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http://dx.doi.org/10.6117/kmeps.2012.19.1.017

Low Temperature bonding Technology for Electronic Packaging  

Kim, Sun-Chul (한양대학교 신소재공학과)
Kim, Youngh-Ho (한양대학교 신소재공학과)
Publication Information
Journal of the Microelectronics and Packaging Society / v.19, no.1, 2012 , pp. 17-24 More about this Journal
Abstract
Recently, flip chip interconnection has been increasingly used in microelectronic assemblies. The common Flip chip interconnection is formed by reflow of the solder bumps. Lead-Tin solders and Tin-based solders are most widely used for the solder bump materials. However, the flip chip interconnection using these solder materials cannot be applied to temperature-sensitive components since solder reflow is performed at relatively high temperature. Therefore the development of low temperature bonding technologies is required in these applications. A few bonding techniques at low temperature of $150^{\circ}C$ or below have been reported. They include the reflow soldering using low melting point solder bumps, the transient liquid phase bonding by inter-diffusion between two solders, and the bonding using low temperature curable adhesive. This paper reviews various low temperature bonding methods.
Keywords
Low temperature bonding; flip chip bonding;
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