• Journal of Welding and Joining
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• v.18 no.6
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• pp.42-47
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• 2000

The object of this study is to estimate Sn-Ag-Bi-Ga solder alloy as a substitute for Sn-37Pb alloy. For Sn-Ag-Bi-Ga alloys, Ag, Bi and Ga contents are varied. (Ag : 1~5%, Ga : 3%, Bi : 3~6%) Comparing to Sn-37Pb alloy Sn-Ag-Bi-Ga alloys have wider melting temperature range up to max. $18.7^{\circ}C$. With increasing Ag, Bi contents, the wettability of the alloys increased up to max. 6.6 mN. The vickers hardness of the alloys was max. 46.4 Hv. The ultimate tensile stress of the alloys was max. 60.3 MPa and the elongation was max. 1.2%. The joint strength between circuit board and solder was max. 55.5 N and the joint strength between connector and solder was max. 176.1 N. There were no cracks in this alloys after thermal shock test.

• Journal of Welding and Joining
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• v.20 no.5
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• pp.72-77
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• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of microelectronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder b01p and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

• Journal of Welding and Joining
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• v.18 no.6
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• pp.74-82
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• 2000

The fluxless wetting properties of UBM-coated Si-wafer to the binary lead-free solders(Sn-Ag, Sn-Sb, Sjn-In, Sn0Bi) were estimated by wetting balance method. With the new wettability indices from the wetting curves of one side coated specimen, the wetting property estimation of UBM-coated Si-wafer was possible. For UBM of Si-chip, Au/Cu/Cr UBm was better than au/Ni/TI in the point of wetting time/ At general reflow process temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) was better than that of low melting point one(Sn-Bi, Sn-In). The contact angle of the one side coated Si-plate to the solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

• Journal of the Korean institute of surface engineering
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• v.36 no.2
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• pp.168-175
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• 2003

The purpose of solder plating on chip external electrode is to provide a proper solderability to chips on PCB's. The quantitative or qualitative analysis of solderability has been performed by destructive methods, reflow or flow. Evidently, the solderability tends to depend on the grain structure which is varied with additives. Research on the feasibility of employing electrochemical techniques to characterize the solderability of electroplated tin - lead, with respect to the additives, was non destructively performed. The deposit morphology and the polarization behavior of electrolytes containing proprietary additives were evaluated to investigate the soldering degradation. The plated panels from synthetic electrolyte were analyzed according to % Sn, plating thickness, deposit appearance, grain structure, solderability and cyclic voltammetry.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.17-24
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• 2012

Recently, flip chip interconnection has been increasingly used in microelectronic assemblies. The common Flip chip interconnection is formed by reflow of the solder bumps. Lead-Tin solders and Tin-based solders are most widely used for the solder bump materials. However, the flip chip interconnection using these solder materials cannot be applied to temperature-sensitive components since solder reflow is performed at relatively high temperature. Therefore the development of low temperature bonding technologies is required in these applications. A few bonding techniques at low temperature of $150^{\circ}C$ or below have been reported. They include the reflow soldering using low melting point solder bumps, the transient liquid phase bonding by inter-diffusion between two solders, and the bonding using low temperature curable adhesive. This paper reviews various low temperature bonding methods.

• Journal of Ocean Engineering and Technology
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• v.14 no.4
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• pp.79-85
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• 2000

Press-fit pin connection is the solderless interference-fit between pins and plated through holes(PTH) in the printed curcuit board(PCB). Because of not only its simple assembly and absence of problems associated with soldering, but also its good mechanical and electrical characteristics, the press-fit pin connection technology has quickly gained wide acceptance in the telecommunications and computer industries. In this paper, the contact stress characteristics of the domestic CPF pin when inserted into the friction coefficients were compared and the stress variations of the compliant part of the pin, which have an influence on the performance, were displayed with the time and arc length after complete connected. It is supposed that the results will provide useful data to improve the performance of the pin-PCB interconnection mechanism.

• Ceramist
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• v.9 no.6
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• pp.30-36
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• 2006

Joining ceramics to metals has a variety of applications both in the structural and the electronics fields. One of the great benefits of the adoption of joining into the structural applications is to provide reliability to the ceramic components by backing up with metal components. In joining ceramics and metals, two key factors, i.e., establishing chemical bonding at interfaces and dissipation of thermal stress across interfaces, should be paid for attention. Many joining methods have been already established such as adhesive and mechanical joining, brazing and soldering, and solid state bonding. Each has its own benefits with some drawbacks. One can select a suitable process and materials following the requirements of the application. This report focuses on the current status of joining technology for ceramics/metal system.

• Smart Structures and Systems
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• v.21 no.2
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• pp.151-161
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• 2018

A new type of cascade sandwiched piezoelectric ultrasonic transducer is presented and studied. The cascade transducer is composed of two traditional longitudinally sandwiched piezoelectric transducers, which are connected together in series mechanically and in parallel electrically. Based on the analytical method, the electromechanical equivalent circuit of the cascade transducer is derived and the resonance/anti-resonance frequency equations are obtained. The impedance characteristics and the vibrational modes of the transducer are analyzed. By means of numerical method, the dependency of the resonance/anti-resonance frequency and the effective electromechanical coupling coefficient on the geometrical dimensions of the cascade transducer are studied and some interesting conclusions are obtained. Two prototypes of the cascade transducers are designed and made; the resonance/anti-resonance frequency is measured. It is shown that the analytical resonance/anti-resonance frequencies are in good agreement with the experimental results. It is expected that this kind of cascade transducer can be used in large power and high intensity ultrasonic applications, such as ultrasonic liquid processing, ultrasonic metal machining and ultrasonic welding and soldering.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.1
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• pp.22-31
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• 2008

The operating window method is a novel approach in quality improvement. But it has not received deserved attention in academic research. If a critical factor for competing failure modes can be identified, the probability of failure can be reduced by widening the operating window of this factor. Traditional SN ratio for the operating window advocated by Taguchi has a critical shortcoming, which has been derived under the assumption that failure rates are determined by the operating window factor only. A new metric for robustness is given for the operating window method, which has relaxed the restrictive assumption of Taguchi's SN ratio. And procedures for determining optimal conditions based on the new metric is presented. The effectiveness of the proposed approach over the traditional practice is tested with the aid of a wave soldering process.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.104-108
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• 2002

This paper was investigated the lead free solder characteristics by P mass percentage chang e. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed for estimation. By adding P on the solder alloys, it was showe d improvement of tensile strength, reduction of intermetallic compound growth and reduction of oxidization of fusible solder under wave soldering processes. After comparing solder alloy containing P with tin lead eutectic solder alloy, p containing solder alloys showed much better solderability than eutectic solder alloys.