• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.67-73
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• 2001

To investigate the relationships of solder joint characteristics with solder composition and A:V ratio (solder volume per pad area), Sn-37Pb and Sn-4.0Ag-0.5Cu solder balls with 330, 400, 450 and $457{\mu}{\textrm}{m}$ size were reflowed on same substrate. Sn-37Pb and Sn-4.0Ag-0.5Cu was reflowed at $220^{\circ}C$ and $240^{\circ}C$ respectively by IR-type soldering machine. As a result of reflowed solder- ball diameter(D) and height(H) measurement, D/H was decreased with solder ball size increment in range of 330~450 ${\mu}{\textrm}{m}$. But, D/H was increased in the solder joint for 457 ${\mu}{\textrm}{m}$ size, it was caused possibly by decrement of solder ball height increment compared with solder volume increment. As a result of shear and pull test, joint strength with A:V ratio was high. Joint strength of Sn-4.0Ag-0.5Cu was higher than Sn-37Pb. However, Sn-37Pb had more stable solder joint of small standard deviation. A thick and clean scallop type Ni-Cu-Sn intermetallic compound layer was formed in high A:V ratio and Sn-4.0Ag-0.5Cu solder joint interface.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.39-43
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• 2002

The eutectic solder Sn-37Pb and the lead free solder alloys with the compositions of Sn-0.7Cu, Sn-3.5Ag, Sn-3.5Ag-0.75Cu, Sn-2.0Ag-0.7Cu-3.0Bi were applied to the 48 BGA packages, and then it was discussed for the shear strength at the solder joints as the hardness and the composition of the small solder ball. As a result of experiments, the high degree of hardness with the displacement of 0.043 mm was obtained in Sn-2.0Ag-0.7Cu-3.0Bi. The shear strength of the lead free solder was higher than that of Sn-37Pb solder, and it can be obtained the maximum value of about 52% in Sn-2.0Ag-0.7Cu-3.0Bi.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.9-17
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• 2018

Aluminum (Al) and its alloys have been used widely in a variety of industries such as structural, electronic, aerospace, and particularly automotive industries due to their lightweight characteristic, outstanding ductility, formability, high oxidation and corrosion resistance, and high thermal and electrical conductivity. Al have different kinds of alloys according to the various additional elements system and they should be selected properly depending on their effectiveness and suitability for their particular purpose. The major elements for Al alloys are silicon (Si), magnesium (Mg), manganese (Mn), copper (Cu), and zinc (Zn). In order for Al alloys to use for each industry, it is necessary to study of Al to Al joining and/or the Al to dissimilar materials joining to combine the individual parts into one. Many studies on joining technologies about Al to Al and Al to dissimilar materials have been performed such as press joining, bolted joint, welding, soldering, riveting, adhesive bonding, and brazing. This study reviews a variety of Al alloys and their joining method including its principles and properties with recent trends.

• The Journal of the Convergence on Culture Technology
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• v.4 no.3
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• pp.209-212
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• 2018

Anisotropic conductive film(ACF) bonding is widely used for making fine interconnections between two different materials where soldering is not easily applicable. There are three constraints for the successful implementation of ACF bonding. A bonding contact should be pressed by a hot head with the right pressure and temperature for a pre-defined curing time. In this paper, a method for ACF bonding based on machine vision system is proposed and verified through some experiments. The system calculates the position and orientation of printed circuit boards(PCBs) on a bonding table and estimates the optimal hitting point where the hot head should be applied. Experimental results show that the proposed system achieves better adhesive strength by providing head flatness over contact surfaces.

• The Journal of the Korean dental association
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• v.54 no.1
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• pp.39-48
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• 2016

SFI-bar is prefabricated bar system and can be assembled at chairside without soldering or welding, thus reducing bone loss, costs and time. A 53-year-old male patient, who had severely absorbed mandible, hoped to wear a stable mandiblular denture. Four implants were placed in the extraction site of canine and 1st molar. Early loaded temporary denture with solitary type attachment was delivered 3 weeks after surgery. 3 month later, SFI-bar was connected and adjusted at chairside. Then, implant overdenture using SFI-bar was delivered. This case report showed that a satisfactory clinical result was achieved by 4-implant-supported overdenture using the SFI-Bar system in a mandibular edentulous patient.

