Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 5 Issue 1
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- Pages.7-18
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- 1998
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
A Study on the Eutectic Pb/Sn Solder Filip Chip Bump and Its Under Bump metallurgy(UBM)
- Paik, Kyung-Wook (Dept. of Materials Science and Engineering Korea Advanced Institute of Science and Technology shary)
- Published : 1998.06.01
Abstract
In the flip chip interconnection on organic substrates using eutectic Pb/Sn solder bumps highly reliable Under Bump Metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as 1
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