• Analytical Science and Technology
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• v.7 no.3
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• pp.293-299
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• 1994

Fifty ancient Korean coins originated in Choson period have been determined for 11 elements such as Sn, Fe, As, Au, Co, Sb, Ir, Os, Ru and Ni by destructive and non-destructive neutron activation analysis as well as for 3 elements such as Cu, Pb and Zn by atomic absorption spectroscopy. The multivariate data have been analyzed by principal component mapping method. The spread of sample points in the eigenvector polt has been attributed to common origins of some elements.

• Korean Journal of Oriental Medicine
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• v.6 no.1
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• pp.117-122
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• 2000

The purpose of this study is to compare the contents of heavy metals of boiled ssangwhatang with those of herbal ingredients which are composed of ssangwhatang. Ssangwhatang is used for antifatigue, tonic and so on. With industrial development, our environment has been very polluted. Herbal medicines also are seriously contaminated by heavy metals and pesticides. The herbal medicines of ssangwhatang were bought at 10 defferent markets. The contents of 14 heavy metals(Ag, As, Ba, Cd, Cr, Cu, Fe, Hg, Mn, Ni, Pb, Sb, Sn, Zn) were analysed using ICP. It was found out that 7 heavy metals(Pb, As, Ba, Cd, Hg, Sb, Sn) were not detected at all in boiled ssangwhatangs. But they were detectable in all ssangwhatangingredients before boiling. For example, the content of Pb in one pack of ssangwhatang before boiling was $0.039^{\circ}{\pm}0.005mg$ and Pb in boiled one was not detected. Herbal medicine itself is seriously contaminated by heavy metals. These results suggest that boiled ssangwhatang which we take is safe from the contamination of heavy metals.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.252-255
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• 2004

Various Semiconductor/Metal structured nanowires were synthesized from the simple thermal annealing of ball-milled compound powders and the thermal evaporation of metals. Their structural properties were investigated by Scanning Electron Microscopy(SEM) and Transmission Electron Microscopy(TEM), Energy Dispersive X-ray spectroscopy(EDX). Depending on the type of metals and the material of nanowires, uniform somiconductor/metal nanowires(GaN/Al, GaN/Ag) or isolated metal particles on semiconductor nanowires$(SnO_2/Ti,\;Si/Ti)$ were formed on the surface of nanowires.

• Journal of Electrochemical Science and Technology
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• v.11 no.4
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• pp.323-329
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• 2020

The cathodic hydrogen evolution ability of different pure metals and their long term galvanic corrosion behavior with pure Mg were investigated. The hydrogen evolution ability of pure Ti, Al, Sn and Zr is weak, while that of Fe, W, Cr, and Co is very strong. Initial polarization test could not completely reveal the cathodic behavior of the tested metals during long term corrosion. The cathodic hydrogen evolution ability may vary significantly in the long term galvanic tests for different metals, especially for Al whose cathodic current density reduced to 1/50 of the initial value. The anodic polarization shows that Al and Sn as alloying elements are supposed to provide relatively good passive effect for Mg alloy, while Ag can provide a slight passive effect and Zn has little passive effect.

• ETRI Journal
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• v.13 no.2
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• pp.42-53
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• 1991

고유전율 적충세라믹 커패시터 소재인 $BaTiO_3$ 자기물은 일반적으로 큐리오도인 약 $120^{\circ}C$부근에서 유전율이 최고 약 10,000정도로 증가한 다음 급격히 감소하므로 적절한 이동체를 첨가하여 큐리온도를 상온으로 이동시켜 상온에서 최대 유전율을 이용하여야 한다. 그리고$BaTiO_3$ 자기물은 $1300^{\circ}C$이상의 고온소결시 고가인 Pd전극이 요구된다. 그러나 자기물의 소결온도를 저온화화면 저가의 Ag합금으로 전극재료를 대체할 수 있다. 본 연구에서는 이동제로서 $CaSnO_3$ 를 이용하여 큐리온도를 상온으로 이동시켰다. 또한 소결온도를 저온화하기 위하여 $BaTiO_3$ 세라믹에 여러가지 산화물을 첨가하여 소결현상을 살펴보았다. 실험결과 첨가제를 넣지 않은 경우 소결온도는 $1350^{\circ}C$의 고온이 필요한 반면, $CuO,B_2O_3$는 $1050^{\circ}C$의 낮은 온도에서도 치밀화와 입도성장이 잘 일어났다. 특히 $B_2$$O_3$ 를 첨가한 경우는 $1250^{\circ}C$이상에서 소결할 때 절연저항이 낮아 유전손실이 큰 문제점을 보였지만, 최대 유전율이 11,000 정도로 높고, 양호한 유전율의 온도변화 특성을 나타내어 우수한 고유전율 소재의 첨가제로 응용될 가능성을 보였다

• Journal of Welding and Joining
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• v.32 no.3
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• pp.74-80
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• 2014

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from their devices and system. Especially, reliability issue of lead-free solder joint is increasing in car electronics due to ELV (End-of-Life Vehicle) banning from 2016. We have prepared engine control unit (ECU) modules soldered with Sn-40Pb and Sn-3.0Ag-0.5Cu (SAC305) solders, respectively. Degradation characteristics of solder joint strength were compared with various conditions of automobile environment such as cabin and engine room. Thermal cycle test (TC, $-40^{\circ}C$ ~ ($85^{\circ}C$ and $125^{\circ}C$), 1500 cycles) were conducted with automotive company standard. To compare shear strength degradation rate with eutectic and Pb-free solder alloy, we measured shear strength of chip components and its size from cabin and engine ECU modules. Based on the TC test results, finally, we have known the difference of degradation level with solder alloys and use environmental conditions. Solder joints degradation rate of engine room ECU is superior to cabin ECU due to large CTE (coefficient of thermal expansion) mismatch in field condition. Degradation rate of engine room ECU is 50~60% larger than cabin room electronics.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.389-389
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• 2011

