 Sn-3.0Ag-0.5Cu(SAC305)와 저온계 무연 솔더인 Sn-57Bi-1Ag를 사용하여 형성된 복합 무연 솔더 접합부의 특성에 대하여 보고 하였다. SAC305 솔더볼이 형성된 ball grid array(BGA) 패키지와 Sn-57Bi-1Ag 솔더 페이스트가 도포된 flame retardant-4(FR-4) 인쇄회로기판(printed circuit board, PCB)을 리플로우 솔더링 공정을 이용하여 복합 무연 솔더 접합부를 형성 하였다. 공정 온도 프로파일을 두 가지 형태로 달리하여 리플로우 솔더링 공정을 진행하였으며 리플로우 솔더링 공정 조건에 따른 계면 반응, 금속간화합물(intermetallic compound, IMC)의 형성, Bi의 확산 거동 등 복합 무연 솔더 접합부 계면 특성을 비교 분석 하였다. 또한, 열 충격 시험을 통하여 리플로우 솔더링 공정에 따른 복합 무연 솔더 접합부의 신뢰성 특성을 비교하고 열 충격 시험 전후 전단 시험을 진행하여 접합부의 기계적 특성 변화를 분석하였다.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2006년도 High Temperature Superconductivity Vol.XVI
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• pp.70-70
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• 2006

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2006년도 High Temperature Superconductivity Vol.XVI
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• pp.62-62
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• 2006

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2007년도 춘계학술대회
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• pp.72-75
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• 2007

본 연구는 TFT-LCD 부품인 Back Light Unit의 광원 역할을 하는 CCFL Assembly 공정을 분석하여 최적의 공정원 배치를 할 수 있도록 하였다. 이에 각 공정의 특성을 파악하고, 이를 Herrmann의 두뇌우성을 적용하여 공정원 배치를 하도록 하였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년 추계학술발표대회 개요집
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• pp.139-141
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• 2006

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2007년도 High Temperature Superconductivity Vol.XVII
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• pp.74-74
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• 2007

• 대한수학회논문집
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• 제9권2호
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• pp.393-400
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• 1994

Let M(f,η,ξ,g) be a (2m ＋ 1)-dimensional Sasakian manifold with soldering form dp ∈ ΓHom(Λ/sup q/TM, TM) (dp: canonical vector-valued 1-form) where f,η,ξ and g are the (1,1)-tensor field, the structure 1-form, the structure vector field and the metric tensor of M, respectively.(omitted)