• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.1-26
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• 2004

The implementation of Pb-free solder technology is making good progress in electronic industry. Further understanding on fundamental issues on Pb-free solders/processes is required to reduce reliability risk factors of Pb-free solder joints. Several reliability issues including thermal fatigue, impact reliability, IMC growth, spalling, void formation are reviewed for Pb-free solder joints. Several applications of Pb-free technology are discussed, such as Pb-free, CBGA, CuCGA, flip chips, and wafer bumping by IMS.

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.577-579
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• 2004

Digital hearing aids enclose $6{\sim}8$ tiny components. Those electromechanical components are individually wired by soldering which is a manual labor and sometimes causes components' damage by heating. This paper suggests a PCB design for overcome these problems. Several PCBs are designed and manufactured and circuited to produce ITE(In The Ear) type hearing aids which are inserted in the ear canal. The most optimal size of the PCB design for the ITE hearing aid is presented in this paper.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1012-1015
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• 2004

Digital hearing aids enclose $6{\sim}8$ tiny components. Those electromechanical components are individually wired by soldering which is a manual labor and sometimes causes components' damage by heating. This paper suggests a PCB design for overcome these problems. Several PCBs are designed and manufactured and circuited to produce ITE(In-the-Ear) type hearing aids which are inserted in the ear canal. The most optimal size of the PCB design for the ITE hearing aid is presented in this paper.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.04a
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• pp.78-78
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• 2006

• Proceedings of the KWS Conference
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• 2004.05a
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• pp.81-83
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• 2004

최근 대두되고 있는 환경오염문제로 인해 전자산업에서는 전 세계적으로 Pb 솔더에 관한 규제가 진행중에 있다. 이에 Pb free 솔더에 관한 연구가 활발히 진행 중에 있으며 그 중 Sn-Ag계 solder는 유력한 대체 solder로 대두되고 있다. (중략)

• Proceedings of the KWS Conference
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• 2004.05a
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• pp.78-80
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• 2004

현재 전자 부품 실장에 사용되는 솔더 합금들 중에서 Sn-Pb계 솔더는 취급이 용이하고 낮은 가격 및 솔더재로서의 우수한 특성(기계적 및 전기적 특성, 접합성 등) 때문에 산업계에서 가장 널리 사용되고 있다. (중략)

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.464-466
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• 2009

This study tried to examine the suitability of strip casting process such as PFC (Planar Flow Casting) method for soldering Au-Sn strip. The effect of heat treatment on the tensile behavior and mechanical properties of an Au-Sn strip was investigated through tensile test, micro hardness test, X-ray diffraction (XRD), SEM, and TEM observations. It was apparent that 20-mm width Au-Sn strip could be well produced by using planar flow casting process. Tensile results showed that tensile strength increased from 338.3MPa to 310MPa and plastic strain improved from 0% to 1.5% with heat treatment ($170^{\circ}C$/70 hrs.). The microstructure of Au-Sn strip mainly consisted of two phases; $Au_5Sn(\zeta)$ and AuSn($\sigma$). It was also found that inhomogeneous amorphous local structure continuously changed to the homogeneous two phases microstructure with heat treatment. The fractographical observation after tensile test indicated the cleavage fracture mode of as-casted Au-Sn strip. On the other hand, the heat treated Au-Sn strip showed that fracture propagated along interface between brittle AuSn and ductile $Au_5Sn$ phases. The deformation behavior of strip casted Au-Sn alloy with microstructural evolution and the improve method for ductility of this alloy was also suggested.

• Fire Science and Engineering
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• v.14 no.2
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• pp.33-38
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• 2000

Flux, essentially used in soldering process of PCB (Printed Circuit Board) in electronics industry, contains IPA (Isopropyl alcohol) and methanol, which are highly inflammable and explosive. Hazard Chemical Controlling Law classified methanol as toxic material and Environmental Law classified methanol as VOC (Volatile Organic Compound). So there have been pressing needs of developing substitutes for the existing Flux. New solvent which is non-flammable and main component is DCP having same specific character of the existing Flux. It's been combirated with proper composition ratio adding stabilizer. As a result, it relieved working Environment Allowance thickness 200 ppm to 470 ppm, chance of not been soldered 0.083% to 0%, spread 85% to 87%, power saving resistance 1.0$\times$$10^{12}$$\Omega$ to 6.9$\times$$10^{12}$$\Omega$, which means a lot better than the existing Flux. Therefore, Flux confirmed the chance of improving productivity, safety, environment safety and quality. Also, Flux got a satisfied result after product quality test and product reliability test.

• Korean Journal of Materials Research
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• v.13 no.1
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• pp.18-23
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• 2003

Properties of Ag thick films fabricated by using low temperature curable silver pastes were investigated. Ag pastes were consisted of polymer resins and silver powders. Ag pastes were used for conductive or fixing materials between board and various electrical and electronic devices. Low temperature curable Ag pastes have some advantages over high temperature curable types. In cases of chip mounting, soldering properties were required for screen printed Ag thick films. In this study, four types of Ag pastes were fabricated with different compositions. Screen printed Ag thick films on alumina substrates were fabricated at various curing temperatures and times. Thickness, resistivity, adhesive strength and solderability of fabricated Ag thick films were characterized. Finally, Ag thick films produced using Ag pastes, sample A and B, cured at $150^{\circ}C$ for longer than 6 h and $180^{\circ}C$ for longer than 2 h, and $150^{\circ}C$ for longer than 1 h and $180^{\circ}C$ for 1 h, respectively, showed low resistivities of $10^{-4}$ $∼10^{-5}$ Ωcm and good adhesive strength of 1∼5 Mpa. Soldering properties of those Ag thick films with curing temperatures at solder of 62Sn/36Pb/3Ag were also investigated.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.35-39
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• 2020

Nonwet (Head in Pillow) defect is one of the defects in SMT (surface mount technology) process, the defect is caused by several factors, such as solder paste misalignment, reflow condition, package warpage and package ball size. This paper focused on ① reflow condition ② package ball & solder paste misalignment ③ package ball size for nonwet experiment. The first, on the case of reflow condition, there would be high risk of nonwet defect when the soldering time was increased, but N₂ was adopted to reflow process, there could be no or low risk of nonwet defect because of oxidation barrier control. And when the contact depth between Solder ball and solder paste was below 20 ㎛, there could be high risk of nonwet defect. Also smaller package ball would have low risk of nonwet defect.