• Progress in Superconductivity and Cryogenics
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• v.5 no.3
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• pp.15-19
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• 2003

For the purpose of standardization of the critical current measurement, it is meaningful to describe how $I_{c}$ will behave as the stress/strain level changes. In this study, strain dependencies of the critical current $I_{c}$ in Ag-alloy sheathed multifilamentary Bi(2212) and Bi(2223) superconducting tapes were evaluated at 77K, 0T. The external reinforcement was accomplished by soldering AgMgNi alloy tapes onto single or both sides of the sample. With the external reinforcement to the Bi(2212) tape, the strength of the tapes increased but the critical current at the strain free state, $I_{c0}$ decreased in some cases. The strain for onset of the $I_{c}$ degradation, $\varepsilon$$_{\irr}$, increased with an increase of the reinforcing volume and then saturated to a certain value. The effect of external reinforcement on the degradation of $I_{c}$ due to the bending strain in the Bi(2223) tape was also examined. Contrary to the expectation, it showed a significant $I_{c}$ degradation even at a small strain of 0.4 %. The observations of damage morphologies gave a good explanation to the $I_{c}$ behavior.c/ behavior.r.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.7
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• pp.2087-2096
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• 1996

Recentrly advantages in composite and light weight material techniques have led to the increased use of bonded dissimilar materials such as ceramics/metal bonded joints, IC package, brazing, coating and soldering in the various industries. It is required to analyze the evaluation method of fracture strength and design methodology of bonded joints in dissimilar materials. Stress singularity according to changes of scarf angles for bonded scarf joints in dissimilar materials was investigated by the boundary element method and static experiments. In this paper, effect of the stress singularity factors at the interface edges of scarf joints on various dissmilar materials combinations were investigated by analysis of its stress and stress singularity index using 2-dimensional elastic program of boundary element method. And the variations of stress singularity index by changes for Young's modulus ratios of materials and scarf angles were investigated. Also, it is found that stress singularities at bonded interface edges are disappeared for certain combination of scarf angle in a pair of bonded dissimilar materials. As the results, it is proposed that the strength evaluation by using stress singularity factors, $\Gamma$, considering stress singularity at the interface edges of bonded dissimilar materials, is very useful.

• 한국문화재보존과학회:학술대회논문집
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• 2001.11a
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• pp.15-18
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• 2001

The sarira reliquary excavated as a lot of fragments were restored by conservation treatment by us. The sarira reliquary was made using fine techniques such as chasing work and engraving work, etc. The analysis of base metals showed that different materials had been used on decorative parts in consideration of the casting and forging technique. Gold granules $(97wt\%\;Au)$ of the small bell were adhered by using a soldering material $(85wt\%\;Au,\;10wt\%\;Ag)$. The lead isotope analysis of lead glass $(74wt\%\;PbO)$ revealed that it agreed with the lead mine in the middle of south area in Korea.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.4
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• pp.398-403
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• 2006

This paper describes the evaluation of the long duration current impulse withstand characteristics of ZnO blocks for high voltage surge arresters. Four ZnO varistors were manufactured with the general ceramic production method and the long duration current impulse withstand test, electrical uniformity evaluation test and microstructure observation were performed. All varistors exhibited high density, which was in the range of $5.42{\sim}5.46g/cm^3$. In the electrical properties, the reference voltage of samples was in the range of $5.11{\sim}5.25\;kV$ and the residual voltage was in the range of $8.314{\sim}8.523\;kV$. In the long duration current impulse withstand test, sample No.2 and No.3 failed at the 2nd and 4th shot of series impulse currents, respectively, but the rest survived 18 shots during the test. Before and after this test, the variation ratio of the residual voltage of samples survived was below 0.5 %, which was in the acceptance range of 5 %. According to the results of the test, it is thought that if the soldering method is improved, ZnO varistors would be possible to apply to the high voltage arresters like the station class and transmission line arresters in the near future.

• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.61-65
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• 2009

Window integrated solar collector is to simply install inside of the existing double glass window frame. Double glass window frame is consist of inner glass of Low-E coating and Silver coating, and outer glass of low iron reinforced glass. In order to secure natural lighting in a room, only 50% of window frame is covered with solar collectors. Solar absorption or transmission rate varies seasonally depending on sun angles. Part of inner glass where right behind of the solar plate is covered with silver coating to increase absorption rate of solar plate. The collector is made of a copper serpentine where aluminum fins are soldering. To improve the effect of insulation of inside of the window frame is recommend vacuum. As a result, we are making the 3th sample and will archieve below $F_RU_L=7.5W/m^2^{\circ}C$ that is the account of heat lossed, and above $F_R({\tau}{\alpha})=0.45$.