• 한국재료학회지
• /
• 제15권8호
• /
• pp.528-535
• /
• 2005

It is inclined to increase that use of hazardous substances such as lead(Pb), mercury (Hg), cadmium(Cd) etc. are prohibited in the electronics according to environmental friendly policies of an advanced nation for protecting environment of earth. As this reasons, many researches for ensuring the reliability were proceeding in Pb free soldering process. n the flux remains on the PCB(printed circuit board) in the soldering process or the electronics exposed to corrosive environment, it becomes the reasons of breakdown or malfunction of the electronics caused by corrosion. Therefore in this studies we researched the polarization and Tafel properties of Sn40Pb and SnCu system solders based on the electrochemical theory. The experimental polarization curves were measured in distilled ionized water and 1 mole $3.5 wt\%$ NaCl electrolyte of $40^{\circ}C$, pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrodes, respectively. To observe the electrochemical reaction, polarization test was conducted from -250mV to +250mV. From the polarization curves composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density((cow). In these results, we compared the corrosion rate of SnPb and SnCu solders.

• 마이크로전자및패키징학회지
• /
• 제19권1호
• /
• pp.47-53
• /
• 2012

무연 리플로우 공정 횟수에 따른 organic solderability preservative(OSP) 표면처리 두께변화 및 열화현상을 분석하였다. 무연솔더 접합부의 접합강도에 미치는 OSP 표면처리의 열화특성을 SnPb 표면처리 경우와 비교하여 조사하였다. 또한 리플로우 pass에 따른 무연솔더 접합강도 열화분석을 위해 OSP 및 SnPb 표면처리된 FR-4 재질 PCB를 각각 1-6회 리플로우 처리하였다. 이후 각 리플로우를 거친 PCB 위에 2012 칩 저항기를 실장한 후 접합강도 변화를 측정하였다. 그 결과, 리플로우 공정 중 열 노출에 의해 OSP 코팅두께가 감소되는 것이 관찰되었고, 코팅두께의 변화 및 OSP 코팅 층의 산화를 유발함으로써, 솔더의 젖음성이 감소될 수 있음을 확인할 수 있었다. OSP 열화에 따른 솔더 접합강도는 SnPb 표리처리시 평균 62.2 N 이였으며, OSP의 경우는 약 58.1 N 이였다. 리플로우 공정 노출에 따라 OSP 코팅 층은 열분해 되지만, 솔더 접합부의 접합강도 측면에서는 산업적으로 적용 가능성을 확인할 수 있었다.

• Preventive Nutrition and Food Science
• /
• 제18권4호
• /
• pp.249-255
• /
• 2013

Yam (Dioscorea) has long been used as foods and folk medicine with the approved positive effects for health promotion. Although consumption of yam products is increasing for health promotion, reports for the metal contamination in commercial yam powder products to protect the consumers are lacking. In this study, we aimed to assess whether the commercial yam powder products were heavy metal contaminated or not using the yam products from six commercial products from various places in South Korea. The contents of heavy metals (Cd, Cr, As, Pb, Ni, and Sn) in yam powder products were measured and compared to national and international food standard levels. Also, the metal contamination was monitored during the food manufacturing steps. The study results showed that the contents of heavy metals (Cd, Cr, As, and Pb) in yam powder products are similar to those in national 'roots and tubers' as well as in various crops. In comparison to three international standard levels (EU, Codex and Korea), Cd content in yam powder products was lower but Pb content was 5 times higher. Also, Pb, Ni, and Sn may have the potential to be contaminated during food manufacturing steps. In conclusion, the level of heavy metals (Cd, Cr, As, Ni, and Sn) except Pb is considered relatively safe on comparison to national and international food standard levels.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
• /
• pp.79-92
• /
• 2004

RoHS compliant products are now being mass-produced. Eco-product(Pb-free+RoHS compliant+Halogen-free) will be possible from 2005. Pb-free flip chip will be qualified by 2004. 4Q. Lead Finish: SnBi-Under mass production Pd PPF-Under small production Matte Sn-will be internally qualified by 2004. 4Q Development of Pb-free Solder Ball: Stable Supply, Cost Down.

• 한국재료학회지
• /
• 제12권5호
• /
• pp.347-352
• /
• 2002

A transparent dielectric of the $PbO-B_2O_3-SiO_2-A1_2O_3$ system which was a low melting glass has been used for PDP (Plasma Display Panel), but it has a problem which is a reaction to be occurred between a transparent dielectric layer and electrodes (Ag, ITO) after firing. This research was conducted for ion migration of $Ag^+\$ and $Sn^ {2+}$ during firing three different frits of low melting glass. The result showed that yellowing phenomena occurred through a chemical reaction between $Ag^+\$and $Sn^ {2+}$ at 550~58$0^{\circ}C$ for 20~60 min. In addition, it was confirmed that the migration of $Sn^{2+}$ from ITO electrode made a strong effect on the yellowing phenomena.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
• /
• pp.481-486
• /
• 2002

We have investigated the effects of plating materials for Cu lead (Sn-lOPb, AwPdJNi, Sn-3.5Ag, Sn-3Bi and Sn-0.7Cu) on properties of QFP joints using a Sn-8Zn-3Bi solder. The results were compared with the joints using Sn-3. 5Ag-0. 7Cu and Sn-37Pb solders. As a result, the joints with the Sn-3.5Ag, Sn-3Bi and Sn-0.7Cu plated Cu lead had the reliability comparable to those of the Sn-3.5Ag-0.7Cu and Sn-37Pb soldered joints with respect to the joint strength after the high temperature holding tests at 348K to 423k. In particular, the joint with the Sn-3.5Ag plated Cu lead had the best reliability. This is caused by the low growth rate of a Cu-Sn interfacial reaction layer that degrades the joint strength of the soldered joints. Consequently, the Sn-3.5Ag plating was found to be most feasible plating for the Sn-8Zn-3Bi soldered joint.

