• The Journal of the Institute of Internet, Broadcasting and Communication
• /
• v.16 no.1
• /
• pp.183-191
• /
• 2016

SNS is developing rapidly along with diffusion of smartphone. However as useage of SNS became excessive, SNS addiction became a social problem. Meanwhile the problem that users leavning SNS because of negative perceptions about SNS became issue. As both SNS addiction and continuance are important when using SNS, this study examines factors affecting Facebook addiction and continuance. We derive three personal traits, which is autonomy, competence, relatedness as variables that affect Facebook addiction and continuance to use Facebook. The authors' structural equation model using data, collected from 204 Facebook user, showed that autonomy and competence significantly affected Facebook addiction. Also, autonomy, competence and relatedness significantly affect Facebook continuance.

• Journal of Powder Materials
• /
• v.31 no.2
• /
• pp.146-151
• /
• 2024

Pure SnO₂ has proven very difficult to densify. This poor densification can be useful for the fabrication of SnO₂ with a porous microstructure, which is used in electronic devices such as gas sensors. Most electronic devices based on SnO₂ have a porous microstructure, with a porosity of > 40%. In pure SnO₂, a high sintering temperature of approximately 1300℃ is required to obtain > 40% porosity. In an attempt to reduce the required sintering temperature, the present study investigated the low-temperature sinterability of a current system. With the addition of TiO₂, the compositions of the samples were Sn_1-xTi_xO₂-CoO(0.3wt%)-CuO(2wt%) in the range of x ≤ 0.04. Compared to the samples without added TiO₂, densification was shown to be improved when the samples were sintered at 950℃. The dominant mass transport mechanism appears to be grain-boundary diffusion during heat treatment at 950℃.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.13 no.5
• /
• pp.241-246
• /
• 2003

The transparent conducting thin film of ATO (antimony-doped tin oxide) was successfully fabricated on$SiO_2$/glass substrate by a sol-gel dip coating method. The crystalline phase of the ATO thin film was identified as SnO$_2$ major phase and the film thickness was about 100 nm/layer at the withdrawal speed of 50 mm/minute. Optical transmittance and electrical resistivity of the 400 nm-thick ATO thin film which was annealed under nitrogen atmosphere were 84% and $5.0\times 10^{-3}\Omega \textrm{cm}$, respectively. It was found that the $SiO_2$ layer inhibited Na ion diffusion and the formation of impurities like $Na_2SnO_3$ or SnO while increasing Sb ion concentration and higher ratio of $Sb^{5+}/Sb^{3+}$in the film. Annealing at nitrogen atmosphere leads to the reduction of $Sn^{4+}$ as well as $Sb^{5+}$ resulting in decrease of the electrical resistivity of the film.

• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.3
• /
• pp.9-18
• /
• 1999

In this study, Metallugical properties between Sn-3.5Ag, Sn-37Pb eutectic solders and Au/Ni/cu substrate according to time span above the melting point were investigated. A conventional reflow soldering machine wert used for this study and time span above the melting point was determined by changing peak soldering temperature and conveyor speed. As results, scallop type intermetallic compounds of $Ni_3Sn_4$ were formed at joint interface and no Cu-Sn compounds were found at all; Ni layer performed as a barrier for Cu diffusion. As the peak soldering temperature increased, thickness of the intermetallic compound layer increased; maximum thickness of the scallop-layer was 2.2$\mu\textrm{m}$. The shape of scallops were transformed from hemi-sphere type to elliptical shape with smaller size. Micro-hardness of the solder joint decreased as the eutectic structure of Sn-3.5Ag and Sn-37Pb increased.

• Composites Research
• /
• v.12 no.6
• /
• pp.22-30
• /
• 1999

Since the surface diffusion processed $Nb_3Sn$ superconducting tape has the advantage of having large overall critical current density. it is used for the construction of open type MRI superconducting magnets. However one of the disadvantages of this tape is that $Nb_3Sn$ compound often exhibited multiple cracking due to its intrinsic brittleness when subjected to mechanical loading such as bending and winding during the fabrication process for superconducting coil. This will eventually cause the severe degradation of critical current density. Therefore it is important to understand the microscopic deformation behavior of this kind of superconducting tape under the mechanical loading.In this study, acoustic emission(AE) was used to clarify microscopic deformation behavior at room temperature for $Nb_3Sn$ superconducting tape which was strengthened and stabilized with copper. For this purpose, special attention was paid to AE characteristics including AE event, energy, and amplitude distribution which were associated with microscopic mechanism of deformation of $Nb_3Sn$ superconducting tape under tensile load.

• Korean Journal of Materials Research
• /
• v.23 no.12
• /
• pp.667-671
• /
• 2013

We present an easy method of preparing two-dimensional (2D) periodic hollow tin oxide ($SnO_2$) hemisphere array gas sensors using polystyrene (PS) spheres as a template. The structures were fabricated by the sputter deposition of thin tin (Sn) metal over an array of PS spheres on a planar substrate followed by calcination at an elevated temperature to oxidize Sn to $SnO_2$ while removing the PS template cores. The $SnO_2$ hemisphere array structures were examined by scanning electron microscopy and X-ray diffraction. The structures were calcined at various temperatures and their sensing properties were examined with varying operation temperatures and concentrations of nitric oxide (NO) gas. Their gas-sensing properties were investigated by measuring the electrical resistances in air and the target gases. The measurements were conducted at different NO concentrations and substrate temperatures. A minimum detection limit of 30 ppb, showing a sensitivity of S = 1.6, was observed for NO gas at an operation temperature of $150^{\circ}C$ for a sample having an Sn metal layer thickness corresponding to 30 sec sputtering time and calcined at $600^{\circ}C$ for 2 hr in air. We proved that high porosity in a hollow $SnO_2$ hemisphere structure allows easy diffusion of the target gas molecules. The results confirm that a 2D hollow $SnO_2$ hemisphere array structure of micronmeter sizes can be a good structural morphology for high sensitivity gas sensors.

