• Applied Chemistry for Engineering
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• v.23 no.6
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• pp.554-560
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• 2012

Recently, it has been increasing trend to use conductive materials as electronics and communication technology in electronics industry are developing. The noble metal such as Ag, Pt, Pd etc. are mostly used as conductive materials, To reduce production cost, alternative materials with similar characteristics of noble metals are needed. Copper has advantages, i.e its electronic properties are similar to noble metals and low cost than noble metal, but its use has been restricted because of oxidation in air. In this study, the tin film was coated on copper by electroless plating to protect copper from oxidation and to confirm the effects of temperature, pH, amount of $SnCl_2$, and feeding speed in plating conditions. Additionally, we apply $Cu_{core}Sn_{shell}$ powder as conductive filler with low-temperature densification and analysis by SEM, XRD, FIB and 4-Point Probe techniques. As result of the study, tin film was coated well on copper and was protected from oxidation. After low-temperature densification treatment, the meted tin made chemical interconnections with copper. Accordingly, conductivity was increased than before condition. We hope $Cu_{core}Sn_{shell}$ powder to replace noble metals and use in the electronic field.

• The Journal of Korean Academy of Prosthodontics
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• v.50 no.3
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• pp.169-175
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• 2012

Purpose: In this study, brazing characteristics of $ZrO_2$ and Ti-6Al-4V brazed joints with increasing temperature were investigated. Materials and methods: The sample size of the $ZrO_2$ was $3mm{\times}3mm{\times}3mm$ (thickness), and Ti-6Al-4V was $10mm(diameter){\times}5mm(thickness)$. The filler metal consisted of Ag-Cu-Sn-Ti was prepared in powder form. The brazing sample was heated in a vacuum furnace under $5{\times}10^{-6}$ torr atmosphere, while the brazing temperature was changed from 700 to $800^{\circ}C$ for 30 min. Results: The experimental results shows that brazed joint of $ZrO_2$ and Ti-6Al-4V occurred at $700-800^{\circ}C$. Brazed joint consisted of Ag-rich matrix and Cu-rich phase. A Cu-Ti intermetallic compounds and a Ti-Sn-Cu-Ag alloy were produced along the Ti-6Al-4V bonded interface. Thickness of the reacted layer along the Ti-6Al-4V bonded interface was increased with brazing temperature. Defect ratios of $ZrO_2$ and Ti-6Al-4V bonded interfaces decreased with brazing temperature. Conclusion: Thickness and defect ratio of brazed joints were decreased with increasing temperature. Zirconia was not wetting with filler metal, because the reaction between $ZrO_2$ and Ti did not occur enough.

• Journal of the Mineralogical Society of Korea
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• v.27 no.1
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• pp.31-40
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• 2014

In present study, we geochemically investigated the fresh coal ashes and the saline ash pond of an electric power plant in Korea, which burns imported bituminous coals. The goals are to see the chemical changes of the ash pond by reaction with coal ashes and to investigate the relative leachability of elements from the ashes by reaction with saline waters. For this study, one fresh fly ash, one fresh bottom ash, and 7 water samples were collected. All the ash samples and 2 water samples were analyzed for 55 elements. The results indicated that the fly ashes are enriched with chalcophilic elements such as Cu, Zn, Ga, Ge, Se, Cd, Sb, Au, Pb, and B relative to other elements. On the other hand, concentrations of As, Ba, Co, Ga, Li, Mn, Mo, Sb, U, V, W, and Zr are much higher in the ash pond than those dissolved in the seawater. Ag, Bi, Li, Mo, Rb, Sb, Sc, Se, Sn, Sr, and W show high ratios of elemental concentrations in pond water to those in the fly ash. Our results imply that the leaching of trace elements is regulated by geochemical controls such as solubility and adsorption even though the trace elements are relatively enriched on the ash surfaces after the coal combustion due to their volatilities.