Transparent conductive oxide (TCO) 박막은 디스플레이 및 태양전지 등 광범위한 분야에서 적용되고 있으며, 특히 indium tin oxide (ITO)는 낮은 전기적 저항과 우수한 광투과도를 가지고 있어서 이미 많은 분야에 적용되고 있다. 본 연구는 RF와 DC를 혼용한 마그네트론 스퍼터링 공정을 활용하여 ITO 박막 특성 및 이를 활용한 유기태양전지 적용에 관한 것이다. UV-O3 처리된 glass 기판위에 thermal evaporation 방식으로 밀착력을 높이기 위하여 Cr을 5 nm 두께로 증착한 후 Al을 95 nm 증착하였다. 그 위에 스퍼터링 공정으로 ITO 박막을 In2O3:SnO2 target (10wt% SnO2)을 사용하여 1.0 mTorr의 공정압력(Ar:O2=30:1), 50W의 RF power 및 0.11kW의 DC power에서 50~250 nm의 두께로 증착하였다. ITO 박막의 결정구조 및 표면 형상은 x-ray diffraction (XRD) 및 scanning electron microscope (SEM)을 사용하여 분석하였으며, 전기적 특성은 four-point probe법으로 비저항값을 측정하였다. 또한 높은 광변환효율을 가지는 태양전지 제작을 위하여, 다양한 두께의 ITO 박막을 사용하여 ITO/ZnO/P3HT:PCBM/PEDOT/Ag 구조의 유기태양전지를 제작하여 소자 특성을 최적화 하였다.

• The Korean Journal of Zoology
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• v.37 no.1
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• pp.19-32
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• 1994

가장 효과적인 H-2b 항원에 대한 시험관내 항체 생산 조건을 찾기 위하여 근교계 생쥐인 C57BL/6BySnj의 비장세포를 UV로 불활성학 시킨 후 항원으로 사용하고, A/wySnJ$\times$Sm/J(ASmJF1, hybrid)의 비장세포를 항원 수용자 계통으로 하여 5-7일동안 배양기에서 항체 생산을 유도하였다. 본 실험에서 T 임파구 대식세포와 임파구 분화 촉진 인자인Concanavalin A Lipopolvsaccharide. Pokeweed mitogen 등을 사용하여 20가지 조건으로 실험을 수행하여, 항체 생성 여부는 보체 의존성 세포 장애 실험과 면역 효소법에 의해 조사하였다 그 결과 모든 조건에서 항체생산이 확인되었으며. 가장 좋은 시험관내 항체 생산 조건으로는 T 임파구와 대식세포를 함께 사용하여 면역시킨 것이 가장 효과적이었다. 이 방법을 이용하여 항체 생산을 유도한 후 5일째 면역된 비장세포를 Sp2/0-Ag 14와 세포 융합시켜 H-2b 마우스의 체포 표면 항원에 대한 단일군항체 생산을 시도하였다. 또한 생체내 면역 방법과 비교하기 위해 6주간 C57BL/6BySnJ의 비장세포를 복강내에 주사하여 같은 조건으로 세포융합을 시도하였다. 그 결과 H-2b 세포의 표면 항원에 대한 항체 생산을 하는 세포군은 시험관내 면역 방법에서 3개 생체내 면역 방법에서 4개부 확인되었다.

• Journal of the Korean Society of Safety
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• v.27 no.6
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• pp.7-13
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• 2012

A lack of study on the dynamic tensile strengths of Sn-based solder joints at high strain rates was the motivation for the present study. A modified miniature Charpy impact testing machine instrumented with an impact sensor was built to quantitatively evaluate the dynamic impact strength of a solder joint under tensile impact loading. This study evaluated the tensile strength of lead-free solder ball joints at strain rates from $1.8{\times}10^3s^{-1}$ and $8.5{\times}10^3s^{-1}$. The maximum tensile strength of the solder ball joint decreases as the load speed increases in the testing range. This tensile strength represented that of the interface because of the interfacial fracture site. The tensile strengths of solder joints between Sn-3.0Ag-0.5Cu and copper substrate were between 21.7 MPa and 8.6 MPa in the high strain range.

• Korean Journal of Materials Research
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• v.19 no.6
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• pp.337-343
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• 2009

In this study, we optimized Pb-free Sn/Ni plating thickness and conditions were optimized to counteract the environmental regulations, such as RoHS and ELV(End-of Life Vehicles). The $B_{10}$ life verification method was also suggested to have been successful when used with the accelerated life test(ALT) for assessing Pb-free solder joint life of piezoelectric (PZT) ceramic resonator. In order to evaluate the solder joint life, a modified Norris-Landzberg equation and a Coffin-Manson equation were utilized. Test vehicles that were composed of 2520 PZT ceramic resonator on FR-4 PCB with Sn-3.0Ag-0.5Cu for ALT were manufactured as well. Thermal shock test was conducted with 1,500 cycles from $(-40{\pm}2)^{\circ}C$ to $(120{\pm}2)^{\circ}C$, and 30 minutes dwell time at each temperature, respectively. It was discovered that the thermal shock test is a very useful method in introducing the CTE mismatch caused by thermo-mechanical stress at the solder joints. The resonance frequency of test components was measured and observed the microsection views were also observed to confirm the crack generation of the solder joints.