• The Journal of Korean Academy of Prosthodontics
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• v.27 no.2
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• pp.201-218
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• 1989

The purpose of this study was to evaluate the influence of attachment technique on mechanical properties and microstructures of wrought wires. The wires tested in this study were precious metal wires: PGP (Platinum-Gold -Palladium), Elastic #12, Denture Clasp, Standard, Jelenko No. 2, Degulor-Klammerdraht, DM (Dong Myung) and base metal wire : Ticonium. Each wire was divided into three groups, and each group was heat treated as embedding, cast to, and soldering state. Heat treated sample was evaluated by tensile test, bending test, microhardness test, element analysis and microstructure test. The obtained results were as follows: 1. In tensile test, cast to and soldering procedures have an effect on wrought wire clasp as hardening heat treatment. 2. Maximum bending strength was significantly increased in Elastic #12, Denture Clasp, Standard, and DM in cast to procedure. 3. Ticonium showed the highest Victors hardness number, followed by PGP, and there was no significant difference in other wrought wires. In cast to and soldering procedure, Victors hardness number was significantly increased in precious wrought wires. 4. The precious wrought wire showed typical fibrous structure and this was disappeared in cast to and soldering procedure. But physical properties were not influenced by this phenomenon.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.236-237
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• 2007

Lamination of coated conductor is important to commercialize for electrical stabilizer and mechanical support. It should be known the properties of soldering interface and the variation of superconductivity on coated conductor with various kinds of solders. $SmBa_2Cu_O_x$ thin films were deposited by co-evaporation method (EDDC, Evaporation using Drum in Dual Chambers). 4 kinds of solders were used to investigate interface properties of SmBCO conductors. In-Bi solder could maintain good connection.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.6
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• pp.951-960
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• 1997

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.

• Journal of Korea Foundry Society
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• v.29 no.4
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• pp.169-175
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• 2009

Effect of iron and manganese contents on die soldering reaction has been studied in Al-9wt.%Si-0.3wt.%Mg alloy. Ternary ${\alpha}_{hcp}-Al_8Fe_2Si$ and ${\alpha}_{bcc}-Al_8Fe_2Si$ intermetallic compounds formed by interaction diffusion between Al-Si-Mg system alloy melt and SKD61 die steel surface. Thickness of soldering reaction layer in die steel surface decreased as Fe and Mn contents of the melts increased : When Fe content of Al-9wt.%Si-0.3wt.%Mg melts at constant 0.5wt%Mn content was 0.15wt.%, 0.45wt.% and 0.6wt.%, thickness of soldered layer of each alloy was $64.5{\mu}m,\;57.3{\mu}m$ and $46.9{\mu}m$ respectively. For Mn content of the alloy melts at constant 0.45wt.%Fe content was 0.30wt.%, 0.50wt.% and 0.70wt.%, thickness of soldered layer of each alloy was $66.1{\mu}m,\;57.3{\mu}m$ and $48.3{\mu}m$ respectively.

• The Journal of Korean Academy of Prosthodontics
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• v.40 no.2
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• pp.156-171
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• 2002

The purpose of this study was to measure and compare the strains produced by screw-tightening implant frameworks fabricated by aye different fabrication methods; (1) one-piece cast using plastic sleeve, (2) one-piece cast using gold cylinder, (3) laser welding, (4) soldering, and (5) electrical discharge machining, and also to measure and compare the strains produced when the order of screw tightening was changed A research model incorporating eighteen strain gages was made to measure the fit of implant frameworks in three dimensions. Three implants aligned in an arc were fixed on the top ends of the L-shape aluminum bars of the research model, and standard abutments were joined to the implants with abutment screws. Five types of implant framework were placed on the abutments and screwed by a torque wrench using 10 Ncm. Under the conditions of this study, the following conclusions were drawn: 1. The electrical discharge machining group showed the smallest magnitude of strain, followed by the soldering group, the laser welding group, the one-piece cast group using gold cylinder, and the one-piece cast group using plastic sleeve. However, among the magnitude of strain for the remaining groups except the electrical discharge machining group, there were not significant differences. 2. When the order of screw tightening was changed, there were not significant differences in the magnitude of strain. 3. In comparison with the electrical discharge machining group, the laser welding group and the one-piece cast groups showed greater horizontal distortion and the soldering group showed greater horizontal and vertical distortion.

• Clean Technology
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• v.14 no.2
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• pp.103-109
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• 2008

In this study, in order to develop evaluation method of the cleaning efficiency of residual flux which remains on the surface after soldering with solder paste, a specially designed metal tool is used to reduce spread uncertainty of flux while soldering. Using this tool, the measurement of cleaning efficiency of flux after soldering for some typical alternative semi-aqueous cleaners and 1,1,1-TCE by weighing method was conducted. As the test result of cleaning efficiency for each cleaner at several different cleaning times, the precision of the data is confirmed to within about 4% relative standard deviation (RSD) range. So, it is considered that this would be a good evaluation method for evaluating the cleaning efficiency of the residual flux which remains after solder paste soldering in the alternative cleaning. The results of this test method shows that the cleaning efficiency of ST 100SX and Neozal 750H in the cleaning of residual flux was better than other semi-aqueous cleaners, but its cleaning efficiency was clearly inferior to 1,1,1-TCE.

• 보존과학연구
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• s.22
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• pp.81-92
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• 2001

The replica experiment of golden bell excavated from the East Three-Story Pagoda at the Gamunsa temple was carried out in order to know the handiwork technique of ancient granule. The size of 0.3mm granule was attached to the golden bell which was 3.4mm bell body by soldering. When we tried to attach the granule by a modern metalwork, we could know that this technique was hard to make the replica bell. We could prove how to adhere strongly to the golden granule by tension testing. First of all, we made the soldering of the same composition as the golden bell excavated from the Gamunsa temple and then prepared specimens for testing to measure the tension strength. It showed that the broken position was not a soldering part. This result showed how the ancient granule could maintain without a break for a long time.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.89-98
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• 2001

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shock teal. $(Cu,Ni)_6Sn_5$-type intermetallic compound of which thickness is about 5 micron was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was found at the solder joint and the newly developed product was superior to conventions; one in terms of productivity and reliability.

• Journal of the Korea Institute of Military Science and Technology
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• v.23 no.6
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• pp.574-581
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• 2020

This paper describes the stacking effect for Ceramic Column Grid Array(CCGA) packages used for satellites. Reflow Soldering Process suitable for CCGA package with back structure was set as the process development goal to meet European Cooperation for Space Standardization(ECSS) standard. After analyzing the stacking effect according to the type of CCGA, it is verified by applying it to the CCGA Reflow Soldering Process. In order to confirm the validity of the staking effect analyzed in terms of vibration and thermal characteristics, it is verified through actual specimen production. It analyzes the cause of crack occurrence in the CCGA package and estimates the crack generation point using previously acquired inspection data.

• Journal of Welding and Joining
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• v.15 no.2
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• pp.36-42
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• 1997

In this paper, stability of initial strength at solder joint with lead free solders, such as Sn-In (52-48%) and Sn-Ag (96.5-3.5wt%) was studied. To obtain at solder joint with high quality, it is very important to control the temperature at the interface of solder joints. It is found that the thermal EMF (electro motive force) occurs betwee lead frame and copper pad on a substrate during reflow soldering process using heated tip. As a result of control the temperature at interface of solder joints, variation of initial strength at solder joint decreases from about $\pm40%$ to $\pm20%$, and it is realized Pb free soldering process using Sn/In and Sn-Ag solder paste.