• 한국응용과학기술학회지
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• 제25권4호
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• pp.518-524
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• 2008

In this study, positive plates of lead acid battery of Pb-Ca alloy and Pb-Ca-Sn alloy were fabricated and the mechanical characteristics of positive plates were measured. This study observed how the changes of content of Ca & Sn affect interface corrosion which is located in between grid & active materials and lead acid batteries as well. The mechanical characteristics of grid alloy is better when Ca is 0.05 wt.% then 0.1 wt.%. This study said that the corrosion rate between the active material based on the charge/discharge cycle of lead acid battery and grid interface is much faster than a grid which contains Sn. And furthermore, according to the study the rate 30 of Sn/Ca which is added to grid shows the best performance.

• 한국정밀공학회지
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• 제26권7호
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• pp.112-119
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• 2009

The purpose of this study is to evaluate the evaluation of process yield performed by using Sn & Cu treatment on the surface to optimize process condition for Lead-free solder application. The materials which are used for the New Surface Treatment study are Semi-Dulling plating for high speed Sn/Cu alloy of Soft Alloy GTC-33 Pb free known as "UEMURA Method" and plating substrate is alloy 42.Especially in lead-free plating process, it is important to control plating thickness and Copper composition than Sn/Pb plating. Evaluated and controlled plating thickness $12{\pm}3um$, Copper composition $2{\pm}1%$, plating particle and visual inspection. The optimization of these parameters and condition makes it makes possible to apply Sn/Cu Lead-free solder from Sn/Pb alloy.

• 한국표면공학회지
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• 제4권1호
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• pp.16-23
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• 1971

In this study , fluoborte solution consisting of lead fluoborate, tin fluoborate and cupric acetate was used. By addition of small amount of Cu+= ion to the solution, the Cu content of deposition layer was almost controlled less than 5%. The amount of Cu in deposition layer was almost constant without any influence of Pb++ & Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution . Agitation of plating solution & low current density result in the increase of Cu content. Analyzing of microscopic structures and etching tests of the deposited alloy, it was believed that the alloy had a lamellar structure consisting of copper rich lamellar and lead rich layer.

• 보존과학회지
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• 제35권4호
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• pp.309-316
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• 2019

This study intends to identify manufacturing techniques, including casting and alloy composition, of nine metal Buddha statues excavated from archaeological sites in Bagan, Myanmar. Two Buddha statues from Pyu city state(2^nd to 9^th century) contain Cu-Sn alloy(including <1 wt% Fe), with different relatively high percentages of Sn(16 wt% and 25 wt%) identified from each Buddha statue, and no Pb detected. Five Buddha statues from the Bagan dynasty contain various alloy ratios of Cu-Sn(including <1 wt% Pb), Cu-Sn-Pb, and Cu-Sn-Zn-Pb. All Buddha statues appear to be fabricated by casting, as there is no evidence of other heat treatments. The silver Buddha statue manufactured in the 18^th century includes >1% Cu besides silver with no additional metallic components identified. The bronze Buddha statue manufactured in the Konbaung dynasty(18^th century) is of Cu-Sn-Pb alloy. The Buddha statues of Pyu was alloy of Cu-Sn without Pb including ahigh percentage of The Buddha statues of both the Bagan and Konbaung dynasties are comprised of ternary Cu-Sn-Pb alloys, with a heterogeneous distribution of lead and tin. Some of Buddha statues of the Bagan dynasty have similar alloy ratios as those of Pyu, suggesting that similar manufacturing techniques were used.

• 한국주조공학회지
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• 제12권3호
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• pp.210-219
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• 1992

The measurement of the apparent and tap density for Al-Pb-X(Sn,Sn-Si) powders produced by centrifugal atomizer showed that the larger theoretically calculated densities the larger those densities. And tap densities were not over 50% of the theoretical densities. The nip angle of Al-5wt%Pb alloy powders produced with 38000 r.p.m. of disk rotation was $3^{\circ}$ degree larger than that of Al-8.5wt%Pb-3wt%Sn(-4wt%Si, 8wt%Si) with 50000 r.p.m. The effects of roll gap and rolling speed on thickness and density of the single strips by rolling were that rolling speed increasing the thickness and density of strip decreased and roll gap increasing, the thickness of strip increased but the density decresed. The compactibility of Al-Pb-X with Al by rerolling showed that the coarse powder-strips were better than fine powder-strips. From the SEM study with EDX analysis on the sintered strips, it was found that Pb and Sn were segregated with maximum size $5{\mu}m$, and Si existed surrounding the segregation zone. After sintering the clad strips at $500^{\circ}C$, the pores, which were spherical with $5{\mu}m$ of mean diameter, partly remained around the particles of alloy powders area, while completely disappeared at clad interface. The hardness of strips of alloy powders decreased linearly with increasing sintering temperature.

