• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.9
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• pp.770-775
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• 2002

We present the band lineups of G $e_{1-}$x S $n_{x}$ G $e_{1-}$y S $n_{y(001)}$ heterostructures for the new devices. The energy gap of the bulk G $e_{1-}$x S $n_{x}$ alloy is calculated by taking into account the Vegard's law. The change of the energy gap due to the strain is understood in terms of the deformation Potential theory The valence band offset is obtained from the average bond energy model, where the changes of the band offset due to alloy compositions and strain are included. It is found that Ge/G $e_{1-}$y S $n_{y(001)}$ heterostructure has a staggered lineup type for 0$\leq$0.06 and a straddling one for 0.06$\leq$0.26. Meanwhile, Ge/G $e_{l-y}$ S $n_{y(001)}$ heterostructure has a staggered lineup type for 0$\leq$0.19 and a broken-gap one for 0.19$\leq$0.26. As a result, the various type of the G $e_{1-}$x S $n_{x}$ G $e_{1-}$y S $n_{y(001)}$ heterostructure can be applied for the useful device.evice.

• Current Photovoltaic Research
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• v.4 no.1
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• pp.16-20
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• 2016

$Cu_2ZnSnS_4$ (CZTS) thin films were fabricated by successive electrodeposition of layers of precursor elements followed by sulfurization of an electrodeposited Cu-Zn-Sn precursor. In order to improve quality of the CZTS films, we tried to optimize the deposition condition of absorber layers. In particular, I have conducted optimization experiments by changing the Cu-layer deposition time. The CZTS absorber layers were synthesized by different Cu-layer conditions ranging from 10 to 16 minutes. The sulfurization of Cu/Sn/Zn stacked metallic precursor thin films has been conducted in a graphite box using rapid thermal annealing (RTA). The structural, morphological, compositional, and optical properties of CZTS thin films were investigated using X-ray diffraction (XRD), Field emission scanning electron microscopy (FE-SEM), Raman spectroscopy, and X-ray Flourescenece Spectrometry (XRF). Especially, the CZTS TFSCs exhibits the best power conversion efficiency of 4.62% with $V_{oc}$ of 570 mV, $J_{sc}$ of $18.15mA/cm^2$ and FF of 45%. As the time of deposition of the Cu-layer to increasing, the properties were confirmed to be systematically changed. And we have been discussed in detail below.

• Biotechnology and Bioprocess Engineering:BBE
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• v.11 no.6
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• pp.530-537
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• 2006

Recently isolated, Pseudomonas putida SN1 grows on styrene as its sole carbon and energy source through successive oxidation of styrene by styrene monooxygenase (SMO), styrene oxide isomerase (SOI), and phenylacetaldehyde dehydrogenase. For the production of (S)-styrene oxide, two knockout mutants of SN1 were constructed, one lacking SOI and another lacking both SMO and SOI. These mutants were developed into whole-cell biocatalysts by transformation with a multicopy plasmid vector containing SMO genes (styAB) of the SN1. Neither of these self-cloned recombinants could grow on styrene, but both converted styrene into an enantiopure (S)-styrene oxide (e.e. > 99%). Whole-cell SMO activity was higher in the recombinant constructed from the SOI-deleted mutant (130 U/g cdw) than in the other one (35 U/g cdw). However, the SMO activity of the former was about the same as that of the SOI-deleted SN1 possessing a single copy of the styAB gene that was used as host. This indicates that the copy number of styAB genes is not rate-limiting on SMO catalysis by whole-cell SN1.

• The Bulletin of The Korean Astronomical Society
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• v.46 no.2
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• pp.65.2-66
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• 2021

Observational studies of supernova (SN) feedback are limited. In our galaxy, most supernova remnants (SNRs) are located in the Galactic plane, so there is contamination from foreground/background sources. SNRs located in other galaxies are too far, so we cannot study them in detail. The Large Magellanic Cloud (LMC) is a unique place to study the SN feedback due to their proximity, which makes possible to study the structure of individual SNRs in some detail together with their environment. Recently, we carried out a systematic study of 13 LMC SNRs using [P II] (1.189 ㎛) and [Fe II] (1.257 ㎛) narrowband imaging with SIRIUS/IRSF, four SNRs (SN 1987A, N158A, N157B and N206), show [P II]/[Fe II] ratio much higher than the cosmic abundance. While the high ratio of SN 1987A could be due to enhanced abundance in SN ejecta, we do not have a clear explanation for the other cases. We investigate the [P II] knots found in SNRs N206, N157B and N158A, using optical spectra obtained last November with GMOS-S mounted on Gemini-South telescope. We detected several emission lines (e.g., H I, [O I], He I, [O III], [N II] and [S II]) that are present in all three SNRs, among other lines that are only found in some of them (e.g., [Ne III], [Fe III] and [Fe II]). Various line ratios are measured from the three SNRs, which indicate that the ratios of N157B tend to differ from those of other two SNRs. We will use the abundances of He and N (from the detection of [N II] and He I emission lines), together with velocity measurements to tell whether the origin of the [P II] knots are SN ejecta or CSM/ISM. For this purpose we have built a family of radiative shock with self-consistent pre-ionization using MAPPINGS 5.1.18, with shock velocities in the range of 100 to 475 km/s. We will compare the observed and modeled line fluxes for different depletion factors.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.23-30
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• 2004