• Proceedings of the KWS Conference
• /
• 2002.10a
• /
• pp.450-455
• /
• 2002

Cu-cored Sn-Ag solder balls were fabricated by coating pure Sn and Ag on Cu balls. The melting behavior and the solderability of the BGA joint with the Ni/Au coated Cu pad were investigated and were compared with those of the commercial Sn-Ag and Sn-Ag-Cu balls. DSC analyses clarified the melting of Cu-cored solders to start at a rather low temperature, the eutectic temperature of Sn-Ag-Cu. It was ascribed to the diffusion of Cu and Ag into Sn plating during the heating process. After reflow soldering the microstructures of the solder and of the interfacial layer between the solder and the Cu pad were analyzed with SEM and EPMA. By EDX analysis, formation of a eutectic microstructure composing of $\beta$-Sn, Ag$_3$Sn, ad Cu$_{6}$Sn$_{5}$ phases was confirmed in the solder, and the η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer was found to form at the interface between the solder and the Cu pad. By conducting shear tests, it was found that the BGA joint using Cu-cored solder ball could prevent the degradation of joint strength during aging at 423K because of the slower growth me of η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer formed at the solder, pad interface. Furthermore, Cu-cored multi-component Sn-Ag-Bi balls were fabricated by sequentially coating the binary Sn-Ag and Sn-Bi solders on Cu balls. The reflow property of these solder balls was investigated. Melting of these solder balls was clarified to start at the almost same temperature as that of Sn-2Ag-0.75Cu-3Bi solder. A microstructure composing of (Sn), Ag$_3$Sn, Bi and Cu$_{6}$Sn$_{5}$ phases was found to form in the solder ball, and a reaction layer containing primarily η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ was found at the interface with Ni/Au coated Cu pad after reflow soldering. By conducting shear test, it was found that the BGA joints using this Cu-core solder balls hardly degraded their joint shear strength during aging at 423K due to the slower growth rate of the η'-(Au, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer at the solder/pad interface.he solder/pad interface.

• Journal of the Microelectronics and Packaging Society
• /
• v.5 no.1
• /
• pp.7-18
• /
• 1998

In the flip chip interconnection on organic substrates using eutectic Pb/Sn solder bumps highly reliable Under Bump Metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as 1$\mu$m Al/0.2$\mu$m Pd/1$\mu$m Cu, laid under eutectic Pb/Sn solder were investigated with regard to their interfacial reactions and adhesion proper-ties. The effects of numbers of solder reflow and aging time on the growth of intermetallic compounds (IMCs) and on the solder ball shear strength were investigated. Good ball shear strength was obtained with 1$\mu$m Al/0.2$\mu$m Ti/5$\mu$m Cu and 1$\mu$m Al/0.2$\mu$m ni/1$\mu$m Cu even after 4 solder reflows or 7 day aging at 15$0^{\circ}C$. In contrast 1$\mu$m Al/0.2$\mu$m Ti/1$\mu$m Cu and 1$\mu$mAl/0.2$\mu$m Pd/1$\mu$m 쳐 show poor ball shear strength. The decrease of the shear strength was mainly due to the direct contact between solder and nonwettable metal such as Ti and Al resulting in a delamination. In this case thin 1$\mu$m Cu and 0.2$\mu$m Pd diffusion barrier layer were completely consumed by Cu-Sn and pd-Sn reaction.

• Management & Information Systems Review
• /
• v.36 no.1
• /
• pp.95-114
• /
• 2017

The purpose of this study is to search information attributes suitable for SNS and to identify the influence of individuals or groups who contribute to the creation and diffusion of information in the SNS. The researchers extracted the accuracy, two-sided information, novelty, diversity, and experiential factors that influence the acceptance and diffusion of information in the SNS, and identified the relationships among the variables, the usefulness of information and the degree of information diffusion intention. And researchers studied market maven who play the key role in creating and diffusing SNS information. A total of 600 questionnaires were collected and 549 questionnaires were used to test the research hypothesis. The results of the study are as follows. Consumers considered information, which had accuracy, two-sided, and experiential attributes, as useful. But novelty or diversity information were regarded as unuseful because of motive to avoid ambiguity. In the Market Maven Group who have the ability to acquire and edit SNS information, however, there were weak or negative causality between experience and accuracy and information usability factors. but positive causality between novelty and diversity factors of information and usability.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2006.09b
• /
• pp.831-832
• /
• 2006

Solid-state processing via the bulk mechanical alloying enables us to directly fabricate $Mg_2X$ semi-conductive material performs. Precise control of chemical composition leads to investigation on the dilution and enrichment of X in $Mg_2X$. Two types of solid-state reactivity are introduced: e.g. synthesis of $Mg_2Si$ from elemental mixture Mg-Si is nucleation-controlled process while synthesis of $Mg_2Sn$ from Mg-Sn, diffusion-controlled process. Thermoelectricity of these $Mg_2X$ is evaluated for discussion on the validity and effectiveness of this new PM route as a reliable tool for fabrication of thermoelectric compounds.