• 한국재료학회지
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• 제12권9호
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• 마이크로전자및패키징학회지
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• 제25권2호
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• pp.25-30
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• 2018

Sn-Pb솔더는 그동안 자동차 전장품에서 많이 사용되어 왔다. 그러나 최근에 환경과 인체에 대한 유해성 때문에 end-of-life vehicle (ELV)과 같은 국제 환경 규제로 인하여 Pb의 사용이 금지되었다. 이러한 이유로 자동차 전장품을 위한 Pb-free 솔더링에 관한 많은 연구들이 보고 되어 왔다. 한편, 자동차의 연료 효율성과 공간 활용을 위하여 유연성과 경량의 특성을 가지는 플렉시블 기판이 자동차 전장품에 사용되고 있다. 자동차 전장품에 대한 Pb-free 솔더 접합부 특성에 관한 연구들이 많이 진행되었음에도 불구하고 자동차의 사용 환경을 고려한 플렉시블 기판 솔더 접합부에 대한 신뢰성 특성에 관한 연구는 아직 부족한 실정이다. 본 연구에서는 organic solderability preservative (OSP) 및 electroless nickel immersion gold (ENIG) 표면처리 된 플렉시블 기판 위 Sn3.0Ag0.5Cu, Sn0.7Cu, Sn0.5Cu0.01Al(Si) 세 가지 Pb-free 솔더 접합부에 대한 특성을 보고 하였다. 솔더 조성과 기판 표면처리에 따른 접합부의 특성 및 신뢰성을 비교 평가 하기 위하여 인장 강도 시험, 열 충격 시험과 반복 굽힘 시험을 진행 하고 그 결과를 분석하였다. OSP 표면처리 된 기판 접합부에 대한 반복 굽힘 시험 결과 세 종류의 솔더 접합부 모두 파괴는 솔더 내부에서 일어 났으며 Sn3.0Ag0.5Cu 솔더의 접합부에서 반복 굽힘 수명이 가장 길게 나타났다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.147-163
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• 2003

European Union bans the usage of Pb in electronics from July 1 st, 2006. The Near-eutectic Sn-Ag-Cu alloys are the leading candidate Pb-free solders (for SMT card assembly). .The microstructure of Sn-Ag-Cu alloys is discussed in terms of solidification, composition and cooling rate. Methods of controlling Ag3Sn plates are discussed. .Thermo-mechanical fatigue behaviors of Sn-Ag-Cu solder joints are reviewed. Tin pest, whisker growth, electromigration of Pb-free solders are discussed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1989년도 춘계학술대회 논문집
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• pp.74-76
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• 1989

x Pb($Sb_{1/2}Sn_{1/2}O_3-PbTiO_3-PbZrO_30.05{\leq}x{\leq}0.25$) ternary compound ceramics were fabricated by the mixed oxide method. The sintering temperature and time were 1200-1270[$^{\circ}C$], 2 hour, respectively. Increasing the PSS contents, the transition temperatures were decreased. The relative dielectric constant and Curie temperature of the 0.25 PSS-0.25 PT-0.5 PZ specimens were 450, 220[$^{\circ}C$]. The Pyroelectric coefficient of the 0.25PSS-0.25PT-0.50 PZ specimen was $5.20{\times}10^4$[C$\textrm{cm}^2$K].

• E2M - 전기 전자와 첨단 소재
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• 제4권3호
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• pp.220-228
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• 1991

본 연구에서는 핫프레스법으로 제작된 0.05Pb(Sn$_{1}$2/Sb$_{1}$2/)O$_{3}$-0.60PbZrO$_{3}$-0.35PbTiO$_{3}$+x[wt%]MnO$_{2}$ 세라믹스에 대해 구조적, 전기적 특성 및 탄성 표면파 특성을 조사하였다. x가 0.4인 조성을 1150[.deg.C]에서 45분간 소성한 시편의 경우 탄성표명파의 전기 기계 결합 계수 k$_{s}$ $^{2}$가 2.8[%], 기계적 품질 계수 Q$_{m}$ 이 1976으로 탄성 표면파 소자용 기판으로서 응용 가능함을 보였다.