Interfacial reaction of Pb-free $Sn0.7wt{\%}Cu$ and $Sn3.8wt{\%}Ag0.7wt{\%}Cu$ solders and Pt during aging has been investigated. After the $Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$ specimens were reflowed at $250^{\circ}C$ for 30s and the $Sn0.7wt{\%}Cu/Pt$ specimens were reflowed at $260^{\circ}C$, the specimens were aged at $125^{\circ}C,\;150^{\circ}C$ and $170^{\circ}C$ for 25-121 hours. The intermetallic thitkness and morphology change during aging were characterized using SEM, EDS and XRD. $PtSn_4$ and $PtSn_2$ were observed in the solder/pt interface and the intermetallic formation was governed by diffusion. The activation energy of intermetallic formation was 145.3 kJ/mol for$Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$ specimens for $Sn0.7wt{\%}Cu/Pt$ specimens from the measurement of the intermetallic thickness with aging temperature and time.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.53-57
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• 2013

Although the lowering of Ag content in Sn-3.0Ag-0.5Cu is known to improve the mechanical shock reliability of the solder joint, it is also known to be detrimental to the solderbility. In this study, the quaternary alloying effect of In and the minor alloying effects of Mn and Pd on the solderability, thermal cycling and mechanical shock reliabilities of the low Ag content Sn-1.2Ag-0.7Cu solder were investigated using board-level BGA packages. The solderability of Sn-1.2Ag-0.7Cu-0.4In was proved to be comparable to that of Sn-3.0Ag-0.5Cu but its thermal cycling reliability was inferior to that of Sn-3.0Ag-0.5Cu. While the 0.03 wt% Pd addition to the Sn-1.2Ag-0.7Cu-0.4In decreased the solderability and reliabilities of solder joint, the 0.1 wt% Mn addition was proved to be beneficial especially for the mechanical shock reliability compared to those of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu compositions. It was considered to be due that the Mn addition decreased the Young's modulus of low Ag content Pb-free solders.

• Management & Information Systems Review
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• v.38 no.4
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• pp.137-157
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• 2019

Companies are trying to use enterprise SNS for collaboration and speedy decision-making. This study verified the mediating effect of communication between enterprise SNS and job performance, and proved the moderating effect of nationality between enterprise SNS and communication. This study collected survey data of 81 Korean and 81 Chinese from employees who have used enterprise SNS in Korea and China. As results of data analysis, first, enterprise SNS improved job performance through speedy information sharing and error reduction. Second, communication mediated the effect of enterprise SNS on job performance. Third, enterprise SNS increased the level of organizational communication through decreasing the burden of offline face-to-face communication. Compared with Chinese corporate organizations, Korean corporate organizations have high power distances, centralized control, and high superior authority. Therefore, in the off-line communication situation, the subordinate feels the social pressure to follow the command of the superior. Thus communication is one-way and closed. In this Korean organizational situation, corporate SNS can be used as a means to bypass rigid offline communication. In the online communication environment of non face-to-face corporate SNS, anxiety and stress of face-to-face communication can be reduced, so communication between the upper and lower sides can flow more smoothly. The contribution of this paper is that it proved that enterprise SNS promotes communication and improve job performance by reducing the anxiety or stress of offline communication, while according to prior research successful adoption of many types of information systems requires the fit between an organization and its organizational culture.

• Journal of Digital Convergence
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• v.18 no.2
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• pp.277-284
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• 2020

Text mining is a representative method of big data analysis that extracts meaningful information from unstructured and large amounts of text data. Social media such as Twitter generates hundreds of thousands of data per second and acts as a one-person media that instantly and directly expresses public opinions and ideas. The traditional media are delivering informations, criticizing society, and forming public opinions. For this, we compare the responses of SNS with the responses of media on the issue of the termination of the Korea-Japan GSOMIA (General Security of Military Information Agreement), one of the domestic issues in the second half of 2019. Data collected from 201,728 tweets and 20,698 newspaper articles were analyzed by sentiment analysis, association keyword analysis, and cluster analysis. As a result, SNS tends to respond positively to this issue, and the media tends to react negatively. In association keyword analysis, SNS shows positive views on domestic issues such as "destruction, decision, we," while the media shows negative views on external issues such as "disappointment, regret, concern". SNS is faster and more powerful than media when studying or creating social trends and opinions, rather than the function of information delivery. This can complement the role of the media that reflects public perception.

• Journal of the Korean Applied Science and Technology
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• v.41 no.3
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• pp.842-855
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• 2024

This study was conducted to investigate the reliability of Social Media information according to the actual use of nail shops through Social Media and the effect of nail shops on the selection factors, and to contribute to the management strategy of nail companies by securing loyal customers through effective promotion and customer satisfaction through Social Media. The survey was conducted by analyzing the final 403 copies of adult women in their 20s and 50s who used nail shops using Social Media. As a result of the study, it was found that there is a difference according to each factor in the actual use of nail shops through Social Media according to general characteristics. Second, there were differences in information reliability according to the actual use of nail shops through Social Media and Social Media nail shop selection factors. Third, there was a difference in the reliability of Social Midea information and selection factors according to the use of nail shops Social Media. Fourth, it was found that the reliability of Social Midea information affects the selection factors of nail shops through Social Media. Therefore, it can be helpful in revitalizing the nail beauty market by increasing the satisfaction of consumers who use nail shops and basic data for establishing nail shop management strategies.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.23-29
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• 2006

Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.