• Korean Journal of Soil Science and Fertilizer
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• v.21 no.2
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• pp.129-134
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• 1988

Enzymatical properties of Streptomyces sp. S-45 producing chitinase and ${\beta}$-1.3-glucanase isolated from soil were investigated. Chitinase activity was 3.01(U/ml) and ${\beta}$-1.3-glucanase activity was 2.49(U/ml). The optimum medium for mycolytic enzyme production of strain was composed of 0.7% colloidal chitin, 0.3% glucose, 0.5% asparagine, 0.2% peptone, 0.01% NaCl, 0.01% $K_2HPO_4$ and 0.01% $MgSO_4{\cdot}7H_2O$ in intial pH 7.0. The optimal condition for mycolytic enzyme activities were: pH 6.5-7.0, $45-50^{\circ}C$. Enzyme activities were activated by metal ion as $10^{-2}M\;Co^{{+}{+}}$, $Cu^{{+}{+}}$, $Mn^{{+}{+}}$, $Al^{{+}{+}{+}}$ and $10^{-3}M\;Sn^{{+}{+}}$ but $Ag^{{+}{+}}$, $Hg^{{+}{+}}$ inhibited.

• Journal of the Korean Society of Radiology
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• v.8 no.7
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• pp.371-376
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• 2014

The process of flip-chip bump bonding, Au wire bonding and encapsulation were sucessfully developed and modularized. The CdTe sensor and ROIC were optimally jointed together at $150^{\circ}C$ and $270^{\circ}C$ respectively under24.5 N for 30s. To make SnAg bump on ROIC easy to be bonded, the higher bonding temperature was established than CdTe sensor's. In addition, the bonding pressure was lowered minimally because CdTe Sensor is easier to break than Si Sensor. CdTe multi-energy sensor module observed were no electrical failures in the joints using developed flip chip bump bonding and Au wire bonding process. As a result of measurement, shearing force was $2.45kgf/mm^2$ and, it is enough bonding force against threshold force, $2kgf/mm^2s$.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.27 no.1
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• pp.1-8
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• 2017

Catalytic synthesis and properties of ${\beta}-Ga_2O_3$ nanowires grown by metal organic chemical vapor deposition are reported. Au, Ni and Cu catalysts were suitable for the growth of $Ga_2O_3$ nanowires under our experimental conditions. The $Ga_2O_3$ nanowires grown by using Au, Ni and Cu catalysts showed different growth rates and morphologies in each case. We found the $Ga_2O_3$ nanowires were grown by the Vapor-Solid (VS) process when Ni was used as a catalyst while the Vapor-Liquid-Solid (VLS) was a dominant process in case of Au and Cu catalysts. Also, we found nanowires showed different optical properties depend on catalytic metals. On the other hand, for the cases of Ti, Sn and Ag catalysts, nanowires could not be obtained under the same condition of Au, Cu and Ni catalytic synthesis. We found that these results are related to the different characteristics of each catalyst, such as, melting points and phase diagrams with gallium metal.

• Economic and Environmental Geology
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• v.26 no.1
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• pp.41-54
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• 1993

The Ulsan Fe-W deposit, which can be classified as a calcareous skarn deposit, is represented by ore pipe consisting principally of magnetite and lesser amounts of scheelite with minor sulphides, sulphosaits, arsenides, sulpharsenides, etc. At Ulsan mine, metasomatic processes of skarn growth may be divided broadly into two stages based on the paragenetic sequence of calc-silicate minerals and their chemical composition; early and late skarn stages. Early stage has started with the formation of highly calcic assemblages of wollastonite, diopsidic clinopyroxene and nearly pure grossular, which are followed by the formation of clinopyroxenes with salite to ferrosalite composition and grandite garnets with intermediate composition. Based on these calc-silicate assemblages, the temperatures of early skarn formations have been in the ranges of $550^{\circ}$ to $450^{\circ}$. The calc-silicate assemblages formed during the earlier half period of late skarn stage show the enrichment of notable iron and slight manganese, and the depletion of magnesium; clinopyroxenes are hedenbergitic, and grandite garnets are andraditic. The formation temperatures during this skarn stage are inferred to have been in the range of $430^{\circ}$ to $470^{\circ}C$ at low $X_{CO_2}$ by data from fluid inclusions of late andraditic garnets. The later half period of late skarn stage is characterized by the hydrous alteration of pre-existing minerals and the formation of hydrous silicates. The main iron-tungsten mineralization representing prominent deposition of magnetite immediately followed by minor scheelite impregnation has taken place at the middle of early skarn stage, while complex polymetallic mineralization has proceeded during and after the late skarn stage. Various metals and semimetals of Fe, Ni, Co, Cu, Zn, As, Mo, Ag, In, Sn, Sb, Te, Pb and Bi have been in various states such as native metal, sulphides, arsenides, sulphosaits, sulpharsenides and tellurides.

