Effects of Metallic Cu/Ag Precoating Layers on the Contact Properties Between In-Bi Solder and $Bi_{2212}$
- Jang, J.H. (Korea University of Technology and Education) ;
-
Kim, C.J.
(Korea Atomic Energy Research Institute) ;
- Hyun, O.B. (Korea Electric Power Research Institute) ;
- Park, H.W. (Korea University of Technology and Education)
- Published : 2006.08.16