• 한국분말야금학회:학술대회논문집
• /
• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
• /
• pp.1223-1224
• /
• 2006

The p-type $(Bi_{0.2}Sb_{0.8})_2Te_3/(Pb_{0.7}Sn_{0.3})$Te functional gradient material (FGM) was fabricated by hot-pressing the mechanically alloyed $(Bi_{0.2}Sb_{0.8})_2Te_3$ and the 0.5 at% $Na_2Te-doped$ $(Pb_{0.7}Sn_{0.3})Te$ powders. Also, the n-type $Bi_2(Te_{0.9}Se_{0.1})_3/PbTe$ FGM was processed by hot-pressing the mechanically alloyed $Bi_2(Te_{0.9}Se_{0.1})_3$ and the 0.3 wt% Bi-doped PbTe powders. With ${\Delta}T$ larger than $300^{\circ}C$, the p-type $(Bi_{0.2}Sb_{0.8})_2Te_3/(Pb_{0.7}Sn_{0.3})Te$ FGM exhibited larger thermoelectric output power than those of the $(Bi_{0.2}Sb_{0.8})_2Te_3$ and the 0.5 at% $Na_2Te-doped$ $(Pb_{0.7}Sn_{0.3})Te$ alloys. For the n-type $Bi_2(Te_{0.9}Se_{0.1})_3/PbTe$ FGM, the thermoelectric output power superior to those of the $Bi_2(Te_{0.9}Se_{0.1})_3$ and the 0.3 wt% Bi-doped PbTe was predicted at ${\Delta}T$ larger than $300^{\circ}C$.

• Bulletin of the Korean Chemical Society
• /
• 제30권5호
• /
• pp.1135-1138
• /
• 2009

Hollow Sn and Pb nanoparticles have been prepared by a rapid injection of an aqueous solution of $SnCl_2$- poly(vinylpyrrolidone) (PVP, surfactant) and $Pb(OAc)_2${\cdot}$3H_2O-PVP$ into an aqueous solution of sodium borohydride (reducing agent) in simple, one-pot reaction at room temperature under an argon atmosphere, respectively. The two hollow nanoparticles have been fully characterized by TEM, HRTEM, SAED, XRD, and EDX analyses. Upon exposure to air, the black Pb hollow nanoparticles are gradually transformed into a mixture of Pb, litharge (tetragonal PbO), massicot (orthorhombic PbO), and $Pb_5O_8$. The order and speed of mixing of the reactants between the metal precursor-PVP and the reductant solutions and stoichiometry of all the reactants are crucial factors for the formation of the two hollow nanocrystals. The Sn and Pb hollow nanoparticles were produced only when 1:(1.5-2) and 1:3 ratios of the Sn and Pb precursors to $NaBH_4$ were employed with a rapid injection, respectively.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2006년 추계학술발표대회 개요집
• /
• pp.136-138
• /
• 2006

Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. Ion migration phenomena has been observed in the field of exposing the specific environment and using for a long time. Also as the RoHS restriction was started in July 1st, 2006, Pb-free solder was utilized in electronics assemblies. In this case, it is very important to compatible between components and printed circuit board(PCB), thus surface treatment materials of PCB was changed to Sn, Sn-3.0Ag-0.5Cu, Cu. Therefore these new application become to need to reevaluate the sensitivity about electrochemical ion migration. This study was evaluated the occurrence time of electrochemical ion migration using by water drop test. We utilized PCB(printed circuit board) having a comb pattern as follows 0.1, 0.318, 0.5, 1.0 mm pattern distance. Sn-3.0Ag-0.5Cu and Sn-37Pb were electroplated on the comb pattern. 6.5V and 15.0V were applied in the comb pattern and then we measured the electrical short time causing by occurring the ion migration. In these results, we evaluate the sensitivity and derived the prediction models of ion migration occurrence time depending on the pattern materials, applied voltage and pattern spacing of PCB conductor.

• 마이크로전자및패키징학회지
• /
• 제9권1호
• /
• pp.35-41
• /
• 2002

솔더 범프를 이용한 플립 칩 접속 기술은 시스템의 고속화, 고집적화, 소형화 요구 덴 마이크로 일렉트로닉스의 성능은 향상시키기 위해 필요한 기술이다. 본연구 에서는 Cr/Cr-Cu/cu UBM 구조에서 고 용융점 솔더 범프와 저 용융점 솔더 범프를-시효처리 후 전단 강도를 평가하였다. 계면에서 관찰된 금속간 화합물의 성장과 접합상태를 SEM과 TEM으로 분석하였으며, 유한요소법을 통하여 전단하중을 적용하였을때 집중되는 응력을 해석하였다. 실험결과 Sn-97wt%Pb와 Sn-37wt%Pb에서 900시간 시효 처리된 시편의 전단강도는 최대 값에서 각각 25%, 20% 감소하였다. 시효처리를 통해 금속간화합물인 $Cu_6/Sn_5$와 $Cu_3Sn$의 성장을 확인하였으며, 파단 경로는 초기의 솔더 내부에서 IMC층의 계면으로 이동하는 경향을 알 수 있었다.