• Economic and Environmental Geology
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• v.46 no.2
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• pp.199-206
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• 2013

The Daehyun gold-silver deposit consists of two hydrothermal quartz veins that fill NE-trending fractures in the Cambro-Ordovician calcitic marble. I have sampled wallrock, hydrothermaly-altered rock and gold-silver ore vein to study the element dispersion and element gain/loss during wallrock alteration. The hydrothermal alteration doesn't remarkably recognized at this deposit and consists of mainly calcite, dolomite, quartz and minor epidote. The ore minerals composed of arsenopyrite, pyrrhotite, pyrite, sphalerite, stannite, chalcopyrite, galena, electrum, native bismuth and silver-bearing mineral. Based on analyzed data, the chemical composition of wallrock consists of mainly $SiO_2$, CaO, $CO_2$ with amounts of $Al_2O_3$, $Fe_2O_3(T)$ and MgO. The contents of $SiO_2$, $Fe_2O_3(T)$, MgO, CaO and $CO_2$ vary significantly with distance from ore vein. The element dispersion doesn't remarkably recognized during wallrock alteration and only occurs near the ore vein margin because of physical and chemical properties of wallrock. Remarkable gain elements during wallrock alteration are $Fe_2O_3(T)$, total S, Ag, As, Bi, Cd, Cu, Ni, Pb, Sb, Sn, W and Zn. Remarkable loss elements are $SiO_2$, MnO, MgO, CaO. $CO_2$ and Sr. Therefore, Our result may be used when geochemical exploration carry out at deposits hosted calcitic marble in the Hwanggangri metallogenic district.

• Korean Journal of Materials Research
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• v.28 no.9
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• pp.528-533
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• 2018

In recent years, solar cells based on crystalline silicon(c-Si) have accounted for much of the photovoltaic industry. The recent studies have focused on fabricating c-Si solar modules with low cost and improved efficiency. Among many suggested methods, a photovoltaic module with a shingled structure that is connected to a small cut cell in series is a recent strong candidate for low-cost, high efficiency energy harvesting systems. The shingled structure increases the efficiency compared to the module with 6 inch full cells by minimizing optical and electrical losses. In this study, we propoese a new Conductive Paste (CP) to interconnect cells in a shingled module and compare it with the Electrical Conductive Adhesives (ECA) in the conventional module. Since the CP consists of a compound of tin and bismuth, the module is more economical than the module with ECA, which contains silver. Moreover, the melting point of CP is below $150^{\circ}C$, so the cells can be integrated with decreased thermal-mechanical stress. The output of the shingled PV module connected by CP is the same as that of the module with ECA. In addition, electroluminescence (EL) analysis indicates that the introduction of CP does not provoke additional cracks. Furthermore, the CP soldering connects cells without increasing ohmic losses. Thus, this study confirms that interconnection with CP can integrate cells with reduced cost in shingled c-Si PV modules.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.11-17
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• 2009

The drop impact reliability comes to be important for evaluation of the life time of mobile electronic products such as cellular phone. The drop impact reliability of solder joint is generally affected by the kinds of pad and reflow number, therefore, the reliability evaluation is needed. Drop impact test proposed by JEDEC has been used as a standard method, however, which requires high cost and long time. The drop impact reliability can be indirectly evaluated by using high speed shear test of solder joints. Solder joints formed on 3 kinds of surface finishes OSP (Organic Solderability Preservation), ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) was investigated. The shear strength was analysed with the morphology change of intermetallic compound (IMC) layer according to reflow number. The layer thickness of IMC was increased with the increase of reflow number, which resulted in the decrease of the high speed shear strength and impact energy. The order of the high speed shear strength and impact energy was ENEPIG > ENIG > OSP after the 1st reflow, and ENEPIG > OSP > ENIG after 8th reflow.