• Journal of Dental Rehabilitation and Applied Science
• /
• v.19 no.4
• /
• pp.269-279
• /
• 2003

This study investigated the mechanical properties of precious metal-ceramic alloy joined by the laser-welding and the soldering compared with the parent metal. Twenty-four tensile specimens were cast in precious metal-ceramic alloy and divided into three groups of eight. All specimens in the control group(group 1) were left in the as-cast condition. Group 2 and 3 were the test specimens, which were sectioned at the center. Eight of sectioned specimens were joined by soldering with a propane-oxygen torch, and the remaining specimens were joined by laser-welding. After joining, each joint diameter was measured, and then tested to tensile failure on an Instron machine. Failure loads were recorded, and then fracture stress(ultimate tensile strength), 0.2% yield strength and % elongation calculated. These data for three groups were subjected to a one-way analysis of variance(ANOVA). Neuman-Keuls post hoc test was then used to determine any significant differences between groups. The fracture locations, fracture surfaces were examined by SEM(scanning electron microscope). The results were as follows: 1) The tensile strength and 0.2% yield strength of the soldered group($280.28{\pm}49.35MPa$, $160.24{\pm}26.67MPa$) were significantly less than both the as-cast group($410.99{\pm}13.07MPa$, $217.82{\pm}17.99MPa$) and the laser-welded group($383.56{\pm}59.08MPa$, $217.18{\pm}12.96MPa$). 2) The tensile strength and 0.2% yield strength of the laser-welded group were about each 98%, 99.7% of the as-cast group. There were no statistically significant differences in these two groups(p<0.05). 3) The percentage elongations of the soldered group($3.94{\pm}2.32%$) and the laser-welded group($5.06{\pm}1.08%$) were significantly less than the as-cast group($14.25{\pm}4.05%$) (p<0.05). 4) The fracture of the soldered specimens occurred in the solder material and many porosities were showed at the fracture site. 5) The fracture of the laser-welded specimens occurred also in the welding area, and lack of fusion and a large void was observed at the center of the fracture surface. However, the laser-welded specimens showed a ductile failure mode like the as- cast specimens. The results of this study indicated that the tensile strengths of the laser-welded joints were comparable to those of the as-cast joints and superior to those of the soldered joints.

• The Journal of Korean Academy of Prosthodontics
• /
• v.37 no.6
• /
• pp.730-740
• /
• 1999

The purpose of this study was to investigate setting and thermal expansion of dental soldering investments. In order to compare expansion rates and to investigate the effect of water/powder ratio on expansion, setting and thermal expansion of low dental soldering investments were measured under three different water/powder ratio conditions. standard, 20% decreased and 20% increased. Setting expansion of investments was measured by use of dialgauge method. Each measurement was started two minutes later from the beginning of spatulation and recorded every one minute for one hour. Thermal expansion of cylindrical test specimens, 10mm diameter, 50mm length, was recorded in a thermodilatometer at heating rate of $10^{\circ}C$ per minute from $25^{\circ}C\;to\;700^{\circ}C$. The results of this study were obtained as follows: 1. Setting expansion rates under the standard water/powder ratio condition were 0.198% in Speed-E, 0.090% in Deguvest, 0.080% in CM and Hi-temp. Setting expansion of Speed-E was significantly different from those of CM, Deguvest and Hi-temp, and setting expansion of Deguvest was significantly different from those of CM and Hi-temp(p<.05). 2. Under the decreased water/powder ratio condition, there was significant increase in setting expansion of 4 dental soldering investments (p<.05). 3. There were no significant differences in setting expansions of investments except Hi-temp between standard and increased water/powder ratio condition(p<.05). 4. Thermal expansion rates under the standard water/powder ratio condition were 1.923% in Deguvest, 1.629% in Speed-E, 1.619% in Hi-temp and 1.580% in CM. No significant differences in thermal expansions under the standard water/powder ratio condition existed only between Speed-I and Hi-temp(p<.05) 5. Under the decreased water/powder ratio condition, there was significant increase in thermal expansion of CM and Deguvest but decrease in thermal expansion of Speed-E (p<.05). 6. Under the increased water/powder ratio condition, there was significant decrease in thermal expansion of CM, Deguvest and Speed-I but decrease in thermal expansion of Hi-temp(p<.05).

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.11 no.3
• /
• pp.866-872
• /
• 2010

In this paper, we developed a digital soldering station based on PID controller, which supply stable power by controlling the current of heater of soldering iron. The proposed system designed PID controller to converge quickly to the set up temperature by user, and regain the lost of heat by external factors quickly. PID controller, designed by Ziegler-Nichols' tuning method, decides triac's trigger timing using setting temperature and present temperature to control the phase of AC 24V power that supply to the heater. Also, we give the function that shows present temperature and setting temperature of iron, and working time by graphic LCD. And during the rest time, we decided the power saving and extension of iron tip by dropping to the optimal temperature. Two experiments had implemented in $25^{\circ}C$ laboratory to confirm the performance of proposed method. The first experiment took 12sec, 13sec, 16sec, 18sec, reaching to $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$, $480^{\circ}C$ respectively which result showed shorten of rising time than previous method. In the loading experiment of $300^{\circ}C$, $400^{\circ}C$, $480^{\circ}C$ steady state showed temperature drop of $3.8^{\circ}C$, $4.1^{\circ}C$, $4.5^{\circ}C$ which result showed the low temperature deviation than previous method.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.3
• /
• pp.55-61
• /
• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.

• 한국초전도학회:학술대회논문집
• /
• v.16
• /
• pp.70-70
• /
• 2006

• 한국초전도학회:학술대회논문집
• /
• v.16
• /
• pp.62-62
• /
• 2006

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
• /
• 2007.06a
• /
• pp.72-75
• /
• 2007

본 연구는 TFT-LCD 부품인 Back Light Unit의 광원 역할을 하는 CCFL Assembly 공정을 분석하여 최적의 공정원 배치를 할 수 있도록 하였다. 이에 각 공정의 특성을 파악하고, 이를 Herrmann의 두뇌우성을 적용하여 공정원 배치를 하도록 하였다.

• Proceedings of the KWS Conference
• /
• 2006.10a
• /
• pp.139-141
• /
• 2006

• 한국초전도학회:학술대회논문집
• /
• 2007.07a
• /
• pp.74-74
• /
• 2007

• Communications of the Korean Mathematical Society
• /
• v.9 no.2
• /
• pp.393-400
• /
• 1994

Let M(f,η,ξ,g) be a (2m ＋ 1)-dimensional Sasakian manifold with soldering form dp ∈ ΓHom(Λ/sup q/TM, TM) (dp: canonical vector-valued 1-form) where f,η,ξ and g are the (1,1)-tensor field, the structure 1-form, the structure vector field and the metric tensor of M, respectively.(omitted)